A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.

Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

A thermoelectric cooler, a method for preparing a thermoelectric cooler, and an electronic device. The thermoelectric cooler includes two monocrystalline silicon substrates disposed opposite to each other and a plurality of semiconductor thermoelectric particles located between the two monocrystalline silicon substrates. An insulation layer is provided on a side that is of a monocrystalline silicon substrate and that faces the semiconductor thermoelectric particles. A conductive sheet is provided between the insulation layer and the semiconductor thermoelectric particles, and the conductive sheet is electrically connected to the semiconductor thermoelectric particles, so that the semiconductor thermoelectric particles form a serial connection circuit.

A thermoelectric element according to one embodiment of the present invention includes a first substrate, a first insulating layer disposed on the first substrate, first electrodes disposed on the first insulating layer, a plurality of semiconductor structures disposed on the first electrodes, and second electrodes disposed on the plurality of semiconductor structures, wherein an average value of absolute values of lengths from a center line to a profile curve of a rough surface of at least a part of an upper surface of the first insulating layer is in the range of 1 to 5 μm.

A thermoelectric element according to one embodiment of the present invention includes a first substrate, a first insulating layer disposed on the first substrate, first electrodes disposed on the first insulating layer, a plurality of semiconductor structures disposed on the first electrodes, and second electrodes disposed on the plurality of semiconductor structures, wherein an average value of absolute values of lengths from a center line to a profile curve of a rough surface of at least a part of an upper surface of the first insulating layer is in the range of 1 to 5 μm.

Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.

Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.

A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

This method is for manufacturing a thermoelectric conversion module in which a first conductive member, a thermoelectric conversion element, a second conductive member are joined by joining members, the method comprising: a step for, after applying on the first conductive member a first paste including metal particles, disposing the thermoelectric conversion element on the first paste, and compressing and spreading the first paste; a step for disposing the second conductive member, after applying a second paste including metal particles in a controlled amount, on the thermoelectric conversion element, and compressing and spreading the second paste; and a step for sintering the first and the second pastes to obtain joining members.