H10N30/063

Method of manufacturing an electronic component

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

LIQUID DISCHARGE HEAD
20220305786 · 2022-09-29 ·

According to one embodiment, a liquid discharge head includes a flexible printed circuit (FPC) connected to piezoelectric elements. The FPC has a first end in the first direction. A wiring layer of the FPC has a first region at the first end and a cover layer covering on a second region. The piezoelectric elements are spaced from each other in a second direction and each has a first electrode on a side surface facing towards the FPC. The first side has a joint surface facing the first region of the wiring layer. The first electrode is electrically connected to the wiring layer at the joint surface. The side surface includes a step portion that is recessed from the joint surface. A portion of the cover layer protrudes into a space adjacent to the step portion.

ELECTROACOUSTIC TRANSDUCER
20170222118 · 2017-08-03 ·

An electroacoustic transducer includes: a polygonal-shaped laminated piezoelectric element including alternately stacked piezoelectric layers and electrode layers, with the piezoelectric layers placed between at least one pair of electrode layers having different polarities; and a circular vibration plate on which the laminated piezoelectric element is placed. Of the piezoelectric layers sandwiched between the at least one pair of electrode layers, the total volume (V) of those effective layers that overlap the at least one pair of electrode layers as viewed from the stacking direction satisfies the condition below:


0.2πR.sup.2×ts≦V≦2.0πR.sup.2×ts

wherein π represents the ratio of the circumference of a circle to its diameter, R represents the radius of the vibration plate, and ts represents the thickness of the vibration plate.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

Stepped piezoelectric actuator

A bender beam actuator includes a first layer of piezoelectric material and a second layer of piezoelectric material overlying a portion of the first layer of piezoelectric material, where a length of the first layer of piezoelectric material is at least 2% greater than a length of the second layer of piezoelectric material.

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND INTEGRATION METHOD THEREFOR
20210391528 · 2021-12-16 ·

An integrated structure of a crystal resonator and a control circuit (110) and an integrated method therefor. Integration of the crystal resonator with the control circuit (110) is accomplished by forming, in a device wafer (100) containing the control circuit, a lower cavity (120) with an opening exposed at a back side of the device wafer (100), forming a piezoelectric vibrator (500) on the back side of the device wafer (100) and electrically connecting the piezoelectric vibrator (500) to the control circuit (110) in the device wafer (100) from the back side of the device wafer (100). The crystal resonator is more compact in size, less power-consuming and easier to integrate with other semiconductor components with a higher degree of integration.

Piezoelectric transformer

A piezoelectric transformer that includes a base and an upper layer supported by the base. The upper layer includes a first piezoelectric layer that includes the portion of the upper layer that is interposed between an output electrode and an intermediate electrode, and a second piezoelectric layer that is superposed with the first piezoelectric layer and includes the portion of the upper layer interposed between the intermediate electrode and an input electrode in at least n vibration portions. Moreover, the input electrode includes multiple input electrode pieces and the output electrode includes multiple output electrode pieces. In addition, wiring lines are routed such that voltages of opposite phases can be respectively applied to a first input electrode piece group and a second input electrode piece group with the potential of the intermediate electrode serving as a reference.

Multi-Layer PZT Microactuator with Active PZT Constraining Layers for a DSA Suspension
20220199114 · 2022-06-23 ·

A PZT microactuator such as for a hard disk drive has a restraining layer bonded on its side that is opposite the side on which the PZT is mounted. The restraining layer comprises a stiff and resilient material such as stainless steel. The restraining layer can cover most or all of the top of the PZT, with an electrical connection being made to the PZT where it is not covered by the restraining layer. The restraining layer reduces bending of the PZT as mounted and hence increases effective stroke length, or reverses the sign of the bending which increases the effective stroke length of the PZT even further. The restraining layer can be one or more active layers of PZT material that act in the opposite direction as the main PZT layer. The restraining layer(s) may be thinner than the main PZT layer.

PIEZOELECTRIC ELEMENT AND METHOD FOR PRODUCING THE SAME

A piezoelectric element includes a piezoelectric layer, a first electrode layer, a second electrode layer, and a coupling electrode. At least a portion of the second electrode layer faces the first electrode layer with the piezoelectric layer interposed therebetween. The second electrode layer includes a coupling area. The coupling area meets a through hole in a region of the second electrode layer not facing the first electrode layer. The coupling electrode is on the coupling area. Between the coupling area and the surface of the second electrode layer on the piezoelectric layer side excluding the coupling area, the difference in position is about 5 nm or less.

Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device

A multilayer piezoelectric element includes a ceramic body formed by a piezoelectric ceramic, and having first and second end face facing a longitudinal direction, first and second principal faces facing a thickness direction perpendicular to the longitudinal direction. A pair of external electrodes cover the first and second end faces, extend from the first and second end faces onto the first principal face via ridge parts connecting the end faces with the principal faces, and project in the thickness direction on the first principal face. Multiple internal electrodes are stacked inside the ceramic body and are connected alternately to the pair of external electrodes along the thickness direction. A surface electrode is provided on at least one of the first and second principal faces, and connected to the external electrode different from the one to which the internal electrode adjacent in the thickness direction is connected.