Patent classifications
H01B3/305
Assembly and method for sealing a bundle of wires
A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa.Math.s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.
Communication cables incorporating twisted pair separators with cooling channels
Twisted pair cables incorporated separators with cooling channels are described. A cable may include a plurality of twisted pairs of individually insulated electrical conductors, and a separator extending lengthwise along a longitudinal length of the cable may be positioned between at least two of the plurality of twisted pairs. The separator may include a flexible body configured to maintain the at least two pairs in a predetermined configuration. A first channel extending lengthwise may define a longitudinal cavity through the separator, and at least one second channel may extend from the first channel through the flexible body to an outer surface of the separator. Additionally, the cable may include a jacket formed around the plurality of twisted pairs and the separator.
Deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact
The present invention generally relates to deformable polymer composites, and more particularly to, deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact. According to embodiments, a deformable elastomeric conductive material includes: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically or thermally conductive. The conductive filler material comprises a plurality of substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain.
Method Of Enhancing Surface Electrical Conductivity Of Conductive Plastics And Conductive Plastic Films Produced Thereby
A method of enhancing surface electrical conductivity of an article formed of a conductive polymer material, such as a conductive polymer film, includes the step of providing an article formed of a conductive polymer. The conductive polymer is made up of a dielectric polymeric material and conductive fibers. A desired pressure is applied to at least a portion of the article while simultaneously heating at least a portion of the article to a desired temperature. The desired pressure and the desired temperature are maintained on at least a portion of the article for a desired time period. This method reduces a polymer-rich skin layer on the surface of the conductive polymer material and helps to randomize the orientation of the conductive fibers on the surface.
Insulated wire and electric or electronic equipment
An insulated wire having a conductor, and a multilayer insulating layer composed of two or more layers coating the conductor, wherein the innermost insulating layer of the multilayer insulating layer is an insulating layer formed of a crystalline thermoplastic resin having a storage elastic modulus of 10 MPa or more at 300° C. and outer insulating layer(s) other than the innermost insulating layer include(s) an insulating layer formed of a crystalline thermoplastic resin having a melting point of 260° C. or higher and a storage elastic modulus of 1,000 MPa or more at 25° C., and adjacent insulating layers have a relationship such that the storage elastic modulus at 25° C. of the thermoplastic resin of the outer insulating layer is equal to or smaller than the inner insulating layer; and electric/electronic equipment formed using the insulated wire as a winding and/or lead wire of a transformer that is incorporated into the electric/electronic equipment.
Cables and methods of making cables
A cable that include a hose having a conductor located thereabout. A first strength member layer is located about the conductor. A second strength member layer is located about the first strength member layer. A first jacket is located about the second strength member layer. The first jacket is fiber-reinforced. A second jacket is located about the first jacket. The second jacket is a contrasting color to the first jacket.
RESIN COATED SUPERCONDUCTING WIRE, SUPERCONDUCTING COIL, AND SHIELD COIL
A resin coated superconducting wire includes a matrix resin including a synthetic resin material, and a superconducting wire in the matrix resin. In a transverse cross section of the resin coated superconducting wire, a cross section area of the matrix resin is equal to or larger than the cross section area of the superconducting wire.
POLYAMIC ACID RESIN IN REACH-APPROVED SOLVENT SYSTEM FOR WIRE COATING APPLICATIONS
The present invention discloses a polyamic acid resin composition in a REACH-approved solvent system for use in wire coating applications. The polyamic acid resin composition comprises a molecular weight greater than 8,000 grams per mole, more preferably greater than 20,000 grams per mole. The REACH-approved solvent system comprising a primary REACHapproved solvent with one or more optional secondary REACH-approved co-solvents. The secondary REACH-approved co-solvent can be reactive or non-reactive with dianhydride. The present invention also discloses the elimination of solvents in polyamic acid resin to produce a REACH-approved polyamic acid resin powder.
INSULATING WIRE WITH HIGH THERMAL RESISTANCE AND RESISTANT TO PARTIAL DISCHARGES AND WIRE DRAWING PROCESS
A manufacturing of wires with optimized insulation properties, providing an insulating wire and the wire drawing process for producing it. The wire enamel has three layers: base layer (2), middle layer (3) and top layer (4), wherein these layers wrap around the conducting wire (1) in this order. The wire drawing process is carried out by a) Primary drawing; b) Final drawing and c) Enameling process carried out in line, wherein the enameling is conducted preferably with a specific number of dies for each layer. The process and composition conditions of the wire allowed to provide a triple layer wire that presents high resistance to partial discharges, high thermal class and high resistance to abrasion, thus, increasing the service lifetime of the wire in demanding motor applications when high thermal, high mechanical and high electrical resistance are required.
Magnet wire with corona resistant polyamideimide insulation
Magnet wire with corona resistant enamel insulation may include a conductor, and at least one layer of polymeric enamel insulation may be formed around the conductor. The polymeric enamel insulation may include a filler dispersed in a base polyamideimide material. The filler may include between 20 percent and 80 percent by weight of silica dioxide and between 20 and 80 percent by weight of titanium dioxide. Additionally, the polymeric enamel insulation may have a thermal index of at least 230° C. and a thermal index that is at least twice that of the base polymeric material.