Patent classifications
H10K59/1201
OLED display panel and preparation method thereof
An organic light emitting diode (OLED) display panel and preparation method thereof, which includes an array substrate, an organic light emitting layer, and an encapsulation layer. The encapsulation layer includes organic-inorganic functional layer. Through disposing the organic-inorganic functional layer, the overall thickness of the encapsulation thin film can be reduced while ensuring the encapsulation effect, and the bending performance of the OLED device can be improved. Further, a mask plate is not required in the encapsulation process, thereby can effectively save production cost.
Display device
A plurality of thin film transistors provided in a peripheral region are first staggered thin film transistors where a first channel layer configured of low-temperature polysilicon is included, and the first channel layer is not interposed between a first source electrode and a first gate electrode, and between a first drain electrode and the first gate electrode. A plurality of thin film transistors provided in a display region are second staggered thin film transistors where a second channel layer configured of an oxide semiconductor is included, and the second channel layer is not interposed between a second source electrode and a second gate electrode, and between a second drain electrode and the second gate electrode. The first thin film transistor is located below the second thin film transistor.
Array substrate and manufacturing method thereof
An array substrate and a manufacturing method thereof are provided. The array substrate includes a flexible substrate, a plurality of thin film transistors, a plurality of replacement units, an organic filling layer, a source and drain layer, a planarization layer, an anode layer, and a pixel definition layer. The organic filling layer is made of a flexible material which has good bendability. Thus, a risk of breakage or crack during a bending process is reduced, thereby realizing a dynamic folding of the array substrate.
Method for manufacturing OLED light emitting device, OLED light emitting device and OLED display device
The present disclosure relates to a method for manufacturing an OLED light emitting device, an OLED light emitting device, and an OLED display device. The method for manufacturing an OLED light emitting device according to an embodiment of the present disclosure includes forming a pixel defining layer on a substrate, wherein the pixel defining layer comprises a lyophilic material or a lyophobic material and the pixel defining layer comprises a plurality of openings which are spaced apart from each other; forming an anode layer on the substrate and in each opening; adding a preset solvent having a property opposite to that of the lyophilic material or the lyophobic material of the pixel defining layer in an OLED film layer ink; and ink-jet printing the OLED film layer ink on the anode layer and in each opening to form an OLED film layer.
Transparent display substrate and manufacturing method thereof, transparent display device
A transparent display substrate, a manufacturing method thereof, and a transparent display device are disclosed. The transparent display substrate includes a base substrate and a pixel defining layer defining a plurality of pixel regions on the base substrate; at least one of the pixel regions includes a light-transmitting portion and a light-emitting portion, and is provided with an OLED layered portion and an auxiliary electrode; the OLED layered portion includes a reflective anode, an organic light-emitting layer and a transmissive cathode; and the auxiliary electrode is located in the light-transmitting portion, disposed at a side of the transmissive cathode close to the base substrate, and connected to the transmissive cathode.
Pixel defining structure and manufacturing method thereof, display panel and display device
A pixel defining structure includes a first sub-pixel defining structure surrounding a first sub-pixel region configured to form a first sub-pixel having a first color. The first sub-pixel defining structure includes a lyophilic portion one the bottom side of the first sub-pixel region and a lyophobic portion on a side opposite to the bottom side. The pixel defining structure includes a second sub-pixel defining structure surrounding a second sub-pixel region configured to form a second sub-pixel having a second color. The second sub-pixel defining structure includes a lyophilic portion one the bottom side of the second sub-pixel region and a lyophobic portion on a side opposite to the bottom side. The second color is different from the first color. Thicknesses of the lyophilic portion of the first sub-pixel defining structure and the lyophilic portion of the second sub-pixel defining structure are different.
Display panel, display device, and manufacturing methods thereof
A display panel and manufacturing methods thereof are provided. In one example, the display panel includes a flexible substrate having a display area and a non-display area, a dam structure located in the non-display area and disposed around the display area, one or more grooves disposed on the non-display area between the display area and the dam structure, and an organic encapsulation layer. In some examples, the organic encapsulation layer covers each of the display area, at least a portion of the non-display area, and the one or more grooves. Accordingly, a display device comprising the display panel is also provided. Thus, a flatness of the organic encapsulation layer may be improved and peeling may be reduced between the organic encapsulation layer and a substrate on which the organic encapsulation layer is disposed, thereby improving an overall quality of the finished display panel.
Array substrate, method of fabricating array substrate, display panel, and method of fabricating display panel
The present disclosure generally relates to the field of display technology, and in particular, to an array substrate, a method of fabricating the array substrate, a display panel including the array substrate, and a method of fabricating the display panel. An array substrate includes: a base substrate; an electrode layer provided on the substrate; a first pixel defining layer on the electrode layer defining a plurality of pixel regions; and a second pixel defining layer on the first pixel defining layer, wherein the second pixel defining layer has a plurality of first grooves and a plurality of second grooves alternately arranged between two adjacent rows of pixel regions.
Pixel defining layer having column portions in a space between two adjacent columns of subpixel apertures and spacing apart by multiple pairs of adjacent row portions respectively in multiple rows
A display panel having a pixel defining layer defining subpixel apertures of subpixels is provided. The pixel defining layer is a unitary structure including column portions and row portions. A respective row portion is between two adjacent subpixel apertures that are in a same column and respectively from two adjacent rows. A respective column portion is in a space between two adjacent columns of subpixel apertures, spacing apart multiple pairs of adjacent row portions respectively in multiple rows. A respective row portion includes a depression part configured to allow fluid communication of an ink solution between the two adjacent subpixel apertures in the same column and respectively from the two adjacent rows. A minimum height of the depression part relative to a base substrate is less than a minimum height of a column portion adjacent to the respective row portion relative to the base substrate.
Semiconductor device and method for fabricating the same
A display device includes: a base substrate having a display region including a first region and a second region, and a non-display region; a first semiconductor layer including polysilicon at the second region; a first conductive layer on a first insulating layer, and including a bottom gate electrode at the first region and a second-first gate electrode at the second region; a second semiconductor layer including an oxide on a second insulating layer at the first region; a second conductive layer on a third insulating layer, and including a top gate electrode at the first region and a second-second gate electrode at the second region; and a third conductive layer on a fourth insulating layer, and including a first source electrode and a first drain electrode connected to the second semiconductor layer, and a second source electrode and a second drain electrode connected to the first semiconductor layer.