Patent classifications
H10N30/067
MICRO-VIBRATION SENSOR AND PREPARATION METHOD THEREOF
A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
Piezoelectric element and method for producing the same, liquid ejection head, and printer
A piezoelectric element including a first electrode provided above a base body, a first piezoelectric layer provided so as to be in contact with the base body and cover the first electrode, a second piezoelectric layer provided above the first piezoelectric layer, and a second electrode provided above the second piezoelectric layer, wherein the first piezoelectric layer includes a composite oxide that contains potassium and niobium and that has a perovskite-type structure containing potassium as a main component at an A-site, the second piezoelectric layer includes a composite oxide that contains potassium, sodium, and niobium and that has a perovskite-type structure, and the first piezoelectric layer has a higher potassium atomic concentration (atm %) than the second piezoelectric layer.
PIEZOELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
A piezoelectric composition according to the present invention comprising: a carbon, and a main component composed of an alkali metal niobate based compound. The amount of carbon contained is 350 to 700 ppm by weight.
METHOD AND SYSTEM FOR FABRICATING A PIEZOELECTRIC DEVICE
A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of clot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.
MICROPHONE DEVICE AND METHOD OF FORMING A MICROPHONE DEVICE
A microphone device may include: a substrate wafer, a support member bonded to a front surface of the substrate wafer, a single-crystal piezoelectric film provided over the support member, a top electrode and a bottom electrode. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The top electrode may be arranged adjacent to the first surface of the single-crystal piezoelectric film. The bottom electrode may be arranged adjacent to the second surface of the single-crystal piezoelectric film. The substrate wafer may have a through-hole formed therein. The through-hole of the substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.
FIRST-STAGE CERAMIC COLLECTIVE BOARD, SECOND-STAGE CERAMIC COLLECTIVE BOARD, MANUFACTURING METHOD FOR SECOND-STAGE CERAMIC COLLECTIVE BOARD, AND MANUFACTURING METHOD FOR MULTILAYER ELECTRONIC COMPONENT
Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.
MANUFACTURING METHOD OF MINIATURE FLUID ACTUATOR
A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.
Manufacturing method for multi-layer PZT microactuator having a poled but inactive PZT constraining layer
A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.
Force touch display panel, detection method thereof, and display apparatus
Embodiments of the present disclosure provide a force touch display panel, a detection method thereof, and a display apparatus. The force touch display panel includes: a substrate; a display structure disposed in a display area on the substrate; and a force common electrode layer, a piezoelectric material layer, and a force sense electrode layer, which are stacked in sequence over the display structure. The force sense electrode layer includes a force sense electrode configured for identifying different forces, and the force sense electrode additionally serves as a touch detection electrode configured for identifying a touch operation.
Unknown
An electromechanical device comprising: first and second electrodes each comprising a metal layer; an active layer comprising at least one ferroelectric polymer and disposed between the first and the second electrode. The first electrode and the second electrode each comprise an interface layer comprising poly(3,4-ethylenedioxythiophene). Each interface layer is interposed between the active layer and the corresponding metal layer. The invention further relates to a method for manufacturing such a device.