Patent classifications
H10K59/1201
DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
A display panel, a manufacturing method thereof and a display device are disclosed. The display panel includes a display array layer, a first optical structural layer, and a first light shielding pattern. The display array layer includes a first sub-display area and a second sub-display area at least partially surrounded by the first sub-display area, the second sub-display area is configured to be able to transmit ambient light; the first optical structural layer is located at a display side of the display array layer; and the first light shielding pattern is located at a side of the first optical structural layer facing the display array layer, and the first light shielding pattern at least partially surrounds the second sub-display area and exposes at least a part of the second sub-display area.
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a barrier layer, a buffer layer, and a thin-film transistor (TFT) array layer. A plurality of first through-holes arranged apart from each other are defined in a display area, a plurality of second through-holes are defined in a bonding area, and the first through-holes and the second through-holes penetrate from an insulating layer to a side of the substrate near the barrier layer. The first through-holes and the second through-holes are filled with a flexible material, thereby improving bending resistance capability of the display panel, and reducing risks of cracking.
DISPLAY PANEL AND FABRICATION METHOD THEREOF
The present application provides a display panel and a fabrication method thereof. In the display panel, a bonding module covers a display area and an extension area, and a bonding conductive layer of the bonding module is electrically connected to an external driving chip. A display module covers the display area and the extension area, the display module comprises a thin film transistor array structure, and the thin film transistor array structure comprises a source-drain conductive layer. A portion of the source-drain conductive layer in the extension area is electrically connected to the bonding conductive layer by a through hole.
DISPLAY PANEL AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE
A display panel and a fabricating method thereof, and a displaying device. The display panel includes: a thin-film-transistor base plate; a planarization layer, wherein the planarization layer is provided on one surface of the thin-film-transistor base plate; and light emitting devices, wherein the light emitting devices are provided on one side of the planarization layer that is further away from the thin-film-transistor base plate, the light emitting devices include a blue-color light emitting device, a red-color light emitting device and a green-color light emitting device, the blue-color light emitting device includes a first anode, the red-color light emitting device includes a second anode, and the green-color light emitting device includes a third anode; and both of the surface roughness of the first anode and the surface roughness of the second anode are greater than the surface roughness of the third anode.
DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS
A display panel includes a display substrate and a reflective layer. The display substrate includes light-emitting regions and a non-light-emitting region. The reflective layer is located on a light exit side of the display substrate and includes a plurality of filter portions and reflective portions arranged between every two adjacent filter portions. The reflective portions correspond to the non-light-emitting region, and the filter portions correspond to the light-emitting regions.
Display substrate, manufacturing method thereof, and display device
Provided are a display substrate, a manufacturing method thereof and a display device. The display substrate includes a base and a plurality of subpixels arranged on the base in an array form. Each subpixel includes a light-emitting element, a subpixel driving circuitry coupled to the light-emitting element, and a light-emission detection circuitry configured to detect luminescence of light emitted by the light-emitting element. The light-emission detection circuitry includes a first control transistor and a PIN-type photodiode laminated in that order in a direction away from the base, a first electrode of the first control transistor is coupled to a cathode of the PIN-type photodiode, and an orthogonal projection of the first control transistor onto the base at least partially overlaps an orthogonal projection of the PIN-type photodiode onto the base. The display substrate provided by the present disclosure is used for display.
FLEXIBLE SUBSTRATE, PREPARATION METHOD THEREFOR AND FLEXIBLE DISPLAY SUBSTRATE
A flexible substrate, a preparation method therefor and a flexible display substrate. The flexible substrate comprises a plurality of spaced island regions and a plurality of bridge regions connected between different island regions, and has a plurality of openings in non-island regions and non-bridge regions. Each island region is provided with a plurality of layered structures. Each layered structure comprises, sequentially arranged from bottom to top: a first flexible base layer, a first buffer layer and a second flexible base layer, wherein the orthographic projection of the surface of the side of the first buffer layer facing the first flexible base layer on the first flexible base layer is greater than that of the surface of the side of the first flexible base layer facing the first buffer layer on the first flexible base layer.
DISPLAY DEVICE, DISPLAY PANEL AND FABRICATING METHOD THEREOF
A display panel includes: a driving substrate, a plurality of first electrodes, a hole transport layer, an organic light emitting layer, a second electrode layer and a color film layer. The hole transport layer includes a first portion and a second portion, the first portion is disposed between adjacent ones of the plurality of first electrodes and is located on a surface of the driving substrate; the second portion is disposed on a surface of each of the first electrodes away from the driving substrate; a minimum distance between an upper surface of the first portion away from the driving substrate and the driving substrate is smaller than an minimum distance between an upper surface of the second portion away from the driving substrate and the driving substrate.
Display Substrate and Manufacturing Method thereof, and Display Apparatus
Provided are a display substrate and a manufacturing method thereof, and a display apparatus. The display substrate includes: a display area and a peripheral area surrounding the display area. The display substrate includes: a base substrate, and a light emitting structure layer, a color filter layer, a first flat layer and an optical layer disposed on the base substrate; the color filter layer is located on one side of the light emitting structure layer away from the base substrate, the first flat layer is located on one side of the color filter layer away from the base substrate, and the optical layer is located on one side of the first flat layer away from the base substrate and is configured to collect light emitted from the color filter layer.
DISPLAY SUBSTRATE, FABRICATING METHOD THEREOF AND DISPLAY PANEL
Provided is display substrate, including driving circuit board, and first electrode layer, insulating layer, second electrode layer, isolation layer, transparent conductive layer sequentially stacked thereon. Driving circuit board includes pixel and bonding regions. First electrode layer includes first sub-portion in bonding region and second sub-portion in pixel region. Insulating and isolation layers are partially cover bonding and pixel regions. Insulating layer has first via hole in area corresponding to first sub-portion. Isolation layer has second via hole in the area. Axes of first and second via holes coincide, first sub-portion is exposed at first and second via holes. Second electrode layer is in pixel region, coupled to second sub-portion through third via hole in area corresponding to second sub-portion. Isolation layer has fourth via hole in area corresponding to second electrode layer. Transparent conductive layer is in pixel region, coupled to second electrode layer through fourth via hole.