Patent classifications
H10N10/817
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOELECTRIC CONVERSION MODULE, AND BINDER FOR THERMOELECTRIC CONVERSION MODULE
A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.
THERMOELECTRIC MODULE
A thermoelectric module according to the disclosure includes: a pair of support substrates including mutually opposed regions; wiring conductors disposed on opposed one principal surfaces of the pair of support substrates, respectively; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor of the wiring conductors, the one wiring conductor being located on either one support substrate of the pair of support substrates; and an electrically conductive joining material which joins the one wiring conductor and the lead member together. A bonding interface between the electrically conductive joining material and the wiring conductor is smaller in width on a side close to the thermoelectric elements than on a side away from the thermoelectric elements, as viewed in a section in a direction perpendicular to an axial direction of the lead member.
Method of Manufacturing and Operating Nano-Scale Energy Conversion Device
Embodiments relate to methods of manufacturing and operating nano-scale energy converters and electric power generators. The nano-scale energy converters include two electrodes separated a predetermined distance. The first electrode is manufactured to have a first work function value. The second electrode is manufactured to have a second work function value different from the first work function value. A cavity is formed between the first and second electrodes, and a nanofluid is disposed in the cavity. The nanofluid includes a plurality of nanoparticles, with the nanoparticles having a third work function value that is greater than the first and second work function values. The relationship of the work function values of the nanoparticles to the work function values of the electrodes optimizes transfer of electrons to the nanoparticles through Brownian motion and electron hopping.
THERMOELECTRIC MODULE
The present invention relates to a thermoelectric module, and a thermoelectric module according to an exemplary embodiment of the present invention includes: a plurality of thermoelectric elements that are disposed between a heat transmission member and a cooling member; and a first electrode layer and a second electrode layer that are respectively disposed between the heat transmission member and the plurality of thermoelectric elements and between the cooling member and the plurality of thermoelectric elements, wherein the plurality of thermoelectric elements may include P-type thermoelectric elements and N-type thermoelectric elements, and a P-type thermoelectric element and an N-type thermoelectric element that neighbor each other may have different heights, and one electrode layer selected from among the first electrode layer and the second electrode layer formed throughout the P-type thermoelectric element and the N-type thermoelectric element that neighbor each other may have at least two bent portions.
High-Temperature Fiber-Free Thermocouple
The present invention relates to a high-temperature thermocouple with a thermocouple wire including two dissimilar wires twisted together and covered with a polyimide-based leak-proof insulation coating. The thermocouple wire may include a welded hot junction attaching the two dissimilar wires together on one end and may be connected to a thermocouple connector located at an opposite end. A method for making the high-temperature thermocouple may include coating a pair of dissimilar wires with a leak-proof polyimide-based insulation coating by dipping of dissimilar wires in a liquid polyimide-based solution and curing the dissimilar wires with heat. The method may also include twisting the dissimilar wires around themselves, welding together the dissimilar wires to each other creating a welded hot junction, and attaching the opposite end of the dissimilar wires to a thermocouple connector. The leak-proof insulation coating and thermocouple connector may be rated for 800 degrees F. and 150 PSI.
THERMOELECTRIC MODULE
A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
Multi header for thermoelectric device
A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.
THERMOELECTRIC MODULE
A thermoelectric module includes a plurality of thermoelectric components, a first electrode and a second electrode. The thermoelectric components have the same type of semiconductor material. The first electrode includes a first parallel connection part and a first serial connection part. The plurality of thermoelectric components is electrically connected to the first parallel connection part and each of the plurality of thermoelectric components is separated from one another. The first serial connection part is configured for being electrically connected to other electrical components. The plurality of thermoelectric components is electrically connected to the second electrode and located between the first parallel connection part and the second electrode.
PIXEL CIRCUIT, DISPLAY PANEL, AND TEMPERATURE COMPENSATION METHOD FOR DISPLAY PANEL
The present application provides a pixel circuit, a display panel, and a temperature compensation method for a display panel. The display panel includes a plurality of pixel units. At least one of the plurality of pixel units includes: a display layer comprising a light emitting element; and a thermoelectric conversion layer comprising a thermoelectric element having a first terminal and a second terminal, wherein the first terminal is disposed adjacent to the light emitting element and in thermal contact with the light emitting element, and the second terminal is disposed away from the light emitting element. The thermoelectric element has a first signal terminal and a second signal terminal, and is configured to generate a temperature difference voltage signal between the first signal terminal and the second signal terminal according to a temperature difference between the first terminal and the second terminal.
Thermoelectric energy harvesting device and method of harvesting environmental energy
A thermoelectric energy harvesting device including a first thermal-coupling interface, a second thermal-coupling interface, and a membrane. The membrane arranged between the first thermal-coupling interface and the second thermal-coupling interface and connected to the first thermal-coupling interface by a supporting frame. A thermal bridge between the second thermal-coupling interface and a thermal-coupling portion of the membrane. A thermoelectric converter on the membrane configured to supply an electrical quantity as a function of a temperature difference between the thermal-coupling portion of the membrane and the supporting frame.