A mounting pad system and method for an HVAC outdoor unit that includes providing a lightweight fillable pad shell containing a gelling material and having securing slots extending from an underside surface to an upperside surface of the shell. The shell is filled with water through a port at its upper surface. Prior to leveling the filled pad on the soil at the site and installation of the outdoor unit, securing straps are inserted into the slots from the underside surface of the shell so as to extend through an upper surface thereof. The filling port is covered when the HVAC unit is placed on top of the pad. One or more securing anchors can be used to anchor the pad to the ground, which are also covered when the HVAC unit is place on top of the pad and an anti-theft cable can be employed to further prevent theft.

A composition includes at least one Pb/Ni/Nb - Pb/Mg/W - Pb/Zr/Ti mixed oxide. A piezoelectric device may be made by providing at least two layers comprising the composition and coated with an outer electrode material; providing a plurality of layers comprising the composition and coated with an inner electrode material; combining or stacking a plurality of layers coated with inner electrode materials between two outer electrodes; and sintering or co-firing the inner electrode materials and outer electrode materials at a temperature at or below about 1000° C.

A composition includes at least one Pb/Ni/Nb - Pb/Mg/W - Pb/Zr/Ti mixed oxide. A piezoelectric device may be made by providing at least two layers comprising the composition and coated with an outer electrode material; providing a plurality of layers comprising the composition and coated with an inner electrode material; combining or stacking a plurality of layers coated with inner electrode materials between two outer electrodes; and sintering or co-firing the inner electrode materials and outer electrode materials at a temperature at or below about 1000° C.

In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.

In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.

A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

In an embodiment, a multilayer piezoelectric element includes a multilayer piezoelectric body and multiple internal electrodes. The multilayer piezoelectric body has a pair of principal faces in a first-axis direction, a pair of end faces in a second-axis direction crossing at right angles with the first-axis direction and defining the longitudinal direction, and a pair of side faces in a third-axis direction crossing at right angles with the first-axis direction and second-axis direction. The multiple internal electrodes are placed inside the multilayer piezoelectric body and stacked in the first-axis direction. Among the multiple internal electrodes, a center internal electrode placed at the center part of the multilayer piezoelectric body is such that its first cross-sectional shape, as viewed from the third-axis direction, has undulations greater than the undulations of the second cross-sectional shape of the center internal electrode as viewed from the second-axis direction.

Provided is a method of manufacturing a piezoelectric element in which, at a time when the piezoelectric element is manufactured, a piezoelectric material is prevented from being exposed to a temperature higher than a Curie temperature thereof to be depolarized, to thereby significantly decrease piezoelectric properties. The method of manufacturing a piezoelectric element includes a first step of arranging a plurality of electrodes on a piezoelectric material, electrically short-circuiting two or more electrodes of the plurality of electrodes, and subjecting the piezoelectric material to heat treatment, and a second step of, after the first step, electrically opening the short circuit of the two or more electrodes at a time when a temperature of the piezoelectric material decreases to less than a temperature of the piezoelectric material at a time of the heat treatment.

A laminated piezoelectric element has excellent suppression effect on characteristics deterioration caused by a pyroelectric effect. Inside an element main body are a first internal electrode, a piezoelectric layer, and a second internal electrode that has different polarity from the first internal electrode, which are repeatedly layered a plurality of times along the lamination direction. A first external electrode is formed on a first side surface of the element main body. A second external electrode is formed on a second side surface of the element main body. A resistance layer connected to the internal electrodes is formed in at least part of a third side surface of the element main body in which the internal electrodes are exposed. An insulating layer is formed on a third side of the element main body so as to cover the resistance layer.