A display device includes a gate electrode, a gate insulating film, a first metal oxide layer having crystallinity, and a second metal oxide layer having non-crystallinity. The first metal oxide layer and the second metal oxide layer are sequentially laminated on a substrate. The first metal oxide layer and the second metal oxide layer are in contact with each other in all regions where the first metal oxide layer and the second metal oxide layer overlap each other. The first metal oxide layer at least partially has a first semiconductor region serving as a semiconductor. One of the first metal oxide layer and the second metal oxide layer at least partially has a conductor region made electrically conductive.

A light emitting device according to the invention includes a first pixel electrode; a second pixel electrode; an organic layer including a light emitting layer; a pixel separation layer being interposed between an outer edge portion of the first pixel electrode and an outer edge portion of the second pixel electrode, and the organic layer, and separating a first pixel area and a second pixel area; and a common electrode provided on a side opposite to a side on which the first pixel electrode and the second pixel electrode of the organic layer are provided, wherein a width overlapped between the pixel separation layer and the first pixel electrode in the planar view and a width overlapped between the pixel separation layer and the second pixel electrode in the planar view are greater than a film thickness of the organic layer or a charge transfer layer.

The aim is to improve the bending resistance a display device. The display device in one embodiment includes a substrate including a first surface and a second surface and a curved part between the first surface and the second surface, a display element arranged on the first surface, a conducting layer connected with the display element and extending to the second surface from the first surface via the curved part, a plurality of protective layers having a lower ductility than the substrate and arranged in the substrate side and/or opposite side to the substrate side with respect to the conducting layer and along the curved part, wherein each of the plurality of protective layers spreading over the curved part, to a certain region of the first surface side from the curved part, and to a certain region of the second side from the curved part.

A flexible display and a method of manufacturing the same are disclosed. In one aspect, the method includes forming a sacrificial layer on a support substrate, wherein the sacrificial layer includes a plurality of patterns continuously formed thereon and a plurality of grooves formed between the patterns. The method also includes forming a display unit on the sacrificial layer, dissolving and removing the sacrificial layer with water and separating the display unit from the support substrate.

An organic light emitting display device has a display panel including a first subpixel, a second subpixel, a data line, and sensing lines. The sensing lines may include a vertical sensing line and a horizontal sensing line connected to the vertical sensing line. The horizontal sensing line may be formed of a source/drain metal layer present on the first substrate, and one portion thereof connected to a first electrode of a sensing transistor of the first subpixel and the other portion thereof connected to a first electrode of a sensing transistor of the second subpixel may be positioned in a region intersecting with the data line, and electrically connected by a connection electrode formed of an insulated light blocking layer below the source/drain metal layer present on the first substrate.

An OLED light emitting device, a method for fabricating an OLED light emitting device and a lamp device. The OLED light emitting device includes: a substrate; a plurality of organic light emitting diodes, wherein the plurality of organic light emitting diodes are located on a same one side of the substrate; and a plurality of regulating resistors, wherein the regulating resistors are connected to the organic light emitting diodes; wherein areas of luminescent layers of the plurality of organic light emitting diodes are not completely equal.

An object is to provide a light-emitting device having a structure in which an external connection portion can easily be connected and a method for manufacturing the light-emitting device. A light-emitting device includes a lower support 110, a base insulating film 112 over the lower support 110 which has a through-hole 130, a light-emitting element 127 over the base insulating film 112, and an upper support 122 over the light-emitting element 127. An electrode 131 is provided in the through-hole 130, and the external connection terminal 132 electrically connected to the electrode 131 is provided below the base insulating film 112. The external connection terminal 132 is electrically connected to the external connection portion 133 and functions as a terminal that inputs a signal or a power supply into the light-emitting device. This light-emitting device has a structure in which an external connection portion can easily be connected.

An object is to provide a manufacturing method of a semiconductor device in which a defect in characteristics due to a crack occurring in a semiconductor device is reduced. Provision of a crack suppression layer formed of a metal film in the periphery of a semiconductor element makes it possible to suppress a crack occurring from the outer periphery of a substrate and reduce damage to the semiconductor element. In addition, even if the semiconductor device is subjected to physical forces from the outer periphery in separation and transposition steps, progression (growth) of a crack to the semiconductor device can be suppressed by the crack suppression layer.

A display device includes a substrate, an active pattern disposed on the substrate, a gate electrode overlapping the active pattern, an inorganic insulation layer covering the active pattern, a source metal pattern and an etch-delaying pattern. The source metal pattern includes a first portion that is disposed on the inorganic insulation layer, and a second portion that passes through the inorganic insulation layer and electrically contacts the active pattern. The etch-delaying pattern is disposed between the active pattern and the first portion of the source metal pattern, contacts the second portion of the source metal pattern, and includes a different material from the inorganic insulation layer.

A display device includes a substrate; pad electrodes disposed on the substrate and spaced apart from one another; a driving member including bumps, which overlap the pad electrodes in a thickness direction of the substrate and are spaced apart from one another; conductive members disposed between the pad electrodes and the bumps to electrically connect the pad electrodes and the bumps; and non-conductive members disposed adjacent to the pad electrodes, the bumps, and the conductive members, wherein the conductive members and the non-conductive members include different materials, each of the conductive members includes a first side surface that faces a corresponding one of the non-conductive members, each of the non-conductive members include a second side surface that faces a corresponding one of the conductive members, and a part of the first side surface and a part of the second side surface directly contact one another.