A method for preparing photoactive perovskite materials. The method comprises the steps of: introducing a lead halide and a first solvent to a first vessel and contacting the lead halide with the first solvent to dissolve the lead halide to form a lead halide solution, introducing a Group 1 metal halide a second solvent into a second vessel and contacting the Group 1 metal halide with the second solvent to dissolve the Group 1 metal halide to form a Group 1 metal halide solution, and contacting the lead halide solution with the Group 1 metal halide solution to form a thin-film precursor ink. The method further comprises depositing the thin-film precursor ink onto a substrate, drying the thin-film precursor ink to form a thin film, annealing the thin film; and rinsing the thin film with a salt solution.

The invention provides an optoelectronic device comprising a porous material, which porous material comprises a semiconductor comprising a perovskite. The porous material may comprise a porous perovskite. Thus, the porous material may be a perovskite material which is itself porous. Additionally or alternatively, the porous material may comprise a porous dielectric scaffold material, such as alumina, and a coating disposed on a surface thereof, which coating comprises the semiconductor comprising the perovskite. Thus, in some embodiments the porosity arises from the dielectric scaffold rather than from the perovskite itself. The porous material is usually infiltrated by a charge transporting material such as a hole conductor, a liquid electrolyte, or an electron conductor. The invention further provides the use of the porous material as a semiconductor in an optoelectronic device. Further provided is the use of the porous material as a photosensitizing, semiconducting material in an optoelectronic device. The invention additionally provides the use of a layer comprising the porous material as a photoactive layer in an optoelectronic device. Further provided is a photoactive layer for an optoelectronic device, which photoactive layer comprises the porous material.

An organic electroluminescence element in an embodiment according to the present invention includes a first electrode, a third electrode including a region overlapping the first electrode, a first insulating layer between the first electrode and the third electrode, a second insulating layer between the first insulating layer and the third electrode, an electron transfer layer between the first insulating layer and the third electrode, a light emitting layer, containing an organic electroluminescence material, between the electron transfer layer and the third electrode, and a second electrode located between the first insulating layer and the second insulating layer and electrically connected with the electron transfer layer. The organic electroluminescence element includes an overlap region where the third electrode, the light emitting layer, the electron transfer layer, the first insulating layer and the first electrode overlap each other in an opening of the second insulating layer.

A method for preparing photoactive perovskite materials. The method comprises the steps of: introducing a lead halide and a first solvent to a first vessel and contacting the lead halide with the first solvent to dissolve the lead halide to form a lead halide solution, introducing a Group 1 metal halide a second solvent into a second vessel and contacting the Group 1 metal halide with the second solvent to dissolve the Group 1 metal halide to form a Group 1 metal halide solution, and contacting the lead halide solution with the Group 1 metal halide solution to form a thin-film precursor ink. The method further comprises depositing the thin-film precursor ink onto a substrate, drying the thin-film precursor ink to form a thin film, annealing the thin film; and rinsing the thin film with a salt solution.

The semiconductor device includes: a first conductor pattern disposed on an insulating surface; and a second conductor pattern disposed on the insulating surface and spaced apart from the first conductor pattern, wherein, in a planar view, a first side of the first conductor pattern and a second side of the second conductor pattern are each formed of a plurality of sides, the first side and the second side face each other, and each of a maximum length of a plurality of sides constituting the first side and a maximum length of a plurality of sides constituting the second side is shorter than the minimum distance between the first side and the second side.

The present disclosure relates to the field of display technology, and provides a display substrate, its manufacturing method, and a display device. The display substrate includes a display region and a GOA region. An active layer of a TFT at the GOA region at least includes a first oxide semiconductor layer and a second oxide semiconductor layer arranged on the first oxide semiconductor layer, and the first oxide semiconductor layer is arranged between the second oxide semiconductor layer and a base substrate of the display substrate and has a carrier mobility of smaller than the second oxide semiconductor layer.

Reagents and aqueous solutions thereof are described that are useful for aqueous processing to form thin films comprising metal oxides. A film, or layered film, may be incorporated into working devices where the thin film provides useful optical properties, electrical properties, or both.

A display device includes: a circuit element layer comprising a transistor; a display element layer comprising a first electrode connected to the transistor, a second electrode facing the first electrode, an organic pattern between the first electrode and the second electrode, a pixel defining layer having an opening exposing the first electrode, an auxiliary electrode spaced apart from the opening to cover a portion of the pixel defining layer and connected to the second electrode, a first protection pattern covering the second electrode, and a second protection pattern covering the first protection pattern; and an encapsulation layer covering the display element layer, wherein the first protection pattern and the second protection pattern have stress in directions different from each other.

A display device includes a display panel having a display area and a non-display area and a polyimide substrate. The display device includes a transistor disposed above the substrate in the display area, a flexible film disposed on a side surface of the non-display area and connected to the substrate, and a conductive layer disposed below the substrate and applied with a low potential power voltage from the flexible film to improve an edge burn-in due to the polarization by offsetting positive charges in the polyimide substrate.

Methods and systems of producing perovskite material, in which the nucleation and crystallization processes are decoupled and, hence, independently controlled resulting in highly uniform nucleation sites for subsequent crystallization of perovskites. Methods and systems for using perovskite material and mixed perovskite films for solar cells.