In an organic electroluminescence (EL) display panel including: a substrate that is flexible and is made of a resin material; a plurality of light-emitting elements that are disposed on the substrate and are spaced away from one another; and a plurality of wire units that are disposed on the substrate and establish electrical connection between the plurality of light-emitting elements, a first region of the substrate that is below the light-emitting elements has greater stiffness than a second region of the substrate that is a remainder of the substrate.

A peeling method at low cost with high mass productivity is provided. An oxide layer is formed over a formation substrate, a first layer is formed over the oxide layer using a photosensitive material, an opening is formed in a portion of the first layer that overlaps with the oxide layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the oxide layer, the oxide layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

An organic light emitting device includes: a substrate; a first electrode provided on the substrate; a metal pattern provided along an edge of the first electrode; and a pixel definer provided on the metal pattern. The pixel definer covers an end portion of the first electrode and an end portion of the metal pattern. The pixel definer includes an opening exposing the first electrode.

A display device and a method of manufacturing the same, the display device including a substrate; a display panel on the substrate; a first film on the display panel; and a first pattern arranged along edges of the first film, the first pattern including a material having a coefficient of thermal expansion (CTE) that is different from the CTE of a material of the first film.

A display device including: a display panel; and an input sensor disposed on the display panel, wherein the input sensor includes: sensing electrodes; signal lines connected to the sensing electrodes; a first insulating layer; a second insulating layer disposed on the first insulating layer; and first, second and third test patterns having different stacking structures from each other, wherein the first test pattern include a first conductive pattern, a first insulating pattern overlapping the first conductive pattern, and a second insulating pattern overlapping the first insulating pattern, the second test pattern includes a third insulating pattern and a fourth insulating pattern overlapping the third insulating pattern, and the third test pattern includes a second conductive pattern.

The present invention provides a display substrate and a manufacturing method thereof, and a flexible display device including the display substrate, which belong to the field of display technology, and can solve the problem of poor reliability of an existing display substrate due to damage to thin film transistors when the display substrate is bent. In the display substrate provided by the present invention, by providing the stress absorbing units made of a resin material in the display substrate, the stress generated during bending of the display substrate is released through the transparent resin material and the thin film transistors on the display substrate are unlikely to be damaged, thereby improving the reliability of the whole display substrate.

Provided is a flexible display device including: a display region including pixels to display images, each pixel including an organic light emitting diode (OLED) configured to receive a signal from a signal line and power from a power line to display the images; a non-display region outside the display region where images are not to be displayed, the non-display region including: a circuit mount region including therein a driving circuit configured to supply the signal through the signal line and the power through the power line to each pixel; and a bending region formed between the display region and the circuit mount region and configured to be bent flexibly, wherein the signal line and the power line are formed on a same layer in the bending region.

A display device includes a plurality of pixels arranged on a substrate, a plurality of pixel electrodes, wherein each pixel electrode of the plurality of pixel electrodes corresponds to a pixel of the plurality of pixels, a bank between adjacent pixel electrodes of the plurality of pixel electrodes, wherein the bank exposes a part of the pixel electrodes, an electroluminescent layer on each of the plurality of pixel electrodes, a common electrode above the bank and the electroluminescent layer, a plurality of insulators on the exposed regions of the pixel electrodes, wherein the common electrode is between the insulators and the pixel electrodes, and an auxiliary wiring on the common electrode between adjacent insulators of the plurality of insulators, wherein a top surface of each insulator of the plurality of insulators is farther from the substrate than a top surface of the common electrode.

A display device includes a substrate including a display region and a peripheral region, display structures at the display region of the substrate, a plurality of blocking structures at the peripheral region of the substrate wherein the blocking structures have heights different from each other, an organic layer on the display structures and the blocking structures, and an inorganic layer on the organic layer.

An OLED substrate (1) and a preparation method therefor, an OLED panel, and an OLED display apparatus. An inter-layer insulation layer (12) is formed in an edge area of the OLED substrate (1), and a concave is formed on the surface of the inter-layer insulation layer (12), so that the lateral tensile-resistance strength of the inter-layer insulation layer (12) and a package substrate can be increased, i.e. increasing a lateral tensile-resistance force between the OLED substrate (1) and the package substrate, thereby improving the stability of the OLED panel, ensuring the sealing effect of the OLED panel and improving the service life of the OLED panel.