A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.

A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

A display panel includes a first substrate on which a conductive structure layer is formed. The conductive structure layer has a bonding area close to a side edge thereof, at least a part of the bonding area of the conductive structure layer protrudes from a first side edge of the first substrate, and is bent toward a side of the first substrate away from the conductive structure layer and fixed; an end surface of the first side edge of the first substrate is provided with a first protective strip, the first protective strip has a first smooth surface facing the conductive structure layer and smoothly connected with a side surface of the first substrate on which the conductive structure layer is formed, and a bent part of the conductive structure layer is attached to the first smooth surface.

A light emitting device comprising a plurality of pixels arranged on a substrate to form a plurality of columns parallel to a first direction and a plurality of rows parallel to a second direction orthogonal to the first direction is provided. Each of the plurality of pixels includes a light emitting element, and a driving circuit configured to drive the light emitting element, the substrate includes a transistor region in which a plurality of transistors that form the driving circuit are arranged, the plurality of pixels include a first pixel and a second pixel, which are adjacent to each other in the first direction, and a virtual line parallel to the second direction, which passes through the transistor region of the first pixel, passes through the transistor region of the second pixel.

Local passive matrix displays and methods of operation are described. In an embodiment, the display includes a pixel driver chip coupled with a matrix of rows and columns of LEDs. The pixel driver chips may be arranged in rows across the display with separate portions to operate separate matrices of LEDs.

A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

An organic light emitting diode display device includes a substrate having an active area and a non-active area, a light emitting diode in the active area, a sealing layer over the light emitting diode, at least one lens pattern over the sealing layer, the at least one lens pattern having a convex shape, and a passivation layer in the active area and the non-active area, the passivation layer covering the at least one lens pattern and having a first open portion exposing a first pad area.

A display device and a method of manufacturing the same are provided. A display device includes: a plastic substrate including: a display portion including organic light emitting diodes, and a pad portion including chip-on-films, a lower protective member attached to an entire lower surface of the plastic substrate, and an upper protective member attached to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.

Hybrid architectures and method methods of operating a display panel are described. In an embodiment, row driver and pixel driver functions are combined in a group of backbone hybrid pixel driver chips, wherein global signal lines are distributed to the backbone hybrid pixel driver chips, where the global signals are manipulated and distributed to a row of pixel driver chips.