The display device includes a substrate including a first resin layer, a second resin layer overlapping the first resin layer, and a first inorganic insulating layer between the first resin layer and the second resin layer, and having flexibility, a display region provided on the substrate, a terminal region arranged outside the display region on the substrate, and a bending region arranged between the display region and the terminal region. A thickness of the second resin layer is larger than a thickness of the first resin layer. The substrate includes a first region and a second region. The first resin layer, the first inorganic insulating layer, and the second resin layer are laminated in the first region. The first resin layer and the second resin layer are laminated in the second region and the first inorganic insulating layer is not laminated in the second region.

The present application discloses an organic light emitting diode array substrate having a subpixel region and an inter-subpixel region. The organic light emitting diode array substrate in the inter-subpixel region includes a first base substrate; a pixel definition layer on the first base substrate for defining a plurality of subpixels; a spacer layer on a side of the pixel definition layer distal to the first base substrate; an auxiliary electrode layer on a side of the spacer layer distal to the pixel definition layer; and a second electrode layer on a side of the auxiliary electrode layer distal to the spacer layer and is electrically connected to the auxiliary electrode layer.

The present disclosure provides a cover, a display device, and a method for manufacturing the display device. By forming a first via hole in an electronic component disposing region when an optically clear adhesive is formed on the cover, via holes are formed because the optically clear adhesive cannot form in the electronic component disposing region. Thus, the optically clear adhesive does not have portions having different thicknesses, thereby preventing bubbles from forming in a blind hole region, and solving technical problems of the existing display device that the OCA has bubbles around the corresponding blind hole region, which affects photographing quality.

Provided is a method for preparing a display substrate. The display substrate includes multiple pixel island regions, empty regions and connection bridge regions. The preparation method includes: forming first grooves corresponding to the pixel island regions and second grooves corresponding to the connection bridge regions on a side of a hard underlay substrate; preparing the display substrate on a side of the underlay substrate where the first grooves and the second grooves are formed, wherein the pixel island regions are located in regions where the first grooves are located, the connection bridge regions are located in regions where the second grooves are located, and the empty regions are located in regions other than the first grooves and the second grooves; and separating the underlay substrate from the display substrate to obtain the display substrate.

A manufacturing method and a manufacturing device of a flexible panel are provided. the flexible panel includes a bending area, and the manufacturing method includes: providing a panel unit including a flexible substrate and a back film which are laminated, the panel unit including a panel area corresponding to the flexible panel and a non-panel area outside the panel area; and removing the non-panel area of the panel unit while peeling off a peelable portion of the back film in the bending area of the flexible panel.

A signal transmission method is applied to a receiving terminal so as to improve the anti-interference capability of the signals on the transmission line, and the signal transmission method includes: receiving a signal sent by a transmitting terminal through a transmission line; detecting whether there is a transmission error in the received signal; and when there is a transmission error in the received signal, adjusting at least one parameter of specified parameters affecting an anti-interference capability of signals on the transmission line, and/or controlling the transmitting terminal to adjust the at least one parameter of the specified parameters affecting the anti-interference capability of signals on the transmission line.

An OLED display device including an OLED pixel driving circuit is provided. A driving thin film transistor in the OLED pixel driving circuit is configured as a double gate oxide thin film transistor, and a switch thin film transistor is configured as a top gate self-aligned oxide thin film transistor. A manufacturing method of a TFT array substrate is also provided, and the TFT array substrate is used for preparing the OLED display device.

A substrate and a preparation method thereof, a display panel and a preparation method thereof, and a display device are provided. The substrate includes a display region and a peripheral region positioned in a periphery of the display region and used for sealing, the substrate includes: a base substrate; an insulating layer, arranged on a side of the base substrate and positioned in the display region and the peripheral region for sealing; and a plurality of pixel units, positioned on the insulating layer corresponding to the display region, and in the peripheral region, at least one groove is disposed on a side of the insulating layer which faces away from the base substrate, a side of the groove which is away from the base substrate is open, and a depth direction of the groove is perpendicular to the base substrate.

A method of manufacturing a display device includes providing an inorganic layer on a carrier substrate, providing a first flexible substrate on the inorganic layer, providing a first shielding layer including a metal on the first flexible substrate, providing a first barrier layer on the first shielding layer, and providing a thin film transistor layer on the first barrier layer. The inorganic layer includes at least one material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiOxNy), and a thickness of the inorganic layer is in a range from about 10 Å to about 6000 Å.

A display apparatus includes: a substrate; a display layer located on a first surface of the substrate; a cover panel located on a second surface, opposite to the first surface, of the substrate; a printed circuit board located on the cover panel; a plurality of first terminals located on a first side of the printed circuit board; a plurality of second terminals spaced apart from the plurality of first terminals; a cover portion covering the printed circuit board; and a connection pattern located on a surface of the cover portion and arranged within a perimeter of the printed circuit board, wherein the surface of the cover portion faces the printed circuit board.