A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.

A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.

Lattice structure with piezoelectric behavior characterized in that the lattice structure (1) comprises a periodic succession of unitary cells (10), wherein each unitary cell (10) is made of a dielectric material, is bending or torsion dominated and comprises nanometric structural connectors (11) connected to each other through nodes (12) defining a non-centrosymmetric shape having a topological constraint that induces torsion or bending of said structural connectors (11); and wherein the unitary cells (10) are connected to each other at least in series defining a continuous electric potential accumulation path with two opposed ends (2, 3), the unitary cells (10) being arranged within the lattice structure (1) in a non-centrosymmetric disposition accumulating and conducting without cancellation the electric gradient generated on each unitary cell (10) through the lattice structure (1) to said two opposed ends (2, 3).

An improved ultrasound apparatus and methods of use are provided, the apparatus comprising at least one ultrasound transducer electrically connected to another electrical component by a flexible electrical connection. In some embodiments, the other electrical component is a printed circuit board. In some embodiments, the flexible electrical connection may allow vertical, horizontal and/or tilting displacement of the ultrasound transducer with respect to the flexible circuit board while maintaining electrical connectivity. In some embodiments, the flexible electrical connection is capable of temporarily disconnecting when an excessive deformation force is applied and self-reconnecting after the excessive deformation force is removed.

A piezoelectric actuator includes: a diaphragm plate; a first electrode provided on or over the diaphragm plate; a piezoelectric substance layer provided on or over the first electrode; and a second electrode provided on or over the piezoelectric substance layer; wherein the piezoelectric substance layer includes a plurality of active portions sandwiched between the first electrode and the second electrode, either one of the first electrode and the second electrode is an individual electrode provided individually for each of the plurality of active portions, the other of the first electrode and the second electrode is a common electrode that is common to the plurality of active portions, and lead-out wiring is multiple-connected to the individual electrode.

A production method for a surface acoustic wave device comprises the following steps: a step of providing a piezoelectric substrate comprising a transducer arranged on the main front face; a step of depositing a dielectric encapsulation layer on the main front face of the piezoelectric substrate and on the transducer; and a step of assembling the dielectric encapsulation layer with the main front face of a support substrate having a coefficient of thermal expansion less than that of the piezoelectric substrate. In additional embodiments, a surface acoustic wave device comprises a layer of piezoelectric material equipped with a transducer on a main front face, arranged on a substrate support of which the coefficient of thermal expansion is less than that of the piezoelectric material. The transducer is arranged in a dielectric encapsulation layer, between the layer of piezoelectric material and the support substrate.

A crystal resonator includes: lower glass plates on which first electrodes are formed so as to extend from side surfaces to a bottom surface of the lower glass plates; a crystal plate which is provided over the lower glass plates and on which second electrodes to be coupled to the first electrodes are formed on a surface in contact with the lower glass plates; and an upper glass plate which is provided over the crystal plate; wherein the side surfaces of the lower glass plates on which the first electrodes are formed are provided with a protrusion that extends in parallel with a top surface and the bottom surface of the lower glass plates and that extends from one end to the other end of each of the side surfaces, and wherein the first electrodes are formed on the side surfaces that include surfaces of the protrusion.

An assembly comprising at least an electrical component mounted on a substrate. The component includes at least a first electrode and a second electrode. The substrate includes at least a first electrical conductor and a second electrical conductor. The first electrode is electrically connected to the first electrical conductor and the second electrode is electrically connected to the second electrical conductor. In a direction perpendicular to the substrate, the first electrode is located between the first electrical conductor and the second electrode. The second electrode is connected to the second electrical conductor by a connecting element extending between the second electrode and the second electrical conductor.

A package that includes a first filter comprising a first polymer, a substrate cap, a second filter comprising a second polymer frame, at least one interconnect, an encapsulation layer and a plurality of through encapsulation vias. The substrate cap is coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter. The second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter. The at least one interconnect is coupled to the first filter and the second filter. The encapsulation layer encapsulates the first filter, the substrate cap, the second filter, and the at least one interconnect. The plurality of through encapsulation vias coupled to the first filter.

A piezoelectric actuator array includes a substrate plate with a number of signal leads and at least one common lead, and a number of piezoelectric bodies arranged in a row on one surface of the substrate plate and formed by dividing a common piezoelectric block. The piezoelectric bodies include a number of active bodies each of which has, on a first side of the row, a signal electrode in contact with one of the signal leads and, on an opposite second side of the row, a common electrode in contact with the common lead. The substrate plate has at least one connector lead disposed on the first side of the row and electrically connected to the common lead on the second side of the row. At least one piezoelectric body has a conductive outer surface layer that establishes an electrically conductive path from the connector lead to the common lead.