H10N30/082

Step motor
11381145 · 2022-07-05 ·

A linear or rotary step motor for moving an object comprising: one or more beam actuators; and one or more auxiliary actuators. Each beam actuator comprises: (a) a flexible beam; (b) two holders holding the flexible beam from the beam edges; and (c) an actuator for moving the said at least one holder in order to bent the beam toward the object or to pull the beam away from the object. The axillary actuators are connected to the one or more beam actuators. The beam actuators configured to grip or release the object, and the one or more beam actuators perform a movement step to the object by first grip the object by the one or more beam actuators then push the object by activating the auxiliary actuator.

Method For Manufacturing Vibration Element

A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

ACOUSTIC WAVE TRANSDUCING UNIT, METHOD FOR MANUFACTURING THE SAME AND ACOUSTIC WAVE TRANSDUCER
20220314277 · 2022-10-06 ·

There are provided an acoustic wave transducing unit and a method for manufacturing the same, and an acoustic wave transducer. The acoustic wave transducing unit includes: a substrate; a first electrode on the substrate; a supporting portion on a side of the first electrode away from the substrate; a diaphragm layer on a side of the supporting portion away from the substrate; a release hole penetrating through at least the diaphragm layer; the supporting portion, the diaphragm layer and the first electrode define a vibration chamber, the vibration chamber is communicated with the release hole, the supporting portion is lattice-matched with the first electrode, the supporting portion is lattice-matched with the diaphragm layer; a material of the supporting portion can be decomposed into a metal simple substance and a gas under an action of laser; Photon Energy of the supporting portion is smaller than that of the diaphragm layer.

PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD OF THE SAME

A piezoelectric device includes a conductive adhesive, a container, and an AT-cut crystal element. The AT-cut crystal element has at least one side surface intersecting with a Z′-axis of the crystallographic axis of the crystal constituted of three surfaces. When a dimension of a straight-line portion along the Z′-axis of a second side opposed to the first side is expressed as W1 and a dimension along the Z′-axis of the AT-cut crystal element is expressed as W0, W1/W0 is 0.91 or greater, and the straight-line portion has both sides constituting corner portions in approximately right angles with sides along an X-axis of the crystal of the AT-cut crystal element. The side of the first side is at a −X-side in an X-axis of the crystallographic axis of the crystal and a side of the second side is at a +X-side in the X-axis.

Method for processing a lithium tantalate crystal substrate

A method for processing a lithium tantalate crystal substrate includes providing a lithium tantalate crystal substrate, roughening the lithium tantalate crystal substrate, providing a catalytic agent, bringing the lithium tantalate crystal substrate and the catalytic agent into contact with each other after the lithium tantalate crystal substrate is roughened, and subjecting the lithium tantalate crystal substrate to a reduction treatment. The reduction treatment is conducted at a temperature not higher than a Curie temperature of the lithium tantalate crystal substrate. The catalytic agent is selected from the group consisting of metal powder, metal gas, and metal carbonate powder.

Piezoelectric device, piezoelectric vibrating piece, and method for manufacturing piezoelectric vibrating piece

A piezoelectric device includes a piezoelectric vibrating piece and a container. The piezoelectric vibrating piece has a rectangular planar shape and has a portion of a first side secured to the container. The piezoelectric vibrating piece has a second side opposing the first side and includes a projecting portion that projects outward from the second side in at least one of proximity of both ends of the second side along the second side.

ANALYSIS DEVICE
20220113236 · 2022-04-14 ·

An analysis device that includes a piezoelectric substrate having a pair of opposing principal surfaces; a groove disposed in one of the principal surfaces of the piezoelectric substrate and that forms a flow passage through which an analysis target flows; a first electrode disposed in at least a portion of a space inside the groove; and a second electrode disposed on another of the principal surfaces of the piezoelectric substrate so as to oppose the first electrode with the piezoelectric substrate disposed therebetween. A projection projects from a bottom surface of the groove, and at least one of the first electrode and an adsorption material is provided in a region extending from the bottom surface of the groove portion to a side surface of the projection.

Microelectronic assemblies having substrate-integrated perovskite layers

Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.

Acoustofluidic components and process for their preparation

Acoustofluidic components in which at least one microfluidic element and at least one acoustic transducer element are arranged on a piezoelectric substrate and/or on a piezoelectric layer on a non-piezoelectric substrate and/or on a non-piezoelectric substrate on a piezoelectric layer. The at least one microfluidic element is arranged in at least one propagation direction of an acoustic wave excited by the acoustic transducer element and the at least one microfluidic element prepared at least partially by lamination and photolithographic structuring comprises a base, walls and a top. At least the top is prepared by lamination and photolithographic structuring, and the microfluidic element has top thicknesses of 0.01 to 10 times the wavelength of the acoustic wave excited by the acoustic transducer element.

Thin-film piezoelectric-material element, method of manufacturing the same, head gimbal assembly and hard disk drive
11289641 · 2022-03-29 · ·

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface.