Disclosed is a method of manufacturing a piezoelectric thin film resonator on a non-silicon substrate, including the following steps: depositing a copper thin film on a silicon wafer; coating photoresist on the copper thin film to perform photoetching so as to remove photoresist in an air gap region under the piezoelectric thin film resonator to be disposed; electroplating-depositing a copper layer, and removing photoresist to obtain a stepped peel sacrifice layer; coating polyimide and performing imidization by heat treatment, making a sandwich structure of the piezoelectric thin film resonator above the polyimide layer; performing etching for the polyimide layer in a region not covered by the piezoelectric thin film resonator by oxygen plasma; placing the obtained device into a copper corrosion solution to dissolve the copper around and under the piezoelectric thin film resonator, attaching a drum coated with polyvinyl alcohol glue onto the piezoelectric thin film resonator, releasing and peeling it from the silicon wafer and then transferring it to a desired non-silicon substrate; washing the drum with hot water to separate the drum from the piezoelectric thin film resonator so as to complete the manufacturing process.

The present invention provides a method for electrohydrodynamic jet printing curved piezoelectric ceramics. First, a stable pressure is provided for a piezoelectric ceramic slurry to ensure that the slurry flows out from a nozzle at a fixed flow rate, and at the same time, an electric field is applied to the piezoelectric ceramic slurry at the nozzle to form a stable fine jet; then a curved substrate is fixed on a fixture of a curved substrate six-axis linkage module to ensure that the curved substrate is always perpendicular to the jet of the nozzle and keeps a constant distance from the nozzle during a printing process; fine jet drop on demand is realized through cooperative control of the changes of the curved substrate six-axis linkage module, the electric field and a flow field, and electrohydrodynamic jet printing and molding of curved piezoelectric ceramics is finally realized.

A method of manufacture and structure for a monolithic single chip single crystal device. The method can include forming a first single crystal epitaxial layer overlying the substrate and forming one or more second single crystal epitaxial layers overlying the first single crystal epitaxial layer. The first single crystal epitaxial layer and the one or more second single crystal epitaxial layers can be processed to form one or more active or passive device components. Through this process, the resulting device includes a monolithic epitaxial stack integrating multiple circuit functions.

The present invention provides a method for electrohydrodynamic jet printing curved piezoelectric ceramics. First, a stable pressure is provided for a piezoelectric ceramic slurry to ensure that the slurry flows out from a nozzle at a fixed flow rate, and at the same time, an electric field is applied to the piezoelectric ceramic slurry at the nozzle to form a stable fine jet; then a curved substrate is fixed on a fixture of a curved substrate six-axis linkage module to ensure that the curved substrate is always perpendicular to the jet of the nozzle and keeps a constant distance from the nozzle during a printing process; fine jet drop on demand is realized through cooperative control of the changes of the curved substrate six-axis linkage module, the electric field and a flow field, and electrohydrodynamic jet printing and molding of curved piezoelectric ceramics is finally realized.

The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.

In some embodiments, the present disclosure relates to a method for recovering degraded device performance of a piezoelectric device. The method includes operating the piezoelectric device in a performance mode by applying one or more voltage pulses to the piezoelectric device, and determining that a performance parameter of the piezoelectric device has a first value that has deviated from a reference value by more than a predetermined threshold value during a first time period. During a second time period, the method further includes applying a bipolar loop to the piezoelectric device, comprising positive and negative voltage biases. During a third time period, the method further includes operating the piezoelectric device in the performance mode, wherein the performance parameter has a second value. An absolute difference between the second value and the reference value is less than an absolute difference between the first value and the reference value.

An actuator assembly includes a primary electrode, a secondary electrode overlapping at least a portion of the primary electrode, and an electroactive polymer layer disposed between the primary electrode and the secondary electrode, where the electroactive polymer layer includes a non-vertical (e.g., sloped) sidewall with respect to a major surface of at least one of the electrodes. The electroactive polymer layer may be characterized by a non-axisymmetric shape with respect to an axis that is oriented orthogonal to an electrode major surface.

A low noise piezoelectric sensor, such as a piezoelectric acoustic transducer, includes a first conductive layer, a second conductive layer, and a piezoelectric layer between the first conductive layer and the second conductive layer. The piezoelectric layer comprises aluminum scandium nitride (AlScN) having a scandium content of greater than 15%, in which the scandium content and an aluminum content comprises 100% of the aluminum scandium nitride. In this way, the piezoelectric layer (or the sensor including the piezoelectric layer) achieves a dissipation factor of less than about 0.1%.

A low noise piezoelectric sensor, such as a piezoelectric acoustic transducer, includes a first conductive layer, a second conductive layer, and a piezoelectric layer between the first conductive layer and the second conductive layer. The piezoelectric layer comprises aluminum scandium nitride (AlScN) having a scandium content of greater than 15%, in which the scandium content and an aluminum content comprises 100% of the aluminum scandium nitride. In this way, the piezoelectric layer (or the sensor including the piezoelectric layer) achieves a dissipation factor of less than about 0.1%.

In some embodiments, the present disclosure relates to a method in which a first set of one or more voltage pulses is applied to a piezoelectric device over a first time period. During the first time period, the method determines whether a performance parameter of the piezoelectric device has a first value that deviates from a reference value by more than a predetermined value. Based on whether the first value deviates from the reference value by more than the predetermined value, the method selectively applies a second set of one or more voltage pulses to the piezoelectric device over a second time period. The second time period is after the first time period and the second set of one or more voltage pulses differs in magnitude and/or polarity from the first set of one or more voltage pulses.