A display device includes a first substrate including a display area and a non-display area, a display element disposed on the first substrate in the display area, a first sealing portion disposed on the first substrate in the non-display area, a second substrate facing the first substrate in a thickness direction, a hole defined through the first substrate and the second substrate along the thickness direction in the display area, and a second sealing portion disposed between the first substrate and the second substrate and enclosing the hole.

A deposition apparatus includes a chamber, a mask assembly disposed in the chamber and including an open sheet including a first area in which a first deposition hole is defined and a second area in which a second deposition hole spaced apart from the first deposition hole is defined, a first mask including multiple deposition openings that overlap the first area, and a second mask including multiple deposition openings that overlap the second area, a deposition substrate disposed on the mask assembly, and a deposition source spraying a deposition material to the mask assembly.

A mask and a method of manufacturing the same are disclosed. The method of manufacturing a mask includes forming a conductive layer on a pattern region and an auxiliary region around the pattern region of a substrate, placing the substrate including the conductive layer in a plating bath, forming a plating layer on the conductive layer, and separating the substrate and the conductive layer from the plating layer.

An organic light emitting display device is disclosed that includes a substrate on which a first sub pixel configured to emit a first color, a second sub pixel configured to emit a second color, and a third sub pixel configured to emit a third color are disposed, a first electrode that defines emitting areas of the first sub pixel, the second sub pixel, and the third sub pixel and is disposed on the substrate, an organic light emitting diode on the first electrode, a bank that defines the emitting areas of the first sub pixel, the second sub pixel, and the third sub pixel and is disposed in a non-emitting area and exposes an upper portion of the first electrode and a second electrode on the organic light emitting diode. The organic light emitting diode includes a path blocking layer in the non-emitting area.

Embodiments of the disclosed subject matter provide a device having a substrate, and a plurality of unit areas of an organic light emitting diode (OLED) display disposed on the substrate. The unit areas may be repeating, area-filling subdivisions of the substrate that each have an anode and a cathode. The organic film may be disposed over portions of the device other than the unit areas. The device may include at least one pixel having a plurality of sub-pixels disposed within each of the plurality of unit areas. The cathode of at least one pixel of each of the plurality of unit areas may be a common cathode.

The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a first area and a second area. A pixel density of the first area is greater than that of the second area. In the second area, each pixel includes a first sub-pixel, a second sub-pixel, a third sub-pixel, and a fourth sub-pixel. The first sub-pixel, the third sub-pixel, and the fourth sub-pixel are in a same sub-pixel row. The first sub-pixel is between the third sub-pixel and the fourth sub-pixel. The first sub-pixel and the second sub-pixel are in a same sub-pixel column. The first sub-pixel and the second sub-pixel are respectively in adjacent sub-pixel rows. The first sub-pixel and the second sub-pixel has a same emission color. The first sub-pixel, the third sub-pixel, and the fourth sub-pixel have different emission colors.

Provided is a mask having a plurality of cell areas, each of which has a plurality of through-portions defined therein. The mask includes a mask film including a polymer and a conductive layer disposed on at least one surface of the mask film and including conductive metal or a conductive metal oxide. Accordingly, precision of a deposition process is enhanced while reducing process time and costs in a manufacturing process of the mask, and thus the yield in manufacturing a display panel using the mask is improved. Therefore, the display panel manufactured using the mask may have improved reliability.

According to one or more embodiments, a mask assembly includes a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first region and a second region, and a deposition material is passable through the first region corresponding to the opening, and the second region is around the first region, and the first region includes deposition openings, and the second region includes dummy openings, at least some of the dummy openings including centers arranged to deviate from a straight line connecting centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

An organic device includes an outer edge, a wiring area and a display area that includes a first electrode, an organic layer on the first electrode and a second electrode on the organic layer. The wiring area includes a reference electrode connected to the second electrode and defining a reference potential. The display area includes a first area and a second area bordering the first area. The second area includes a normal area including the second electrode and transmission areas not including the second electrode and arranged in a first direction. The second electrode of the normal area includes connecting portions connected to the second electrode of the first area. The connecting portions include a first connecting portion located on the side of the first side in a second direction. The first connecting portion includes a facing connecting portion located between the transmission areas in the first direction.

A trilayer resist system design and method for patterning organic devices including organic light emitting diode (OLED) devices suited for high-definition light field displays. The trilayer resist system is comprised of a fluoropolymer base layer, an inorganic transfer layer and a top positive-type photoresist layer that protects organics formed upon a substrate from damage resulting from the radiation, developers and solvents used in traditional photolithography techniques and thereby resulting in a high-resolution multi-colored OLED array.