A piezoelectric transducer device includes a support, a piezoelectric element, a first connecting element and a second electrical connecting element, the piezoelectric element being carried by the support and each of the first and second electrical connecting elements being electrically connected, respectively, to a first area and a second area, distinct from the first area, of the piezoelectric element, the piezoelectric element including a lower face opposite the support and an upper face, opposite to the lower face, wherein the upper face is integrally exposed or is covered, partially or not, only with the second electrical connecting element.

A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

The present disclosure provides a haptic feedback base plate, a haptic feedback apparatus and a haptic feedback method. The haptic feedback base plate comprises: a substrate and a deformation unit disposed on one side of the substrate. The deformation unit comprises a first electrode, a piezoelectric material layer and a second electrode that are arranged in a stacked manner, the first electrode is arranged close to the substrate, the first electrode and the second electrode are configured to form an alternating electric field, and the piezoelectric material layer vibrates under the effect of the alternating electric field and drives the substrate to resonate, wherein a difference between a frequency of the alternating electric field and an inherent frequency of the substrate is less than or equal to a preset threshold.

A piezoelectric substrate attachment structure including a press section pressed by contact, a piezoelectric substrate provided adjacent to the press section, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. The following relationship Equation (a) is satisfied:
da/E′a<db/E′b  (a) wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.

A production method for a surface acoustic wave device comprises the following steps: a step of providing a piezoelectric substrate comprising a transducer arranged on the main front face; a step of depositing a dielectric encapsulation layer on the main front face of the piezoelectric substrate and on the transducer; and a step of assembling the dielectric encapsulation layer with the main front face of a support substrate having a coefficient of thermal expansion less than that of the piezoelectric substrate. In additional embodiments, a surface acoustic wave device comprises a layer of piezoelectric material equipped with a transducer on a main front face, arranged on a substrate support of which the coefficient of thermal expansion is less than that of the piezoelectric material. The transducer is arranged in a dielectric encapsulation layer, between the layer of piezoelectric material and the support substrate.

A display apparatus is disclosed. The display apparatus includes a display panel, a piezoelectric vibration unit attached to a rear surface of the display panel, and a member attached to at least one of a rear surface of the piezoelectric vibration unit and a portion of the rear surface of the display panel that surrounds the piezoelectric vibration unit. The display apparatus includes a display panel, a damping member attached to a rear surface of the display panel, and a piezoelectric vibration unit attached to a rear surface of the damping member.

Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.

Provided is an electronic device in which penetrating wires can be formed easily. The electronic device includes a sealing plate 33 having a first surface 41 to which a pressure chamber-forming plate 29 is connected and a second surface 42 which is on a side opposite from the first surface 41 and on which a drive IC 34 is provided; bump electrodes 40 which are arranged in a nozzle row direction on the first surface 41 of the sealing plate 33 and which output signals to piezoelectric elements 32; individual connection terminals 54 which are arranged in the nozzle row direction on the second surface 42 of the sealing plate 33 and to which the signals are inputted, wherein wires each of which connects one of the bump electrodes 40 to one of the individual connection terminals 54 corresponding to the bump electrode 40 each include a penetrating wire 45 formed inside a through hole 45a penetrating the sealing plate 33 and made of a conductor, the penetrating wires 45 are formed at positions away from the bump electrodes 40 or the individual connection terminals 54 in a direction perpendicular to the nozzle row direction, and each two of the penetrating wires 45 adjacent in the nozzle row direction are arranged at different positions in the direction perpendicular to the nozzle row direction.

Provided are a polymer composite piezoelectric body in which the conversion efficiency between electricity and sound is increased and thus the sound pressure level is improved, an electroacoustic transduction film, and an electroacoustic transducer. The polymer composite piezoelectric body includes a viscoelastic matrix formed of a polymer material having a cyanoethyl group, piezoelectric body particles which are dispersed in the viscoelastic matrix and have an average particle diameter of more than or equal to 2.5 μm, and dielectric particles dispersed in the viscoelastic matrix, in which the dielectric particles are formed of a material different from that of the piezoelectric body particles and have an average particle diameter of less than or equal to 0.5 μm and a relative permittivity of more than or equal to 80.

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.