A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

A display module includes a window including a base substrate and a bezel pattern overlapping the base substrate in a plan view, and a display panel. The bezel pattern includes a first bezel pattern extending along an edge of the base substrate, and a second bezel pattern which extends from the first bezel pattern and of which at least a portion defines a transmission area. The display panel includes a glass substrate, an encapsulation substrate on the glass substrate, a sealing member coupling the glass substrate and the encapsulation substrate and overlapping the first bezel pattern in the plan view, a circuit element layer disposed on the glass substrate and including a transistor, and a display element layer disposed on the circuit element layer and including light emitting elements. The display element layer exposes a portion of a layer disposed thereunder, which corresponds to the transmission area.

The embodiment of the invention discloses a thin film transistor, a method for manufacturing the same, an array substrate thereof and a display panel thereof, wherein the thin film transistor includes: a light shielding layer, wherein the light shielding layer includes a first layer for preventing light from a backlight source from entering a channel region of an active layer and a second layer for preventing light from an interlayer light source from entering the channel region of the active layer. The present invention is provided with the light shielding layer, which not only prevents the backlight from entering the channel region of the active layer, but also prevents the interlayer light from entering the channel region of the active layer, thereby reducing the adverse effect of the light source on the active layer and thus improving the quality of the thin film transistor.

The present disclosure provides an organic thin film and a method for preparing the same, a display device, and an optical device, in which the method includes: providing a base substrate; forming an isomerization generating layer on the base substrate, the isomerization generating layer including a first region and a second region; adding a precursor solution on a surface of the isomerization generating layer away from the base substrate, and allowing surface energy of the second region to be greater than surface energy of the first region, so as to form the organic thin film from the precursor solution, the precursor solution being at least partially located in the second region.

A technique of producing a device comprising a stack of layers defining an array of transistors and including one or more electrically conductive interlayer connections, wherein the method comprises: forming a source-drain conductor pattern defining an array of source conductors each providing an addressing line for a respective set of transistors of the transistor array, and an array of drain conductors each associated with a respective transistor of the transistor array; wherein forming said source-drain conductor pattern comprises forming a first conductor subpattern and thereafter forming a second conductor subpattern, wherein said first conductor subpattern provides the conductive surface of the source-drain conductor pattern in one or more interconnect regions where electrically conductive interlayer connections are to be formed to the source-drain conductor pattern, and the second conductor subpattern provides the conductive surface of the source-drain conductor pattern at least in the regions where the source and drain conductors are in closest proximity.

An organic light emitting display device includes a display panel, a support layer, a coating layer, and a cushion layer. The display panel includes a foldable area. The support layer is disposed on a bottom surface of the display panel, and a plurality of openings is defined through the support layer on the foldable area. The coating layer is disposed on a top surface of the support layer and side walls of the support member which define the openings. The cushion layer is disposed between the coating layer and the display panel.

A device array substrate is provided and includes a flexible base, a pixel island, and a connection line. The pixel island is disposed on the flexible base, and at least one edge of the pixel island is provided with at least one opening. The connection line enters the pixel island via the opening. A display device is also provided and includes the device array substrate.

In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.

In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.

The present invention relates to an organic thin film transistor (OTFT) comprising an organic semiconductor layer (2) arranged between a source terminal (3) and a drain terminal (4). The OTFT further includes a front gate (5) electrode arranged on one side of the organic semiconductor layer and a back gate electrode (6) arranged on the opposite side of the organic semiconductor layer. The front and back gate electrodes are arranged to control the current flow in the organic semiconductor layer upon application of a voltage and the back gate electrode is electrically connected to one of: the front gate electrode and the source terminal. OTFT's according to the present invention, with a connection between the back gate and the source or front gate, exhibit improved turn on voltage stability, lower power consumption and improved bias stress stability compared to single gate and back gate isolated OTFTs.