The present disclosure relates to an electroluminescent lighting device having high aperture ratio. The present disclosure provides an electroluminescent light device comprising: a substrate including an emission area and a non-emission area surrounding the emission area; a power line disposed in the emission area and defining an open area; a buffer layer covering the power line; an emission element disposed in the open area on the buffer layer; a link electrode overlapping the power line on the buffer layer, and having a first end connected to the emission element and a second end connected to the power line; a passivation layer deposited within a width of the power line covering the link electrode; an emission layer covering the emission area; and a cathode layer covering the emission area on the emission layer.

A device such as a micro-OLED includes a display element having a display active area disposed over a silicon backplane and a display driver integrated circuit (DDIC) electrically coupled to the display element through at least one contact that extends through the silicon backplane. Through silicon via (TSV) technology may be used to form the contacts. A chip-on-flex architecture may be used to orient and attach the DDIC to the silicon backplane.

An AMOLED comprises a plurality of pixel structures arranged in a matrix and one layer of power supply signal electrode configured to provide a power supply voltage signal for the pixel structures, and the power supply signal electrode has a planar structure. The planar power supply signal electrode can greatly reduce its resistance and hence can reduce the IR drop of power supply voltage signals that are transmitted over the power supply signal electrode, effectively reduce the impact of the IR drop on the display effect, and remarkably reduce the power consumption of a panel.

The present invention provides a frameless display device and a manufacturing method thereof, in which a conductive connection body is formed on a substrate; a first via is formed in a protective layer to be located above the conductive connection body and a second via hole is formed in the substrate to be located under the conductive connection body. A circuit layout layer is connected through the first via with the conductive connection body and a flexible connection circuit connected to a drive circuit board is connected through the second via with the conductive connection body thereby achieving electrical connection between the drive circuit board and the circuit layout layer. The method is simple and easy to operate and in a frameless display device so manufactured, the flexible connection circuit and the drive circuit board are both arranged at a back side of the substrate without occupying an effective display zone thereby achieving frameless displaying and improving displaying quality.

A display device includes a substrate including a first planarization region and a second planarization region inclined at a predetermined angle with respect to the first planarization region. A display device further includes a first wiring disposed in the second planarization region. A display device additionally includes a flexible film bonded with the substrate in the first planarization region and the second planarization region and connected to the first wiring in the second planarization region.

An organic electro-luminescence display device includes: a first substrate having transmissive properties; a touch electrode for a touch sensor, the touch electrode being provided on a main surface of the first substrate; an insulating film provided on the main surface and covering the touch electrode wherein the insulating film includes a first surface at the touch electrode-side and a second surface opposite to the first surface; an organic light-emitting element provided on the second surface of the insulating film; a second substrate provided facing the main surface of the first substrate; and an integrated circuit electrically connected with both the touch electrode and the organic light-emitting element. The touch electrode, the insulating film, and the organic light-emitting element are interposed between the first substrate and the second substrate.

A display device comprises a display panel having a display area, in which a plurality of pixels and at least one power line for supplying power to the pixels are formed, and a non-display area outside the display area; and a cover disposed over the display panel so as to cover the display area of the display panel. The cover comprises at least one electrically conductive portion coupled to the at least one power line and configured to receive at least one power supply voltage via the non-display area and supply the at least one power supply voltage to the at least one power line in the display area.

Provided is a light-emitting device including a pair of substrates each of which includes a conductive layer, a light-emitting element, disposed between the pair of substrates, which includes a first electrode and a second electrode facing each other, and a resin layer, containing conductive particles, which fills a space between the substrates and electrically connects the conductive layers of the substrates to the first and second electrodes of the light-emitting element.

Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

An organic light emitting display can include light emitting elements disposed on a substrate; an encapsulation unit disposed on the light emitting elements; touch sensors disposed on the encapsulation unit; first conductive lines connected to the touch sensors; second conductive lines connected to the first conductive lines; and at least one insulating film formed of at least one of an inorganic film or an organic film and disposed between the first and second conductive lines.