A display device includes a substrate including a plastic layer, a barrier layer, and a display area in which an image is displayed. The display device further includes a light-emitting diode disposed in the display area, a planarization layer, and a pixel definition layer. The planarization layer and the pixel definition layer overlap the light-emitting diode. The display device further includes a thin film encapsulation layer disposed on the pixel definition layer. The thin film encapsulation layer includes at least one inorganic layer. The display device further includes an opening disposed in the display area and penetrating the substrate. The opening includes a protruded portion and a depressed portion, and the barrier layer overlaps at least one of the pixel definition layer and the planarization layer at the protruded portion.

A display device includes a substrate and a pixel disposed on the substrate. The pixel includes a first transistor, a second transistor electrically connected to the first transistor, a third transistor electrically connected to the first transistor, and a light-emitting diode element electrically connected to at least one of the first transistor and the third transistor. The first transistor includes a first semiconductor member and a first gate electrode. The first semiconductor member includes an oxide semiconductor material. The first gate electrode is disposed between the first semiconductor member and the substrate. The second transistor includes a second semiconductor member and a second gate electrode. The second semiconductor member includes the oxide semiconductor material. The second semiconductor member is disposed between the second gate electrode and the substrate. The third transistor includes a third semiconductor member including silicon.

The disclosure provides a fingerprint identification panel. The fingerprint identification panel includes an encapsulation layer, a light emitting element, a light sensing element and a dielectric layer. The light emitting element and the light sensing element are on a same side of the encapsulation layer, and the encapsulation layer is configured to enable light emitted from the light emitting element to be totally reflected in the encapsulation layer; the dielectric layer is between the encapsulation layer and the light sensing element and in direct contact with the encapsulation layer, and is configured to enable the light totally reflected by the encapsulation layer to be received by the light sensing element after passing through the dielectric layer, and a refractive index of the dielectric layer is smaller than that of the encapsulation layer.

Embodiments of the present disclosure relate to a display substrate, a method for manufacturing the same, and a display device. The display substrate includes a substrate, a pixel definition layer for defining pixels on the substrate, the pixel definition layer including a plurality of inter-pixel portions located between adjacent pixels, and a fingerprint recognition sensor located in the inter-pixel portions.

A display device including a base substrate including a display area and a non-display area positioned at a side of the display area; at least one transistor in the display area of the base substrate and conductive lines in the non-display area of the base substrate; at least one light-emitting element in the display area that is coupled to the at least one transistor; an encapsulation layer covering the light-emitting element; a sensing electrode on the encapsulation layer and a sensing line on the encapsulation layer coupled to the sensing electrode; and an align mark on the encapsulation layer at least partially overlapping some of the conductive lines in the non-display area, in a plan view.

A display apparatus includes a base substrate including a display area in which an image is displayed and a peripheral area adjacent to the display area, a source/drain pattern on the base substrate, the source/drain pattern including a connecting electrode in a pad portion of the peripheral area and a electrode of a thin film transistor in the display area, a planarization insulation layer on the base substrate, the planarization insulation layer contacting a side surface of the connecting electrode and a side surface of the electrode of the thin film transistor, and exposing a top surface of the connecting electrode, a connecting member contacting the connecting electrode, and a driving member including a driving circuit, the driving member being connected to the connecting member.

A display substrate having a plurality of subpixels is provided. A respective one of the plurality of subpixels includes alight emitting element; a first thin film transistor configured to driving light emission of the light emitting element; and a light emitting brightness value detector. The light emitting brightness value detector includes a second thin film transistor; and a photosensor electrically connected to the second thin film transistor and configured to detect a light emitting brightness value. The display substrate further includes a silicon organic glass layer on a side of at least one of the first thin film transistor or the second thin film transistor away from a base substrate; and the photosensor is on a side of the silicon organic glass layer away from the base substrate.

An organic light-emitting diode (OLED) display panel, a manufacturing method thereof, and an OLED display device are provided. In the OLED display panel, by disposing a stress buffering member in a concave corner of an undercut section, a stress at the concave corner is eliminated, and the undercut section is prevented from being broken, such that a technical problem that an existing OLED display panel is easily broken from a concave corner of a undercut section, which leads to a failure of the OLED display panel, is solved.

A display substrate and a preparation method thereof, and a display device are provided. The display substrate (200/300/400) includes a display region (201/301/401) and an opening region (2011/3011/4011), the display region (200/300/400) surrounds the opening region (2011/3011/4011), a first barrier wall (2012/3012/4012) is between the display region (201/301/401) and the opening region (2011/3011/4011), and the first barrier wall (2012/3012/4012) surrounds the opening region (2011/3011/4011); the first barrier wall (2012/3012/4012) includes a first metal layer structure, and at least one side surface, surrounding the opening region (2011/3011/4011), of the first metal layer structure includes a recess (2012A/3012A/4012A). The display substrate combines the imaging device with the display region of the display substrate and has a better encapsulation effect.

A driving backplane includes: a substrate; a first conductive layer disposed on the substrate; an insulating layer disposed on a side of the first conductive layer away from the substrate; and a second conductive layer disposed on a side of the insulating layer away from the substrate. The first conductive layer includes a first electrode, the first electrode includes a first sub-electrode and a second sub-electrode surrounding the first sub-electrode, and the second sub-electrode and the first sub-electrode have no gap therebetween. The second conductive layer includes a second electrode. An orthographic projection of the second electrode on the substrate coincides with an orthographic projection of the first sub-electrode on the substrate. The first sub-electrode, the second electrode and a portion of the insulating layer located therebetween constitute a first capacitor.