A display device includes a substrate including a pad region, a first conductive pattern disposed on the pad region of the substrate and having a quadrangle shape in a plan view, an insulating layer disposed on the substrate and covering the first conductive pattern, and a second conductive pattern disposed on the insulating layer and contacting the first conductive pattern through a plurality of contact holes defined in the insulating layer. The plurality of the contact holes are arranged along a diagonal direction of the quadrangle shape in the plan view.

A display device and a method for manufacturing a display device are provided. An embodiment of a display device includes a display panel including a pad area including a plurality of pads, a first circuit board disposed to partially overlap the pad area; wherein the first circuit board includes: a first base board; a conductive layer disposed on the first base board and including a plurality of first bumps disposed on one end portion of the first base board, a plurality of second bumps disposed on the opposite end portion of the first base board, and a lead wiring connecting the first bump to the second bump, a passivation layer disposed on the first base board to cover the lead wiring; an adhesive layer disposed on the passivation layer to at least partially cover a top and side surface of one end portion of the display panel.

A display device may include a driving transistor disposed in a display area, a test transistor disposed in a peripheral area adjacent to the display area, and a resistance line disposed in the peripheral area, electrically connected to the test transistor and including a metal oxide.

Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.

A display apparatus includes: a substrate including a display region and a non-display region outside the display region; a first line disposed on an upper surface of the substrate in the non-display region of the substrate, where the first line has a first height; a flexible printed circuit board; a second line disposed on a lower surface of the flexible printed circuit board, where the second line has a second height; and a connection line located in a portion in which the substrate and the flexible printed circuit board overlap each other and disposed between the substrate and the flexible printed circuit board, where in the connection lines has a third height greater than each of the first height and the second height, one end of the connection line is connected to the first line, and another end of the connection line is connected to the second line.

A display device includes a substrate, a first active layer including a driving active pattern of a driving transistor disposed on the substrate and a first active pattern of a first transistor disposed on the substrate, a second active layer including a driving sub-active pattern disposed on the driving active pattern of the first active layer, a first insulating film disposed on the first active layer and the second active layer, a driving gate electrode disposed on the first insulating film and overlapping the driving sub-active pattern, and a first gate electrode disposed on the first insulating film and overlapping the first active pattern, where a thickness of the driving active pattern is greater than a thickness of the driving sub-active pattern.

A display device includes a bank including an opening exposing a surface of a base. The bank further includes side surfaces adjacent to an upper surface. The side surfaces slope downward from the upper surface toward an opening in an organic film pattern. A plurality of fine holes is formed on the upper surface and the side surfaces, the bank may also include a plurality of inner holes.

Display panel, manufacturing method thereof, and display device are provided. As an example, the display panel includes a substrate, a TFT layer formed on the substrate, and an encapsulation layer formed on the TFT layer. The TFT layer includes a thin film transistor with a source electrode, a drain electrode and a gate electrode, and further includes a first metal layer, a first inorganic layer on the first metal layer, and a second metal layer on the first inorganic layer. The second metal layer includes a first region and a second region, a hollowed-out region is formed between the first region and the second region, and the first region and the second region are electrically connected via the first metal layer. A portion of the encapsulation layer that is located in the hollowed-out region is in contact with the first inorganic layer.

The present disclosure provides an organic light-emitting diode display substrate and a manufacturing method thereof. The manufacturing method includes: sequentially forming a first electrode, a light-emitting layer and a second electrode on a base substrate; forming a protection layer having a first opening on a side of the second electrode distal to the base substrate; and forming a second opening in the second electrode, the second opening being located below the first opening. In the present disclosure, with the protection layer, only a portion of the second electrode below the first opening is removed, so that other portions of the second electrode are prevented from being damaged, thereby eliminating a poor display of the display device.