An inkjet printing method includes: setting a first region to be printed at a constant print density within a target region to be printed; setting a second region within the target region and closer than the first region to an edge of the target region, wherein the second region is to be printed at a print density that varies according to a position; generating control data for a plurality of nozzles provided on an inkjet head in order to print the first region and the second region; and driving the inkjet head according to the control data.

A source to facilitate precise vapor deposition in processes to obtain organic light emitting diodes (OLEDs) in a display panel, includes forming a plurality of grooves on a first substrate; in filling organic light emitting materials into the grooves and providing a second substrate to receive the vaporized organic light emitting materials. The first substrate is aligned with the second substrate and the first substrate is heated to vaporize the organic light emitting materials in the grooves. The vapor deposition regions of the second substrate form an organic light emitting material layer after the deposition, the layer can then be used in an OLED display panel. The shadow effect is greatly reduced, a method for the procedure is also disclosed.

A display device including a display panel configured to display an image and having a folding area by which the display panel is configured to be folded along a folding axis, and a touch member disposed on the display panel and configured to detect an external touch signal. The touch member includes a plurality of first conductive patterns disposed to overlap the folding area, in which each of the first conductive patterns includes a fiber layer including a plurality of nanofibers, and the nanofibers includes a plurality of cavities.

The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.

The present application provides a display panel having a plurality of subpixels. The display panel includes an array substrate including an array of a plurality of first thin film transistors respectively in the plurality of subpixels for driving light emission of the display panel; a counter substrate facing the array substrate and having a plurality of subpixel areas respectively in the plurality of subpixels; and an optical compensation device for adjusting in real time actual light emitting brightness values of the plurality of subpixel areas to target brightness values. The optical compensation device includes a plurality of actual light emitting brightness value detectors integrated in the counter substrate and respectively in the plurality of subpixel areas.

An organic light emitting display device is provided as follows. A first thin film transistor having a first semiconductor pattern is disposed on a substrate. A second thin film transistor having a second semiconductor pattern is disposed on the substrate. An insulating layer covers the first thin film transistor and the second thin film transistor. At least one first dummy hole passing through the insulating layer overlaps the first semiconductor pattern of the first thin film transistor. At least one second dummy hole passing through the insulating layer overlaps the second semiconductor pattern of the second thin film transistor. Numbers or sizes of the at least one first dummy hole and the at least one second dummy hole are different from each other.

A substrate including a light-emitting element and a terminal for connection to the outside is prepared. The light-emitting element includes a light-emitting layer, an anode, and a cathode. The anode and the cathode interpose the light-emitting layer therebetween. A sealing layer is formed on the substrate so as to cover the light-emitting element and the terminal. An amorphous carbon film is formed on the sealing layer so as to cover a region above the light-emitting element and avoid a region above the terminal. The sealing layer is dry-etched so as to expose the terminal from the sealing layer using the amorphous carbon film as a mask. The amorphous carbon film is removed.

To provide a support for supporting a flexible component and a light-emitting device. A first substrate, a second substrate, a rack, a pinion, and a hinge are provided. When the second substrate is moved, the rotational force of the pinion is transmitted to the rack of the first substrate and thus the first substrate is moved in the horizontal direction while being overlapped with one of hinge pieces of the hinge; accordingly, the flexible component can be bent while the flexible component is fixed to the first substrate and the second substrate and the allowable curvature radius is maintained in the vicinity of the hinge.

A display device including a display region and a frame region and configured to display an image by causing first light-emitting elements provided in the display region to emit light, the display device includes: a plurality of data lines to which data signals are supplied; a plurality of control lines arranged to intersect the plurality of data lines; a plurality of pixel circuits including the first light-emitting elements, each of the first light-emitting elements being provided at each of intersection points of the plurality of data lines and the plurality of control lines; a control circuit configured to activate the plurality of corresponding control lines; and second light-emitting elements provided in the frame region, wherein electrical signals flowing through the plurality of control lines or electrical signals flowing through nodes provided in the control circuit are input to the second light-emitting elements.

Although an organic resin substrate is highly effective at reducing the weight and improving the shock resistance of a display device, it is required to improve the moisture resistance of the organic resin substrate for the sake of maintaining the reliability of an EL element. Hard carbon films are formed to cover a surface of the organic resin substrate and outer surfaces of a sealing member. Typically, DLC (Diamond like Carbon) films are used as the carbon films. The DLC films have a construction where carbon atoms are bonded into an SP.sup.3 bond in terms of a short-distance order, although the films have an amorphous construction from a macroscopic viewpoint. The DLC films contain 95 to 70 atomic % carbon and 5 to 30 atomic % hydrogen, so that the DLC films are very hard and minute and have a superior gas barrier property and insulation performance.