Patent classifications
H10N30/085
Method for making electrical contact with an electronic component in the form of a stack, and electronic component having a contact-making structure
A method is provided for making electrical contact with an electronic component in the form of a stack formed from a plurality of material layers, which react upon application of an electric field, and a plurality of electrode layers, wherein each material layer is arranged between two of the electrode layers. An insulation structure is generated on at least one stack circumferential region of the stack, which exposes each second electrode layer of the at least one stack circumferential region for electrical contact to be made. Also, a contact-making structure is applied to the at least one stack circumferential region which is provided with the insulation structure. Before the step of generating the contact-making structure, the material layers are partially removed by a material-removing method such that the electrode layers are exposed close to the surface.
Method for manufacturing liquid ejecting head
A method for manufacturing a liquid ejecting head including a laminate formed of a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, a first electrode, a piezoelectric layer, and a second electrode, the method including stacking the first electrode, the piezoelectric material, the second electrode, and a reinforcing member on top of one another to form a laminate; heating the laminate to form a piezoelectric layer made of the piezoelectric material; bonding the laminate to the flow path substrate on a first electrode side; and removing the reinforcing member.
Method Of Bonding A Piezoelectric Ultrasonic Transducer
A method of bonding an electrode of a piezoelectric ultrasonic transducer to an electrically conductive layer of a support substrate, in order to support the piezoelectric ultrasonic transducer and establish an electrical connection between the electrode and the electrically conductive layer. The method includes: roughening the surface of one or both of the electrode and the electrically conductive layer; applying an adhesive to one or both of the electrode and the electrically conductive layer; assembling the electrode and the electrically conductive layer; and curing the adhesive. An assembly, an ultrasonic flow meter, and surface mount technology assembly is also disclosed.
Method of making an actuator for a resonant acoustic pump
A method of making an actuator for a resonant acoustic pump comprises: forming a through-hole in a ceramic material of a piezoelectric layer of the actuator, prior to assembly of the piezoelectric layer with other layers of the actuator; forming a through-hole in a flexible circuit layer of the actuator; forming a through-hole in an end plate layer of the actuator; and disposing each of the piezoelectric layer and the end plate layer on a respective one of opposite sides of the flexible circuit layer, so that the through-holes align to provide a passageway for a fluid to pass through the actuator.
Method of making an actuator for a resonant acoustic pump
A method of making an actuator for a resonant acoustic pump comprises: forming a through-hole in a ceramic material of a piezoelectric layer of the actuator, prior to assembly of the piezoelectric layer with other layers of the actuator; forming a through-hole in a flexible circuit layer of the actuator; forming a through-hole in an end plate layer of the actuator; and disposing each of the piezoelectric layer and the end plate layer on a respective one of opposite sides of the flexible circuit layer, so that the through-holes align to provide a passageway for a fluid to pass through the actuator.
Piezoelectric vibration element, piezoelectric resonator unit, and electronic device
A piezoelectric vibration element includes a piezoelectric piece having a main surface; an excitation electrode disposed on the main surface of the piezoelectric piece; and a connection electrode disposed on the main surface of the piezoelectric piece and electrically connected to the excitation electrode, wherein when the main surface of the piezoelectric piece is viewed in a plan, the piezoelectric piece has a through-hole in an area between the excitation electrode and the connection electrode, and wherein an internal wall of the through-hole located closer to the excitation electrode has at least four slopes.
Piezoelectric vibration element, piezoelectric resonator unit, and electronic device
A piezoelectric vibration element includes a piezoelectric piece having a main surface; an excitation electrode disposed on the main surface of the piezoelectric piece; and a connection electrode disposed on the main surface of the piezoelectric piece and electrically connected to the excitation electrode, wherein when the main surface of the piezoelectric piece is viewed in a plan, the piezoelectric piece has a through-hole in an area between the excitation electrode and the connection electrode, and wherein an internal wall of the through-hole located closer to the excitation electrode has at least four slopes.
METHOD OF MAKING AN ACTUATOR FOR A RESONANT ACOUSTIC PUMP
A method of making an actuator for a resonant acoustic pump comprises: forming a through-hole in a ceramic material of a piezoelectric layer of the actuator, prior to assembly of the piezoelectric layer with other layers of the actuator; forming a through-hole in a flexible circuit layer of the actuator; forming a through-hole in an end plate layer of the actuator; and disposing each of the piezoelectric layer and the end plate layer on a respective one of opposite sides of the flexible circuit layer, so that the through-holes align to provide a passageway for a fluid to pass through the actuator.
METHOD OF MAKING AN ACTUATOR FOR A RESONANT ACOUSTIC PUMP
A method of making an actuator for a resonant acoustic pump comprises: forming a through-hole in a ceramic material of a piezoelectric layer of the actuator, prior to assembly of the piezoelectric layer with other layers of the actuator; forming a through-hole in a flexible circuit layer of the actuator; forming a through-hole in an end plate layer of the actuator; and disposing each of the piezoelectric layer and the end plate layer on a respective one of opposite sides of the flexible circuit layer, so that the through-holes align to provide a passageway for a fluid to pass through the actuator.
Detachment chamber for detaching a piezoelectric layer from a donor substrate
A detachment chamber for detaching a piezoelectric layer from a piezoelectric donor substrate includes at least one chuck having at least one electrode configured to apply an electric field to the piezoelectric donor substrate to detach the piezoelectric layer from the piezoelectric donor substrate.