The present disclosure provides a power generator, its manufacturing method, and an electronic device utilizing the power generator as its power source. The power generator includes a deformation unit and a piezoelectric unit. The deformation unit is coupled to the piezoelectric unit; and the deformation unit comprises a conductive polymer, which is configured to deform upon contacting moisture to thereby apply a mechanical force to the piezoelectric unit to thereby generate electricity.

A transparent ultrasonic transducer device includes a transparent substrate, one or more transparent conductors, and a patterned piezoelectric material layer or, alternatively, a transparent piezoelectric film and one or more transparent conductors, wherein the piezoelectric layer is formed on essentially an entire transparent substrate surface, including a central area of the transparent substrate.

A piezoelectric device includes a base with a cavity and a vibration layer on an upper side of the base and including a fixed portion fixed to the base and a membrane portion extending from the fixed portion over the cavity, the vibration layer includes a lower electrode layer connected to the base, a piezoelectric layer on an upper side of the lower electrode layer, and an upper electrode layer on an upper side of the piezoelectric layer. The piezoelectric layer is between the upper and lower electrode layers in at least a portion of the membrane portion. A first pad electrode is on an upper side of the upper electrode layer, a second pad electrode is on the upper side of the lower electrode layer, and a first conductor layer is on the upper side and spaced away from at least one of the first and second pad electrodes.

A piezoelectric device includes a base with a cavity and a vibration layer on an upper side of the base and including a fixed portion fixed to the base and a membrane portion extending from the fixed portion over the cavity, the vibration layer includes a lower electrode layer connected to the base, a piezoelectric layer on an upper side of the lower electrode layer, and an upper electrode layer on an upper side of the piezoelectric layer. The piezoelectric layer is between the upper and lower electrode layers in at least a portion of the membrane portion. A first pad electrode is on an upper side of the upper electrode layer, a second pad electrode is on the upper side of the lower electrode layer, and a first conductor layer is on the upper side and spaced away from at least one of the first and second pad electrodes.

A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.

The present invention relates to a piezoelectric sensor manufacturing method, and the piezoelectric sensor manufacturing method according to the present invention includes the steps of: forming a mold in the form of a sensor array pattern including a plurality of grooves by etching a semiconductor substrate; injecting and sintering a piezoelectric material in the grooves; forming piezoelectric rods in the form of a sensor array pattern by etching the semiconductor substrate to protrude the piezoelectric material, i.e., etching to protrude a first area at one side of the pattern; forming an insulation layer by filling an insulation material in the semiconductor substrate; flattening the insulation layer until the piezoelectric material is exposed; forming a first electrode on a first surface of the piezoelectric material and the insulation layer; bonding a dummy substrate on the semiconductor substrate on which the first electrode is formed; flattening a second surface of the semiconductor substrate until the piezoelectric material is exposed; forming a second electrode on a second surface of the piezoelectric material; and exposing the first electrode by etching the first area.

A piezoelectric device that includes a sintered body in which a first conductor portion and a second conductor portion are disposed on both principal surfaces of a piezoelectric ceramic base body. The first conductor portion includes conductive films having a predetermined pattern. An insulating film is formed on the principal surface of the piezoelectric ceramic base body on which the conductive films are disposed such that portions of the conductive films are exposed therethrough. The insulating film has a malleability equal to or greater than that of the conductive films.

A piezoelectric actuator that includes (a) a piezoelectric body made of piezoelectric ceramic, the piezoelectric body having two principal surfaces facing each other and having four side surfaces, (b) external electrodes on the principal surfaces, (c) recessed portions in the four side surfaces, and (d) a coating layer made of resin and provided on the four side surfaces. The coating layer covers the recessed portions in the four side surfaces.

A microacoustic component includes a functional acoustic region, an inner marginal region and an outer marginal region. The cover covers the functional acoustic region and has a thin film and a bearing surface. The inner marginal region is acoustically coupled to the functional acoustic region and the bearing surface bears directly at least on a part of the inner marginal region.

A functional ink that includes a precursor sol-gel solution and a solvent is provided. The precursor sol-gel solution is used for forming an oxide dielectric film having a perovskite structure represented by a general formula ABO.sub.3, and has been subjected to a partial hydrolysis process in which a viscosity change resulting from the partial hydrolysis process is controlled to be less than or equal to 50%, and water contained in the precursor sol-gel solution is controlled to be greater than or equal to 0.50 times and less than or equal to 10 times by molar ratio with respect to a B site atom contained in the precursor sol-gel solution. The functional ink has a metal oxide concentration and a viscosity that renders the functional ink suitable for being discharged from a nozzle of a liquid droplet discharge apparatus included in a thin film fabrication apparatus.