Data is encoded for identification and labeling using a multitude of nano-electro-mechanical structures formed on a substrate. The number of such structures, their shapes, choice of materials, the spacing therebetween and the overall distribution of the structures result in a vibrational pattern or an acoustic signature that uniquely corresponds to the encoded data. A first group of the structures is formed in conformity with the design rules of a fabrication process used to manufacture the device that includes the structures. A second group of the structures is formed so as not to conform to the design rules and thereby to undergo variability as a result of the statistical variations that is inherent in the fabrication process.

A method of forming a monolithic integrated PMUT and CMOS with a coplanar elastic, sealing, and passivation layer in a single step without bonding and the resulting device are provided. Embodiments include providing a CMOS wafer with a metal layer; forming a dielectric over the CMOS; forming a sacrificial structure in a portion of the dielectric; forming a bottom electrode; forming a piezoelectric layer over the CMOS; forming a top electrode over portions of the bottom electrode and piezoelectric layer; forming a via through the top electrode down to the bottom electrode and a second via down to the metal layer through the top electrode; forming a second metal layer over and along sidewalls of the first and second via; removing the sacrificial structure, an open cavity formed; and forming a dielectric layer over a portion of the CMOS, the open cavity sealed and an elastic layer and passivation formed.

According to an embodiment, a micro-optical electromechanical device includes a body, a mirror element, and a spring structure configured to flexibly support the mirror element to the body. The spring structure includes at least one piezoelectric transducer adapted to induce in the spring structure a displacement that moves the mirror element.

A microelectronic device containing a piezoelectric thin film element is formed by oxidizing a top surface of a piezoelectric layer with an oxygen plasma, and subsequently forming an etch mask containing photoresist on the oxidized top surface. The etch mask is conditioned with an oven bake followed by a UV bake. The piezoelectric layer is etched using a three step process: a first step includes a wet etch of an aqueous solution of about 5% NH.sub.4F, about 1.2% HF, and about 18% HCl, maintaining a ratio of the HCl to the HF of about 15.0, which removes a majority of the piezoelectric layer. A second step includes an agitated rinse. A third step includes a short etch in the aqueous solution of NH.sub.4F, HF, and HCl.

A single crystal acoustic electronic device. The device has a substrate having a surface region. The device has a first electrode material coupled to a portion of the substrate and a single crystal capacitor dielectric material having a thickness of greater than 0.4 microns and overlying an exposed portion of the surface region and coupled to the first electrode material. In an example, the single crystal capacitor dielectric material is characterized by a dislocation density of less than 10.sup.12 defects/cm.sup.2. A second electrode material is overlying the single crystal capacitor dielectric material.

An ultrasonic sensor includes: when two orthogonal axes are referred to as an X axis and a Y axis and a plane formed by the X axis and the Y axis is referred to as an XY plane, a substrate disposed across the XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are closed and that has a first surface on the substrate side and a second surface facing the first surface; and a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space, and that transmits/receives an ultrasonic wave. At least some of the spaces are arranged to form a zigzag shape.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A method of manufacturing a piezoelectric element includes: forming a patterned mask layer over a substrate, in which the patterned mask layer has an opening exposing a portion of the substrate; forming a piezoelectric element in the opening; and removing the patterned mask layer to obtain the piezoelectric element, in which the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion.

The disclosure is and includes at least an apparatus, system and method for manufacturing piezoelectrics. The apparatus, system and method may include at least a first roller and an end roller; a continuous printable substrate roll extending at least from the first roller to the end roller as the first and end roller turn; at least one printer for printing piezoelectric material onto the continuous substrate roll to form a plurality of the piezoelectrics; and an electric field generator that polls the piezoelectric material as the continuous substrate roll is rolled from the first roller to the end roller. The polling electric field generator may comprise a corona field generator.

A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.