An ultrasonic transducer of this invention includes a rigid substrate with opening parts extending between bottom and top surfaces, a flexible resin film fixed to the top surface of the substrate to cover the opening parts, and piezoelectric elements fixed to a top surface of the resin film so as to overlap in a plan view with the opening parts, respectively. An arrangement pitch of the piezoelectric elements is preferably set to be equal to or less than 4.3 mm, and the piezoelectric element may have a rectangular shape in the plan view having longitudinal and lateral dimensions in the plan view with a maximum value of 4.0 mm or less, a circular shape in the plan view having a diameter of 4.0 mm or less, or an elliptical shape in the plan view having a major axis of 4.0 mm or less.

Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip in which a pad barrier layer caps a pad of a piezoelectric device. The pad barrier layer is configured to block hydrogen ions and/or other errant materials from diffusing to the piezoelectric layer. Absent the pad barrier layer, hydrogen ions from hydrogen-ion containing processes performed after forming the pad may diffuse to the piezoelectric layer along a via extending from the pad to the piezoelectric device. By blocking diffusion of hydrogen ions and/or other errant materials to the piezoelectric device, the pad barrier layer may prevent delamination and breakdown of the piezoelectric layer. Hence, the pad barrier layer may prevent failure of the piezoelectric device.

An ultrasonic sensor includes a casing and a piezoelectric vibrator element. The casing includes a first unit made of a metal and a second unit made of a resin. The first unit has a cylindrical or substantially cylindrical shape extending in a first direction. The second unit is connected to one end of the first unit in the first direction and includes a cylindrical section and a bottom plate. The cylindrical section extends in the first direction. The bottom plate is a disk-shaped portion which closes an end of the cylindrical section positioned farther away from the first unit in the first direction. The piezoelectric vibrator element is mounted on the bottom plate.

A transduction unit of a non-contact human sleep physiological parameter detection sensor includes a circuit board, a piezoelectric film and conductive adhesives, wherein the piezoelectric film includes a film sheet and two electrodes, which are respectively arranged on two side faces of the film sheet; the piezoelectric film is attached to the circuit board; and the two electrodes of the piezoelectric film are respectively electrically connected to two exposed pad electrodes on the circuit board by means of the conductive adhesives.

A vibration device includes a piezoelectric element, a vibration member to which the piezoelectric element is bonded, and a wiring member connected with the piezoelectric element. A method for vibrating the vibration device includes inputting a signal including a fundamental frequency component to the piezoelectric element through the wiring member, and vibrating the vibration device in a vibration mode that includes the fundamental frequency component and does not approximately include a high order frequency component that is n times (n represents an integer of 2 or more) the fundamental frequency component. The fundamental frequency component is lower than the resonance frequency component of the vibration device.

An object of the present invention is to provide a piezoelectric element formed of a piezoelectric film including an electrode layer provided on each of both surfaces of a piezoelectric layer and a protective layer provided on the surface of the electrode layer, in which the electrode layer and a conductive member such as a lead wire can be connected to each other with high productivity and the resistance of the connection is also low. The object thereof is achieved by opening through-holes in the protective layer of the piezoelectric film and the conductive member, allowing both through-holes to at least partially overlap each other, filling the through-hole of the protective layer with a conductive filling member, and allowing the filling member to reach the through-hole of the conductive member.

A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.

A vibration structure that includes a film having a first electrode on a first main surface thereof, the first electrode defining a first connection region on the first main surface where the first electrode is not present, and the film is constructed to be deformed in a plane direction when a voltage is applied thereto; a frame-shaped member; a vibration portion surrounded by the frame-shaped member; a first connection member that connects the first main surface of the film to the frame-shaped member at the first connection region; a second connection member that connects the film to the vibration portion; and an extended electrode that is connected to the first electrode.

An elastic wave device includes a piezoelectric body including a main surface, an IDT electrode provided on the main surface of the piezoelectric body, and a wiring electrode provided on the main surface of the piezoelectric body and electrically connected to the IDT electrode, in which the wiring electrode includes a portion that extends to an edge of the main surface of the piezoelectric body, and a width of the wiring electrode on the edge is narrower than a width of the wiring electrode in a portion not on the edge.

The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.