The present disclosure provides a light emitting display device including a low-level voltage power line configured to transmit a low-level voltage, a data line configured to transmit a data voltage, a gate line configured to transmit a gate signal, and a subpixel connected to the low-level voltage power line, the data line and the gate line. The subpixel includes a capacitor overlapping with the low-level voltage power line.

A display apparatus includes: a substrate; a first display element having a first emission area configured to emit light of a first color; first and second data lines between the substrate and the first display element, extending in a first direction, and overlapping at least a portion of the first emission area; and first and second auxiliary electrodes between the substrate and the first display element, overlapping at least a portion of the first emission area, and configured to receive a driving voltage, wherein a lengthwise direction of the first and second auxiliary electrodes is the first direction, and wherein the first and second data lines are between the first and second auxiliary electrodes spaced apart from each other in a second direction.

Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.

The present application provides a splicing display device, a light-emitting diode (LED) substrate is arranged on adjacent display devices, and the LED substrate covers a gap. LED elements are arranged on a base. A first magnetic member is arranged on the base. A fastening module includes a fastening element and a magnetic assembly. The fastening element is arranged on a support module. At least a portion of the fastening element is arranged corresponding to the gap. The magnetic assembly is arranged on the fastening element and located in the gap. The magnetic assembly is magnetically connected to the first magnetic member.

In manufacturing display devices having a flexible substrate, the invention allows reduction of material cost and the number of manufacturing steps, thereby reducing manufacturing cost. A display device includes: a bendable substrate 100 having thereon a display area DA and a terminal section TA; an array layer 50 formed in the displayer area DA; and an inter-layer 160 of a predetermined width formed between the array layer 50 and the terminal section TA. The inter-layer 160 does not overlap the array layer 50 and the terminal section TA.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

A flexible display panel, a manufacturing method for the flexible display panel, and a display device are provided. The flexible display panel includes a packaging layer, a driving circuit layer and an insulation layer. The insulation layer serves as a base of the flexible display panel and is located at a side of the driving circuit layer distal to the packaging layer, each of a CTE and a light transmittance of the insulation layer is within a respective predetermined range, the CTE of the insulation layer is smaller than a first threshold, the light transmittance of the insulation layer is greater than a second threshold, the first threshold is within a range of 5 to 15, and the second threshold is within a range of 90% to 99%.

An embodiment of the present invention provides a display device including: a substrate including a display area in which an image is displayed and a non-display area disposed outside the display area; a pad portion disposed in the non-display area on the substrate and including a plurality of pads spaced apart by a predetermined distance; and a flexible printed circuit board bonded to the pad portion, wherein the flexible printed circuit board may include a plurality of leads, each of the plurality of pads may be bonded to each of the plurality of leads, each of the plurality of pads may include a contact pad electrode that contacts each of the plurality of leads, and the contact pad electrode may include a dummy electrode surrounding an edge of a lower surface of each of the plurality of leads.

A display device includes: a substrate; and a semiconductor layer disposed on the substrate, and including a first area, a second area, and a third area that are sequentially positioned by dividing the semiconductor layer into three areas in a thickness direction of the semiconductor layer, wherein the semiconductor layer includes polycrystalline silicon, a concentration of fluorine contained in the semiconductor layer has a first peak value in the first area and a second peak value in the third area, and the first peak value of the concentration of the fluorine in the semiconductor layer is about 30% or less of the second peak value of the concentration of the fluorine in the semiconductor layer.