Patent classifications
H10N10/817
MANUFACTURING METHOD OF THERMOELECTRIC CONVERSION ELEMENT
The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.
THERMOELECTRIC ELEMENT
A thermoelectric element according to one embodiment of the present invention comprises: a first metal substrate; a first resin layer arranged on the first metal substrate; a plurality of first electrodes arranged on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer arranged on the plurality of second electrodes; and a second metal substrate arranged on the second resin layer, wherein at least one of the plurality of first electrodes comprises: a first surface coming into contact with the first resin layer; a second surface which is opposite to the first surface and on which one pair of a P-type thermoelectric leg and an N-type thermoelectric leg are arranged; and a first protruding part arranged along the edge of the second surface, and the thickness of the first resin layer arranged between neighboring first electrodes is less than the thickness of the first resin layer arranged on the lower side of the first surface.
Thermoelectric conversion element
A thermoelectric conversion element includes an element body formed of a thermoelectric conversion material of a silicide-based compound, and electrodes each formed on one surface of the element body and the other surface opposite the one surface. The electrodes are formed of a sintered body of a copper silicide, and the electrodes and the element body are directly joined.
Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module and optical sensor
A thermoelectric conversion material contains a matrix composed of a semiconductor and nanoparticles disposed in the matrix, and the nanoparticles have a lattice constant distribution Δd/d of 0.0055 or more.
Solder alloy and junction structure using same
A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
THERMOELECTRIC MODULE
A thermoelectric module that has excellent thermal, electric properties, can realize high joining force between thermoelectric elements and an electrode, and can maintain stable joining even at a high temperature.
HIGH-POWER THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION SYSTEM
The present invention relates to a high-power thermoelectric conversion module and thermoelectric conversion system. The thermoelectric conversion module includes: a first substrate made of ceramic; a second substrate made of ceramic and disposed opposite to the first substrate; a plurality of third electrodes and thermoelectric conversion elements arranged crosswise in a matrix between the first substrate and the second substrate; a first electrode disposed between the first substrate and the thermoelectric conversion elements; and a second electrode disposed between the second substrate and the thermoelectric conversion elements. The first electrode is connected to one ends of the thermoelectric conversion elements and the third electrodes whose tops are flush with the one ends of the thermoelectric conversion elements, respectively. The second electrode is connected to the other ends of the thermoelectric conversion elements and the third electrodes whose bottoms are flush with the other ends of the thermoelectric conversion elements, respectively.
THERMOCOUPLE CONNECTOR AND MANUFACTURING METHOD OF THE SAME
The present inventive concept relates to a thermocouple connector and a manufacturing method of the same, the manufacturing method including forming connector pins, covering the connector pins using a glass material, the sensor electrodes including a positive sensor electrode and a negative sensor electrode respectively connected to the positive terminal and the negative terminal, the positive sensor electrode being the chromel and the negative terminal being the alumel, placing the connector pins in a center of a surrounding sealing material having a hole, filling liquid ceramic material into a space of the surrounding sealing material through the hole, sealing the hole, and solidifying the liquid ceramic material. According to the present inventive concept, the connector pin is provided by using the same kind of material as a material of the thermocouple sensor, whereby output voltage error is minimized and output voltage change due to long-term use is low.
THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELECTRIC CONVERSION MODULE
A thermoelectric conversion module includes: a plurality of thermoelectric conversion elements; a first electrode portion disposed on one end side of the plurality of thermoelectric conversion elements; and a second electrode portion disposed on the other end side of the plurality of thermoelectric conversion elements, a first insulating circuit board provided with a first insulating layer and the first electrode portion made of copper or a copper alloy formed on one surface of the first insulating layer is disposed on one end side of the thermoelectric conversion elements, a Ag plating layer is directly formed on a surface of the first electrode portion opposite to the first insulating layer, a Ni layer is not present between the first electrode portion and the Ag plating layer, and the Ag plating layer and the thermoelectric conversion element are bonded to each other via a sintered body of Ag.
Thermoelectric conversion element and thermoelectric conversion module
A thermoelectric conversion element includes a thermoelectric member that is columnar and an insulator formed around the thermoelectric member. Particles are enclosed between the thermoelectric member and the insulator.