A sensor for obtaining downhole data includes a first piezoelectric layer. The sensor also includes a second piezoelectric layer having a trench extending a depth below a surface of the second piezoelectric layer. The sensor also includes an electrode positioned within the trench. The first piezoelectric layer is directly coupled to the second piezoelectric layer.

An optical scanning device includes a mirror and a drive beam. The drive beam includes a piezoelectric portion. The piezoelectric portion is partitioned by a plurality of first grooves into a plurality of piezoelectric bodies. The piezoelectric bodies are reduced in length in an X-axis direction as the piezoelectric bodies approach one end side connected to an anchor. The piezoelectric bodies are reduced in length in the X-axis direction as the piezoelectric bodies approach the other end side connected to a link beam.

Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.

Microelectromechanical systems (MEMS) mesh-membrane nebulizers are described. The MEMS mesh-membrane nebulizers may include a piezoelectric MEMS mesh membrane. The piezoelectric MEMS mesh membrane may include a piezoelectric active layer patterned with openings for making droplets. One electrode of the piezoelectric MEMS mesh membrane may serve as an electrode for electroplating. Activation of the piezoelectric MEMS mesh membrane may generate droplets suitable for delivery of medicines or other uses.

The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

In a piezoelectric device, a piezoelectric driving portion includes layers and is directly or indirectly supported by a base portion. The piezoelectric driving portion includes a piezoelectric layer, an upper electrode layer, and a lower electrode layer. The upper electrode layer is disposed on the upper side of the piezoelectric layer. The lower electrode layer faces at least a portion of the upper electrode layer with the piezoelectric layer interposed therebetween. The piezoelectric driving portion includes a through groove extending through the piezoelectric driving portion in the vertical direction, so that a pair of inner side surfaces are provided. The pair of inner side surfaces each include a first small-width portion in which the width of the through groove decreases in a downward direction from an upper end surface of the piezoelectric layer.

An inductively coupled plasma dry etch process can obtain a deep etching profile in a piezoelectric material, such as lithium niobate, with minimum roughness and substantially vertical sidewalls. In addition, quality metal masks can be achieved by employing a hydrogen-plasma treatment prior to the processing steps. Periodic interruption steps can be included in the plasma dry etch procedure followed by a chemical cleaning between each cycle to avoid thermal effect and minimize byproduct redeposition during the long etching process. A deep etching profile in a piezoelectric material, such as a Sc.sub.xAl.sub.1-xN film, can be attained with minimum roughness and substantially vertical sidewalls using wet etching and a patterned mask, where the patterned mask is formed using another mask.

An inductively coupled plasma dry etch process can obtain a deep etching profile in a piezoelectric material, such as lithium niobate, with minimum roughness and substantially vertical sidewalls. In addition, quality metal masks can be achieved by employing a hydrogen-plasma treatment prior to the processing steps. Periodic interruption steps can be included in the plasma dry etch procedure followed by a chemical cleaning between each cycle to avoid thermal effect and minimize byproduct redeposition during the long etching process. A deep etching profile in a piezoelectric material, such as a Sc.sub.xAl.sub.1-xN film, can be attained with minimum roughness and substantially vertical sidewalls using wet etching and a patterned mask, where the patterned mask is formed using another mask.

The present disclosure provides a manufacturing method for a piezoelectric ceramic chip, a piezoelectric ceramic chip assembly and a display device. The manufacturing method includes: transferring a piezoelectric ceramic layer and a bottom electrode covering the piezoelectric ceramic layer formed on a substrate to a base plate, forming an insulating layer with an opening on the base plate, so that edges of the piezoelectric ceramic layer and the bottom electrode are covered by the insulating layer, and the piezoelectric ceramic layer is exposed from the opening; etching the base plate by immersing the base plate in an etching solution for etching a material of the bottom electrode; and forming a top electrode in the opening of the insulating layer, so that the top electrode is spaced apart from the insulating layer.

The present disclosure provides a manufacturing method for a piezoelectric ceramic chip, a piezoelectric ceramic chip assembly and a display device. The manufacturing method includes: transferring a piezoelectric ceramic layer and a bottom electrode covering the piezoelectric ceramic layer formed on a substrate to a base plate, forming an insulating layer with an opening on the base plate, so that edges of the piezoelectric ceramic layer and the bottom electrode are covered by the insulating layer, and the piezoelectric ceramic layer is exposed from the opening; etching the base plate by immersing the base plate in an etching solution for etching a material of the bottom electrode; and forming a top electrode in the opening of the insulating layer, so that the top electrode is spaced apart from the insulating layer.