A pixel including: a light emitting element; a first transistor between a first node and the light emitting element to control current flowing from a first driving power source through the light emitting element to a second driving power source; a second transistor between a data line and the first transistor, and tamed on by a first scan signal; a third transistor between the first transistor and first node, and turned on by the first scan signal; and a fourth transistor between an initialization power line and the first node, and turned on by a second scan signal, wherein the fourth transistor is a tunneling field effect transistor including a source and drain area that are spaced apart from each other and have opposite conductivities, a channel area between the source area and drain area, and a gate electrode on the channel area with a gate insulating layer therebetween.

An organic light emitting diode display includes a substrate including a display area and a pad area, a first thin film transistor disposed on the display area, an organic light emitting diode connected to the first thin film transistor, a pad electrode disposed on the pad area and a pad contact electrode disposed on an upper portion of the pad electrode and electrically connected to the pad electrode. The organic light emitting diode includes an anode, an organic emission layer, and a cathode. The anode includes a lower layer, an intermediate layer, and an upper layer. The pad contact electrode is formed of a material of the lower layer of the anode.

The present disclosure relates to a surface protective film and a method for manufacturing an organic light emitting electronic device.

Provided are an array substrate and a manufacturing method therefor, a display device, and a mask plate. The array substrate includes a pixel defining layer having a first opening, a second opening, and a third opening passing through the pixel defining layer. Every two of the first to third openings are adjacent to each other. The pixel defining layer includes first to third opening denning portions. At least one of the ratio of the slope angle of a portion of the first opening defining portion located between the first opening and the second opening to the slope angle of the third opening defining portion, and the ratio of the slope angle of a portion of the second opening defining portion located between the first opening and the second opening to the slope angle of the third opening defining portion is from 0.8 to 1.25.

An ink for a display device, the ink includes: an organic material, wherein the organic material has a molecular weight greater than about 500 and less than about 1,000,000, and the organic material in the ink has a concentration and the molecular weight of the organic material satisfy:

y>−3.518*ln(x)+45.59,

wherein y is the concentration of the organic material, and x is the molecular weight of the organic material.

A display panel, a manufacturing method thereof, and a display device are provided. In the display panel, a conversion terminal layer is formed on a first substrate to form a conversion terminal, a first opening is formed at a position on the first substrate corresponding to the conversion terminal, and a data line formed from a source/drain layer is connected to the conversion terminal by a first through-hole. Therefore, when a driver chip is connected to the display panel, the driver chip can be connected to the data line of the source/drain layer by the conversion terminal layer.

A display device includes: a substrate including a first region and a second region; a first active layer located on the first region and including a first channel region, a first source region at one side of the first channel region, a first drain region at the other side of the first channel region, and a first extension region extending in a direction from the first source region to the second region; a first gate electrode located above the first active layer and overlapping the first channel region; a driving voltage line located on the first active layer, overlapping the first source region, and extending along the first extension region; a first connection electrode located on the first drain region; and a pixel electrode located above the first gate electrode and connected to the first connection electrode.

A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.

A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

A display substrate and a manufacturing method thereof, a display panel, a display motherboard and a testing method thereof, and a display device are provided in the present disclosure. The display substrate is provided with a display region and at least a wiring region outside the display region. The display substrate includes a base substrate and a plurality of connection structures on the base substrate. The plurality of connection structures are connected to a plurality of edge signal terminals through a control module. All of the plurality of connection structures, the plurality of edge signal terminals and the control module are located in the wiring region. The plurality of edge signal terminals are located on an edge of the wiring region. The control circuit is configured to control the connection or disconnection between the plurality of signal terminals and the plurality of connection structures.