A display device, which includes a display region in which a plurality of pixels are arranged, includes a first organic insulating film, a first groove, which exists in a frame shape surrounding the display region to separate the first organic insulating film, a first inorganic partition portion, which is arranged in the first groove, and is made of an inorganic insulating material that exists in a frame shape surrounding the display region, a second organic insulating film formed above the first organic insulating film and the first inorganic partition portion, and a second groove, which exists in a frame shape surrounding the display region to separate the second organic insulating film, and is located inside the first groove in plan view.

A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a first inorganic layer, an organic layer, and a water absorption laminated layer. The display panel manufacturing method includes a substrate provided step, a first inorganic layer formation step, an organic layer formation step, a second inorganic layer formation step, and a water absorption laminated layer formation step.

An electroluminescent display device includes a substrate including a display area and a non-display area including a gate-in-panel (GIP) area disposed outside the display area, an oxide thin-film transistor disposed above the substrate, a planarization layer disposed above the oxide thin-film transistor, an anode disposed above the planarization layer, a bank disposed above the planarization layer and including an opening portion through which a part of the anode is exposed, a plurality of dams disposed outside the GIP area and configured by the planarization layer and the bank, a buffer layer disposed above the bank and the dam and made of silicon nitride, a light-emitting part disposed on the exposed anode and the buffer layer, and a cathode disposed on the light-emitting part, thereby inhibiting hydrogen from entering an oxide thin-film transistor and improve properties and reliability of the transistor.

An encapsulated organic light emitting device and a fabrication method thereof are disclosed. An encapsulated organic light emitting device according to an example embodiment includes a plurality of organic light emitting devices formed on a substrate, a partition wall disposed to separate the plurality of organic light emitting devices, a hydrophobic oil filling a housing structure defined by the partition wall, a polymer thin film formed on surfaces of the hydrophobic oil and the partition wall using a photo-curable precursor, and a multi-film laminated on the polymer thin film.

Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.

A touch display device includes a display unit including a plurality of pixels disposed in an active area, an encapsulation unit disposed on the display unit, the encapsulation unit being configured to seal the plurality of pixels, and a touch sensor unit including an organic buffer layer disposed on the encapsulation unit and a plurality of touch sensors disposed on the organic buffer layer in the active area, wherein the end of the organic buffer layer and the end of the encapsulation unit are disposed in a bezel area adjacent to the bezel area so as to have a stepped end profile, and a plurality of touch routing lines connected to the plurality of touch sensors of the touch sensor unit and disposed in the bezel area is disposed along the stepped end profile of the end of the organic buffer layer and the end of the encapsulation unit.

Provided is a display panel. The display panel includes a substrate; multiple light-emitting structures disposed on the substrate; an obstruction layer disposed on the substrate and surrounding the multiple light-emitting structures; an isolation layer disposed on the substrate and covering the multiple light-emitting structures, where at least part of the isolation layer covers the obstruction layer; and an encapsulation layer disposed on the substrate and covering the isolation layer and the obstruction layer. A manufacturing method for the display panel includes forming the obstruction layer surrounding the multiple light-emitting structures on the substrate and forming the isolation layer covering the multiple light-emitting structures and partially covering the obstruction layer.

Encapsulation materials for light-emitting elements such as organic light-emitting diodes and polymer light-emitting diodes are implemented as a photopolymerizable hydrophobic fluid dispersion polymer having both adhesive and barrier properties. A light-emitting element encapsulation is formed by applying the photopolymerizable hydrophobic fluid dispersion polymer of the present invention to a manufactured light-emitting element and photocuring. An encapsulation structure may be formed in a short time through a simple coating (or filling) process and a curing process by exposure (UV, or the like), and thus an encapsulation of a light-emitting device (particularly, a large-area organic light-emitting diode) is possible at low cost without using expensive deposition equipment.

An electronic device and a manufacturing method thereof. The electronic device includes a quantum dot light-emitting diode and an encapsulation layer encapsulating the quantum dot light-emitting diode. The quantum dot light-emitting diode includes an anode, a cathode, a quantum dot light-emitting layer provided between the anode and the cathode, an electron transport layer provided between the cathode and the quantum dot light-emitting layer, and a zinc carbide layer provided between the cathode and the electron transport layer. The encapsulation layer includes a gas reservoir layer. Arrangement of a zinc carbide layer between an electron transport layer and a cathode can improve transport capability of a carrier, and cooperation of the zinc carbide layer and an encapsulation layer can enhance a positive aging effect and stability of a device, and extend service life of the device.

A display panel comprises a first substrate including a display area and a non-display area surrounding the display area, a light emitting diode disposed in the display area on the first substrate, an adhesive layer covering the display area and the non-display area on the first substrate, and a second substrate bonded to the first substrate by the adhesive layer, wherein the second substrate includes a barrier structure portion for defining a plurality of open spaces on one surface of the second substrate that adjoins the adhesive layer.