A structure of an integrated crystal oscillator package has a first quartz crystal resonator, a second quartz crystal resonator, and application-specific integrated circuit chip (ASIC) combined in a package. The ASIC has a switch control for receiving audio formats of 44.1 kHz and 48 kHz with different hi-fidelity (hi-fi). The first quartz crystal resonator has a first clock rate corresponding to the 44.1 kHz frequency and the second quartz crystal resonator has a second clock rate corresponding to the 48 kHz frequency to be switched by the present invention in operation.

A package that includes a first filter comprising a first polymer, a substrate cap, a second filter comprising a second polymer frame, at least one interconnect, an encapsulation layer and a plurality of through encapsulation vias. The substrate cap is coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter. The second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter. The at least one interconnect is coupled to the first filter and the second filter. The encapsulation layer encapsulates the first filter, the substrate cap, the second filter, and the at least one interconnect. The plurality of through encapsulation vias coupled to the first filter.

A piezoelectric element includes a laminate including first and second piezoelectric layers with respective polarization directions in a thickness direction and an elastic layer provided between the first piezoelectric layer and the second piezoelectric layer, first and second terminal electrodes that are provided on an external surface of the laminate, a first detection electrode provided on a positive polar surface of the first piezoelectric layer, a second detection electrode provided on a negative polar surface of the first piezoelectric layer, a third detection electrode provided on a positive polar surface of the second piezoelectric layer, and a fourth detection electrode provided on a negative polar surface of the second piezoelectric layer. The first detection electrode and the fourth detection electrode are connected to the first terminal electrode. The second detection electrode and the third detection electrode are connected to the second terminal electrode.

A piezoelectric actuator includes a housing body and lid wherein the housing body defines an open-ended cylindrical interior chamber extending along a displacement axis. The lid bolts to the body transverse to the open end allowing easy access to an electrostrictive assembly disposed within the chamber. The electrostrictive assembly includes an electrostrictive element affixed at one end to the housing by a cup element with an outermost cylindrical surface, and at an opposite, and free, end, to a driver having a portion with a outermost cylindrical surface. The outermost cylindrical surfaces both include circumferential sealing elements, for example, circumferential grooves in which resilient a sealing O-ring resides, or circumferential wiper seals. The assembly is dimensioned to fit wholly within the chamber, with the circumferential sealing elements establishing a hermetic seal while allowing sliding motion of the free end of the electrostrictive element, and the driver, along the displacement axis.

This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion (13) by bending the clad material.

A force sensor having a noise shielding layer is disclosed. For a first embodiment, a top noise shielding layer is configured on a top surface of a force sensor to screen noise signals which are caused by human body's touch or approaching from top of the force sensor. For a second embodiment, a bottom noise shielding layer is configured on a bottom surface of the force sensor to screen noise signals which are caused by human body's touch or approaching from bottom of the force sensor.

The present disclosure relates to an ultrasound transducer and a control method thereof. More particularly, the present disclosure is related to an ultrasound transducer for facilitating waste clearance of the brain lymphatic system and a control method thereof. A transducer according to the present disclosure includes: an oscillator including a plurality of Piezoelectric materials, and a polymer encompassing the plurality of Piezoelectric materials, and irradiating an ultrasound using at least one of the plurality of Piezoelectric materials and the polymer; a lens having a first space where at least a part of the oscillator is inserted, and focuses the applied ultrasound; and a housing supporting connection between the oscillator and the lens, wherein a height of the oscillator is longer than a height of the first space, a first height difference between the height of the oscillator and the height of the first space is inverse proportion to overall height of the lens, and a width of the oscillator is smaller than a width of the first space.

Provided are an electroacoustic transduction film in which conversion between a vibration and a voltage is able to be appropriately performed without the occurrence of dielectric breakdown of the air between upper and lower thin film electrodes even when a high voltage is applied therebetween, a user is able to be prevented from coming into contact with a piezoelectric layer, and high productivity is achieved, and a manufacturing method of an electroacoustic transduction film. A piezoelectric layer which stretches and contracts in response to a state of an electric field, an upper thin film electrode formed on one principal surface of the piezoelectric layer, a lower thin film electrode formed on the other principal surface of the piezoelectric layer, an upper protective layer formed on the upper thin film electrode, and a lower protective layer formed on the lower thin film electrode are included, and a groove which penetrates the thin film electrode and the protective layer is formed in at least a portion of an outer peripheral portion in a surface direction of at least one of the upper thin film electrode and the upper protective layer, or the lower thin film electrode and the lower protective layer.

A micromechanical component having a substrate which includes a micro-electromechanical microphone structure, the micro-electromechanical microphone structure encompassing at least one piezoelectric layer and at least one polymer mass as at least part of a packaging of the substrate fitted with the micro-electromechanical microphone structure, which is in contact with at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure. A method is also described for packaging a substrate having a micro-electromechanical microphone structure encompassing at least one piezoelectric layer by developing at least a portion of a packaging of the substrate fitted with the micro-electromechanical microphone structure from at least one polymer mass, and the at least one polymer mass being applied directly on at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.