A method of manufacturing a display device may include forming an active pattern on a substrate, the active pattern including a first region, a second region spaced apart from the first region, and a third region disposed between the first region and the second region, forming an insulation layer on the active pattern, defining a first contact hole exposing a portion of the first region, a second contact hole exposing a portion of the second region, and an opening exposing the third region in the insulation layer, forming a conductive pattern filling the first and second contact holes on the insulation layer and removing the third region at a substantially same time, and forming a planarization layer on the conductive pattern.

A light emitting display device includes: a substrate including a display area in which a plurality of display pixels are disposed and a non-display area surrounding the display area; an encapsulation film covering the display area and the non-display area and having a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in an order; a first touch electrode disposed on the encapsulation film and extending in a first direction and a second touch electrode extending in a second direction; at least one inorganic insulating layer disposed on the substrate; a first planarization layer disposed on the inorganic insulating layer; a second planarization layer disposed on the first planarization layer; and a hole pattern formed in the second planarization layer. The hole pattern has the organic encapsulation layer therein.

A display apparatus includes a substrate including a display area and a peripheral area disposed outside the display area, a transistor disposed in the display area on the substrate, a first pad part disposed in the peripheral area on the substrate, a second pad part disposed in the peripheral area on the substrate and spaced apart from the first pad part, a first pad disposed in the second pad part, a second pad disposed in the second pad part and spaced apart from the first pad and a passivation layer including a plurality of grooves defined between the first pad and the second pad and a protrusion disposed between two adjacent grooves among the grooves.

Discussed is a display device including a gate electrode, a gate insulating film disposed on the gate electrode, a semiconductor layer disposed on the gate insulating film, an insulating layer disposed on the semiconductor layer, a first electrode disposed on the insulating layer, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer.

A light emitting element include: a spherical conductive ball made of a metal material having conductivity; a light emitting layer covering a portion of a surface of the conductive ball; a metal layer formed on the light emitting layer; and an insulating layer covering at least a portion of a remaining portion of the surface of the conductive ball.

A display device and a method of manufacturing the same are provided. A display device includes: a plastic substrate including: a display portion including organic light emitting diodes, and a pad portion including chip-on-films, a lower protective member attached to an entire lower surface of the plastic substrate, and an upper protective member attached to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.

A display substrate includes a substrate; a first pixel defining layer on the substrate, wherein the first pixel defining layer has a first container portion therein; a planarization pattern filled in the first container portion, wherein a surface of the planarization pattern distal to the substrate is flush with a surface of the first pixel defining layer distal to the substrate; a second pixel defining layer on a side of the planarization pattern distal to the substrate, wherein a second container portion is in the second pixel defining layer and penetrates through the second pixel defining layer along a stacking direction of the first pixel defining layer and the substrate, and an orthographic projection of the second container portion on the substrate falls within an orthographic projection of the first container portion on the substrate; and an organic functional layer in the second container portion.

Provided is a semi-transparent display and a method for producing a semi-transparent display. An SOI wafer is provided, the surface having at least one pixel region and at least one contact region arranged next to the pixel region, the SOI wafer comprising a silicon substrate on the rear side. At least one electromagnetic-radiation-emitting layer is deposited on the front side of the SOI wafer. At least one transparent cover layer is applied above the at least one electromagnetic-radiation-emitting layer. A wiring carrier is fastened to the assembly comprising the SOI wafer, the electromagnetic-radiation-emitting layer and the transparent cover layer. Before fastening of the wiring carrier to the assembly, the silicon substrate is removed from the assembly, producing a residual assembly, and electrically conductive connections are formed between the contact region of the SOI wafer and the wiring carrier from the rear side of the SOI wafer.

An array substrate, a manufacturing method thereof and a display panel. After a metal layer is formed on a substrate, a protective layer is formed on the metal layer.

An organic light emitting diode display substrate includes a light emitting unit layer, a first band gap layer and a color conversion layer. The first band gap layer and the color conversion layer are on a light exit path of the light emitting unit layer. The light emitting unit layer includes first, second and third light emitting units periodically arranged on a driving substrate and emitting light of a first color. The color conversion layer converts a part of the light of the first color into light of a second color and a third color. The first band gap layer is between the light emitting unit layer and the color conversion layer. The first band gap layer transmits the light of the first color in a light exit direction, and reflects the light of the second color and the light of the third color.