A method of forming a device includes emitting a coherent light beam and providing a mask including a region transparent to the light beam. The method further includes projecting the light beam on a photosensitive layer through the transparent region of the mask. The method further includes forming a recess in the photosensitive layer, wherein the recess corresponds to a position of the transparent region of the mask. The method further includes filling an organic light emitting material in the recess.

A method of manufacturing a display panel includes providing a base substrate and forming a plurality of anodes above the base substrate; forming a photoresist layer above a side of the base substrate above which the plurality of anodes are formed, the photoresist layer including a plurality of openings and each opening corresponding to at least one anode; and forming a plurality of light emitting layers and a cathode layer sequentially above a side of the base substrate above which the plurality of anodes and the photoresist layer are formed, the cathode layer including a plurality of cathode films and each cathode film corresponding to a single opening.

A manufacturing method of a display panel and a display panel are provided. The advantages thereof are that a shadow area of an edge of a pixel caused by an angle of evaporation can be avoided and reduced, a pixel position accuracy (PPA) shift caused by raising a temperature of a fine metal mask during a coating process can be prevented, and it is applicable to manufacture of high-resolution display panels.

A display device includes a display panel and a first protective substrate positioned under the display panel and including a first sub-region and a second sub-region positioned at a side of the first sub-region. A thickness of the first protective substrate in the first sub-region is greater than a thickness of the first protective substrate in the second sub-region.

An array substrate and a method for manufacturing the same, a method for repairing an array substrate, and a display apparatus are provided. The array substrate includes a base substrate and pixel units above the base substrate, each pixel unit includes a light emitting device, the light emitting device includes a first electrode and a second electrode, at least one pixel unit is provided with a repair structure, the repair structure includes a first part and a second part mutually insulated, the first part and the second part are electrically coupled after being repaired, the first part is electrically coupled to the first electrode of the light emitting device in the pixel unit where the repair structure is located, the second part is electrically coupled to the first electrode of the light emitting device in any pixel unit other than the pixel unit where the repair structure is located.

An organic light emitting display device may include a base substrate including an emission area at which light is emitted and a peripheral area which is adjacent to the emission area; an encapsulation substrate disposed on the base substrate; a common layer between the base substrate and the encapsulation substrate, the common layer disposed in both the emission area and the peripheral area; between the base substrate and the common layer, each of: a planarization layer; a pixel electrode in the emission area; and a pixel defining layer; and a discharging hole disposed corresponding to the pixel defining layer, the discharging hole extending through the common layer.

An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction and a method for fabricating the same. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate.

A display apparatus includes: a substrate having a display area and a peripheral area extending around a periphery of the display area; a pixel electrode in the display area; a pixel-defining layer on the pixel electrode and having a first sub-opening exposing a central portion of the pixel electrode; a bank layer on the pixel-defining layer and having a third sub-opening exposing a central portion of the pixel electrode; a first conductive layer on the bank layer and having a tip protruding outwardly beyond the pixel electrode and the third sub-opening; an emission layer over the pixel electrode and the first conductive layer and having an opening exposing a portion of an upper surface of the first conductive layer; and an opposite electrode on the emission layer and in direct contact with the first conductive layer through the opening in the emission layer.

Provided is a display substrate, including: a silicon-based substrate having a display area, a binding area located on one side of the display area, and a trace area located between the display area and the binding area; a trace protection structure is arranged on the silicon-based substrate in the trace area, and a pad assembly is integrated in the silicon-based substrate in the binding area; and a minimum distance between an edge of an orthographic projection of the trace protection structure on the silicon-based substrate and an edge of an orthographic projection of an opening of the pad assembly on the silicon-based substrate is smaller than a maximum size of one subpixel.

Embodiments of the present disclosure relate to a quantum dot light emitting diode subpixel array, a method for manufacturing the same, and a display device. The method for manufacturing the quantum dot light emitting diode subpixel array according to embodiments of the present disclosure comprises a quantum dot accepting layer forming step of forming a quantum dot accepting layer on a substrate; a thermosensitive quantum dot material layer applying step of applying a thermosensitive quantum dot material layer containing a thermosensitive organic ligand on the quantum dot accepting layer; and a thermosensitive quantum dot material transferring step of subjecting the organic ligand of the thermosensitive quantum dot material in a predetermined area of the thermosensitive quantum dot material layer to a chemical reaction by heating such that the thermosensitive quantum dot material in the predetermined area is transferred onto a corresponding subpixel region on the quantum dot accepting layer.