Patent classifications
H10N30/2041
Coupled MEMS resonator
A microelectromechanical resonator includes a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. The resonator element includes a plurality of adjacent sub-elements each having a length and a width and a length-to-width aspect ratio of higher than 1 and being adapted to a resonate in a length-extensional, torsional or flexural resonance mode. Further, each of the sub-elements is coupled to at least one other sub-element by one or more connection elements coupled to non-nodal points of the of said resonance modes of the sub-elements for exciting the resonator element into a collective resonance mode.
PIEZOELECTRIC VIBRATION MODULE AND HAPTIC FEEDBACK MODULE
A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.
Actuator and tactile sensation providing apparatus
An actuator includes a piezoelectric element, a vibration plate, a support, a holder, and first and second fixing portions. The vibration plate has the piezoelectric element joined thereto and bends and vibrates in accordance with expansion and contraction of the piezoelectric element. The support supports the vibration plate on a base to allow bending and vibration of the vibration plate. The holder holds an object of vibration to the vibration plate. The first fixing portion is coupled to the support and fixes the support to the base. The second fixing portion is coupled to the holder and fixes the object of vibration to the holder. The first and second fixing portions are each displaceable in a direction intersecting the direction of the expansion and contraction of the piezoelectric element.
Piezoelectric vacuum transistor
A vacuum transistor includes a substrate and a first terminal formed on the substrate. A piezoelectric element has a second terminal formed on the piezoelectric element, wherein the piezoelectric element is provided over the first terminal to provide a gap between the first terminal and the second terminal. The gap is adjusted in accordance with an electrical field on the piezoelectric element.
Inertial measurement unit calibration stage, method, and applications
A 6-degree of freedom (DOF) PZT actuator-based dither stage includes a 6-DOF PZT Z-cut bimorph actuator-based stage. A net motion sensor includes a 6-DOF PZT Z-cut bimorph actuator-based stage and a PZT Z-cut bimorph actuator-based sensing cantilever coupled to the stage to detect motion. Methods to detect inertial sensor fixed offset, bias, and net motion are disclosed.
Coupled MEMS resonator
A microelectromechanical resonator assembly includes a first rectangular resonator array and a second rectangular resonator array, where the first rectangular resonator array and the second rectangular resonator array each have at least two rectangular resonator sub-elements, and the at least two rectangular resonator sub-elements are coupled to each other by one or more connection elements, and the first rectangular resonator array and the second rectangular resonator array are coupled to each other by one or more connection elements.
Transducers with improved impedance matching
A transducer (140) having a mechanical impedance over an operative frequency range and having a desired power coupling (145) to a load over the operative frequency range comprises a piezoelectric device (141) having a frequency distribution of modes in the operative frequency range; and an overmould (143). The overmould (143) is arranged to surround at least part of the piezoelectric device (141); and the parameters of the overmould (143) are selected to provide a required impedance matching between the mechanical impedance of the transducer (140) and the mechanical impedance of the load. An alternative transducer comprises a mounting means for holding a discrete portion of at least a part of the periphery of the piezoelectric device wherein the parameters of the mounting means are selected to provide a required boundary condition for the periphery of the piezoelectric device whereby the desired power coupling between the transducer and the load is provided.
DEVICE AND METHOD FOR COATING SURFACES
The present invention relates to devices and methods for coating surfaces including surfaces of medical devices, in particular the coating of microprojections on microprojection arrays. The present invention also relates to print head devices and their manufacture and to methods of using the print head devices for manufacturing articles such as microprojection arrays as well as to coating the surfaces of microprojection arrays. The present invention also relates to high throughput printing devices that utilize the print heads of the present invention.
Vibrator and oscillator
A vibrator includes: a vibration element that includes a pair of first excitation electrodes formed at the first vibration portion, a pair of second excitation electrodes formed at the second vibration portion, and a pair of third excitation electrodes formed at the third vibration portion, in which one second excitation electrode of the pair of second excitation electrodes is formed at a first inclined surface that is inclined with respect to two main surfaces, and one third excitation electrode of the pair of third excitation electrodes is formed at a second inclined surface that is inclined with respect to the two main surfaces and the first inclined surface; and a package that houses the vibration element. The vibration element includes a fixing portion to be fixed to the package. The fixing portion is provided between the first vibration portion and the second and third vibration portions.
Vibrator Device
A vibrator device includes a base, a vibrator element, a support substrate configured to support the vibrator element, and at least three bonding members which are arranged on the support substrate at a distance from each other, and which are configured to bond the support substrate and the base to each other, wherein the support substrate has a thin-wall portion, and the thin-wall portion is arranged between a pair of the bonding members adjacent to each other at a distance smaller than a distance between another pair of the bonding members adjacent to each other.