A functionalized object includes at least one mechanical wave sensor providing the object with a vibration and deformation detection capability. The mechanical wave sensor comprises: a sensitive cell having a thickness less than or equal to 50 microns, and comprising an active layer made of a monocrystalline or polycrystalline piezoelectric material and two electrodes, which are in contact with the active layer and accessible at a first surface of the sensitive cell, and a support layer secured to the second surface of the sensitive cell and secured to the object. The functionalized object comprises at least two electrically conductive strips disposed on the first surface of the sensitive cell and on a surface of the object, each strip connecting an electrode to an electrical contact pad. A method is used for producing such a functionalized object.

A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.

A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.

A method for forming an electroactive device may include (i) depositing a curable material onto a primary electrode, (ii) curing the deposited curable material to form an electroactive polymer element comprising a cured elastomer material, and (iii) depositing an electrically conductive material onto a surface of the electroactive polymer element opposite the primary electrode to form a secondary electrode. The cured elastomer material may have a Poisson's ratio of between approximately 0.1 and approximately 0.35. Various other devices, methods, and systems are also disclosed.

A method of manufacturing a piezoelectric element of the present disclosure includes: a first film forming step of forming a first electrode at a substrate; a second film forming step of forming a first piezoelectric layer at the first electrode; a first processing step of patterning the first electrode and the first piezoelectric layer by etching; and a third film forming step of forming, after the first processing step, a second piezoelectric layer to cover the first electrode, the first piezoelectric layer, and the substrate.

A method of manufacturing a piezoelectric element of the present disclosure includes: a first film forming step of forming a first electrode at a substrate; a second film forming step of forming a first piezoelectric layer at the first electrode; a first processing step of patterning the first electrode and the first piezoelectric layer by etching; and a third film forming step of forming, after the first processing step, a second piezoelectric layer to cover the first electrode, the first piezoelectric layer, and the substrate.

In an embodiment, a multilayer piezoelectric element includes a multilayer piezoelectric body and multiple internal electrodes. The multilayer piezoelectric body has a pair of principal faces in a first-axis direction, a pair of end faces in a second-axis direction crossing at right angles with the first-axis direction and defining the longitudinal direction, and a pair of side faces in a third-axis direction crossing at right angles with the first-axis direction and second-axis direction. The multiple internal electrodes are placed inside the multilayer piezoelectric body and stacked in the first-axis direction. Among the multiple internal electrodes, a center internal electrode placed at the center part of the multilayer piezoelectric body is such that its first cross-sectional shape, as viewed from the third-axis direction, has undulations greater than the undulations of the second cross-sectional shape of the center internal electrode as viewed from the second-axis direction.

A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.

A laminated piezoelectric element has excellent suppression effect on characteristics deterioration caused by a pyroelectric effect. Inside an element main body are a first internal electrode, a piezoelectric layer, and a second internal electrode that has different polarity from the first internal electrode, which are repeatedly layered a plurality of times along the lamination direction. A first external electrode is formed on a first side surface of the element main body. A second external electrode is formed on a second side surface of the element main body. A resistance layer connected to the internal electrodes is formed in at least part of a third side surface of the element main body in which the internal electrodes are exposed. An insulating layer is formed on a third side of the element main body so as to cover the resistance layer.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The ceramic base body is formed by a piezoelectric ceramic. The pair of external electrodes cover a pair of end faces. The multiple internal electrodes are stacked inside the ceramic base body along a thickness direction crossing at right angles with a longitudinal direction, and connected alternately to the pair of external electrodes in the thickness direction. The surface electrodes are provided on a pair of principal faces, respectively, and are each connected to the external electrode different from the one to which the internal electrode adjacent in the thickness direction is connected. The pair of external electrodes have a higher porosity than the surface electrodes.