An electronic device is provided and includes a wiring structure including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side and two side walls opposite to each other. The insulating layer wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. The conductive wiring includes a first layer, a second layer and a third layer, the second layer is disposed between the first layer and the third layer, and the first layer is disposed between the second layer and the substrate. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer.

A display device includes a display panel and an integrated circuit chip. The integrated circuit chip is provided with a plurality of first binding terminals arranged at intervals, and conductive particles are in contact between the first binding terminals and second binding terminals of the display panel. A groove is provided on opposite sides of two adjacent first binding terminals, and the groove is filled with a first insulating layer.

A display device includes a display panel and an integrated circuit chip. The integrated circuit chip is provided with a plurality of first binding terminals arranged at intervals, and conductive particles are in contact between the first binding terminals and second binding terminals of the display panel. A groove is provided on opposite sides of two adjacent first binding terminals, and the groove is filled with a first insulating layer.

A display panel and a display device are provided. The display panel includes a base substrate and a conductive member, wherein the conductive member is located on the base substrate and includes a first conductive sub-layer, a second conductive sub-layer and a third conductive sub-layer stacked in sequence; the first conductive sub-layer is closer to the base substrate than the third conductive sub-layer; a conductivity of the first conductive sub-layer is smaller than that of the second conductive sub-layer, and a melting point of the third conductive sub-layer is larger than that of the second conductive sub-layer; the second conductive sub-layer includes a first surface close to the first conductive sub-layer and a second surface close to the third conductive sub-layer, the first surface and the second surface are oppositely arranged; the third conductive sub-layer protrudes from the second surface along a width direction of the conductive member

The present disclosure provides an array substrate, a method for fabricating the same and a display apparatus, which belongs to the field of display technology and may alleviate at least a problem of wide bezel of a display apparatus in the related art. The array substrate includes a display region and a periphery region abutting the display region, the display region being provided with a plurality of AM-OLEDs therein. The array substrate further includes a plurality of PM-OLEDs provided in the periphery region, wherein both of the plurality of AM-OLEDs and the plurality of PM-OLEDs are electrically connected to a power supply driving unit. Since the plurality of PM-OLEDs capable of emitting light are disposed in the periphery region, the array substrate according to the present disclosure can realize a narrow-bezel design.

An optical device (10) includes a joining structure in which a first conductive film (110) and a second conductive film (130) are joined to each other. The first conductive film (110) that constitutes the joining structure is constituted by a conductive material. The second conductive film (130) that constitutes the joining structure is constituted by a metal material. A part of the second conductive film (130) comes into contact with the first conductive film (110). A plurality of concave portions are provided in a contact surface of the second conductive film (130) which comes into contact with the first conductive film (110). The contact surface has a surface roughness greater than a surface roughness of a non-contact surface of the second conductive film (130) which does not come into contact with the first conductive film (110).

A flexible display device includes a flexible substrate and a conductive pattern. The flexible substrate includes a bending part. The conductive pattern includes a first conductive pattern layer and a second conductive pattern layer disposed on the first conductive pattern layer, and at least a portion of the conductive pattern may be disposed on the bending part. The first conductive pattern layer has a first thickness and includes a first material, and the second conductive pattern layer has a second thickness smaller than the first thickness and includes a second material different from the first material.

An array substrate, a display panel, a display apparatus, and a method for manufacturing the array substrate are provided. The array substrate includes: a base substrate; a plurality of pixels, at least one of the pixels including a pixel driver circuit and a light-emitting unit electrically connected to the pixel driver circuit; a fingerprint recognition structure including a first capacitor electrode configured to form a capacitor for fingerprint recognition between at least a part of a touch body and the first capacitor electrode in response to the at least a part of the touch body covering the first capacitor electrode. The fingerprint recognition structure is in the at least one pixel, the pixel driver circuit includes a thin film transistor including an active layer and a gate, and the first capacitor electrode is in the same layer as one of the active layer or the gate of the thin film transistor.

A display device includes a substrate including a display area and a non-display area, a pixel located in the display area, a pad unit on one side of the non-display area, and a driver connected to the pixel. The pixel includes a first insulating layer, a first light emitting element on the first insulating layer, a second insulating layer on the first light emitting element and exposing one end portion and another end portion of the first light emitting element, a first contact electrode on the second insulating layer and connected to the one end portion of the first light emitting element, and a second contact electrode on the second insulating layer and connected to the other end portion of the first light emitting element. The pad unit includes a pad metal layer, a first pad insulating layer, a second pad insulating layer, and a pad electrode.

An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.