H10N30/872

Wafer-Scale Piezoelectric Bio-Organic Thin Films
20220231218 · 2022-07-21 ·

A flexible piezoelectric thin film, and method of manufacture, has a polyvinyl alcohol (PVA)-glycine-PVA sandwich heterostructure. The thin film is manufactured by evaporating the solvent from a glycine-PVA mixture solution. The film automatically assembles into the PVA-glycine-PVA sandwich heterostructure as it is salted out. Strong hydrogen bonding between the oxygen atoms in glycine and hydroxyl groups on PVA chains are responsible for the nucleation and growth of the piezoelectric γ-glycine and alignment of the domain orientation.

Piezoelectric transducer

The invention concerns a piezoelectric transducer including: a conductive layer between first and second piezo-electric layers; first and third electrodes arranged on the front surface of the second piezoelectric layer; second and fourth electrodes arranged on the rear surface of the first piezoelectric layer; and a control circuit configured to: in a first operating phase, simultaneously apply a non-zero voltage to the first electrode, a non-zero voltage to the fourth electrode, and substantially zero voltages to the second and third electrodes; and in a second operating phase, simultaneously apply a non-zero voltage to the second electrode, a non-zero voltage to the third electrode, and substantially zero voltages to the first and fourth electrodes.

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND INTEGRATION METHOD THEREFOR
20210391528 · 2021-12-16 ·

An integrated structure of a crystal resonator and a control circuit (110) and an integrated method therefor. Integration of the crystal resonator with the control circuit (110) is accomplished by forming, in a device wafer (100) containing the control circuit, a lower cavity (120) with an opening exposed at a back side of the device wafer (100), forming a piezoelectric vibrator (500) on the back side of the device wafer (100) and electrically connecting the piezoelectric vibrator (500) to the control circuit (110) in the device wafer (100) from the back side of the device wafer (100). The crystal resonator is more compact in size, less power-consuming and easier to integrate with other semiconductor components with a higher degree of integration.

Piezoelectric material, piezoelectric element, vibration wave motor, optical apparatus, and electronic apparatus

A piezoelectric material which is low in load on the environment, and also satisfies both the requirements of a high piezoelectric constant and a high mechanical quality factor. The piezoelectric material comprises a plurality of crystal grains containing Ba, Ca, Ti, Zr, Mn, and O. An average equivalent circle diameter of the crystal grains is not smaller than 1.0 μm and not larger than 10 μm. The crystal grains include crystal grains A each having a first domain with a width of not smaller than 300 nm and not larger than 800 nm, and crystal grains B each having a second domain with a width of not smaller than 20 nm and not larger than 50 nm.

TRANSDUCER, METHOD OF MANUFACTURING TRANSDUCER, AND TRANSDUCING DEVICE

A transducer, a method of manufacturing a transducer, and a transducing device are provided. The transducer includes a receiving unit and a transmitting unit. The receiving unit includes a first receiving electrode, a first piezoelectric film, and a second receiving electrode which are sequentially stacked, and the receiving unit is configured to convert a first acoustic wave signal into an electrical signal by using a piezoelectric effect of the first piezoelectric film. The transmitting unit is configured to receive a control signal, which is based on the electrical signal, to transmit a second acoustic wave signal.

INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE

Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Piezoelectric transformer

A piezoelectric transformer that includes a base and an upper layer supported by the base. The upper layer includes a first piezoelectric layer that includes the portion of the upper layer that is interposed between an output electrode and an intermediate electrode, and a second piezoelectric layer that is superposed with the first piezoelectric layer and includes the portion of the upper layer interposed between the intermediate electrode and an input electrode in at least n vibration portions. Moreover, the input electrode includes multiple input electrode pieces and the output electrode includes multiple output electrode pieces. In addition, wiring lines are routed such that voltages of opposite phases can be respectively applied to a first input electrode piece group and a second input electrode piece group with the potential of the intermediate electrode serving as a reference.

PIEZOELECTRIC ELEMENT FOR SPEAKER AND MANUFACTURING METHOD THEREFOR

Provided are a piezoelectric element for a speaker and a method of manufacturing the same. The piezoelectric element for a speaker includes a plurality of piezoelectric ceramic layers stacked on one another in a thickness direction, and a plurality of electrodes provided to be connected to middle portions of sides of the plurality of piezoelectric ceramic layers along external walls of the plurality of stacked piezoelectric ceramic layers, wherein middle portions of some sides from among a plurality of sides of each of the plurality of piezoelectric ceramic layers are etched, and wherein the plurality of piezoelectric ceramic layers are stacked on one another in the thickness direction not to overlap non-etched sides from among the plurality of sides.

PIEZOELECTRIC ELEMENT
20220209097 · 2022-06-30 · ·

A piezoelectric element includes a laminate, a plurality of internal electrodes, and a plurality of external electrodes. The laminate includes a plurality of piezoelectric layers that is laminated. The laminate includes a pair of main faces facing away from each other in a laminating direction of the plurality of piezoelectric layers, a pair of end faces facing away from each other in a first direction crossing the laminating direction, and a pair of side faces facing away from each other in a second direction crossing the laminating direction and the first direction. The plurality of internal electrodes is disposed in the laminate to be laminated in the laminating direction. Each of the pair of main faces, the pair of end faces, and the pair of side faces is a polished surface that is polished. Each ridge portion of the laminate has a rounded chamfered shape.

PIEZOELECTRIC ELEMENT
20220209099 · 2022-06-30 · ·

A piezoelectric element includes a laminate and a first internal electrode. The laminate includes a pair of main faces, a pair of end faces, and a pair of side faces. The first internal electrode includes four electrode portions and a connector. The four electrode portions include a first pair of electrode portions and a second pair of electrode portions. The connector connects the first pair of electrode portions. The connector is spaced apart from each of the second pair of electrode portions by a first distance. Each of the four electrode portions includes a main electrode part. The main electrode part is spaced apart from the pair of end faces by a second distance. The main electrode part is spaced apart from the pair of side faces by a third distance. The first distance is longer than each of the second distance and the third distance.