A superconductive wire conductor is produced by: embedding a plurality of deposition substrates formed to have a predetermined size in parallel with each other to a connection base material to connect and integrate therewith; depositing an intermediate layer, a superconductive layer and a protective layer on a deposition surface side of the deposition substrate; and winding a single or multiple integrated superconductive conductors around a desired core material, separating each single superconductive wire from the integrated superconductive conductor and winding each superconductive wire around the core material or winding the integrated or separated wire alternately, whereby a superconductive conductor having a good superconductive characteristic without a problem regarding a shape thereof such as local protrusions.

Methods and devices for producing a superconductive conductor are disclosed. The method includes providing a plurality of conductive strips by means of a strip provision device, applying liquid soldering agent onto the plurality of conductive strips, stacking the conductive strips wetted with soldering agent, and forming a superconductive body by machining the strip stack.

The present invention relates to a superconducting wire having improved electrical and physical properties.

An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 ?m.

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

Reinforced materials for high temperature superconducting tape. More specifically reinforcement materials for significantly reducing the amount of required reinforcement and attaining much higher stress tolerances at practical conductor dimensions are described herein.

In a method of manufacturing an oxide superconducting wire, a superconducting laminated body is prepared, a tape-shaped stabilizer is folded to be divided into a first portion in which the stabilizer covers one surface of the superconducting laminated body in a thickness direction and a second portion in which the stabilizer covers both side surfaces of the superconducting laminated body in a widthwise direction and the stabilizer is disposed around the superconducting laminated body, the first portion is formed to have a width larger than that of the superconducting laminated body using a molding jig and the superconducting laminated body is covered with the stabilizer, and the superconducting laminated body and the stabilizer are bonded and a bonding material between the second portion and the superconducting laminated body is formed to have a thickness larger than that of a bonding material between the first portion and the superconducting laminated body.

The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.

In one embodiment a superconductor tape includes a substrate comprising a plurality of layers, an oriented superconductor layer disposed on the substrate, and an alloy coating disposed upon the superconductor layer, the alloy coating comprising one or more metallic layers in which at least one metallic layer comprises a metal alloy.

Various fabrication methods are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is in direct contact with a semiconductor structure on the substrate, the semiconductor structure comprising at least one nanowire. The beam has a non-zero angle of incidence relative to the normal of the plane of the substrate such that the beam is incident on one side of the protruding structure, thereby preventing a portion of the nanowire in a shadow region adjacent the other side of the protruding structure in the plane of the substrate from being covered with the material.