The present invention generally relates to deformable polymer composites, and more particularly to, deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact. According to embodiments, a deformable elastomeric conductive material includes: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically or thermally conductive. The conductive filler material comprises a plurality of substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain.

The present invention provides a method for forming a polymer by using a mixture containing a polymerization initiator which is an adduct of a boron compound and a first unsaturated hydrocarbon compound, and a second unsaturated hydrocarbon compound, generating a radical by oxidization of the polymerization initiator and adding the radical to the second unsaturated hydrocarbon compound, thereby forming the polymer. According to the present invention, excellent controllability of alkylboranes for radical polymerization can be maintained and the structure of a polymerization initiation terminal can be freely selected and controlled. Thus, a terminal-modified polymer having functionality imparted to the terminal group can be prepared. In addition, a polymerization initiator having a plurality of polymerization starting points can be prepared, and polymers with special structures including multibranched polymers, grafted-type (comb-type) polymers and brush-shaped polymers can be prepared.

A composition can include polystyrene, modified-polystyrene, or a mixture thereof. The polystyrene, modified-polystyrene, or mixture thereof can include carbon nanotubes. The composition can also include a polyolefin. The composition can include at most 1.90% by weight of carbon nanotubes, based on a total weight of the composition. The composition can be prepared by providing a masterbatch including at least 5% by weight of carbon nanotubes based on a total weight of the masterbatch, and a polyolefin and/or styrenic copolymer. The masterbatch can be blended with polystyrene, modified-polystyrene, or a mixture thereof, and with a polyolefin, in amounts such that a conductive composition is obtained. An article can be made of the conductive composition.

An insulated wire having an electrical wire structure capable of reducing an outer diameter while an insulation property and a flame-retardant property are highly kept is provided. In the insulated wire including: a conductor; and a coating layer arranged on an outer periphery of the conductor, the coating layer includes: a semiconductive layer having a volume resistivity defined by JIS C2151 that is equal to or smaller than 1.0×10.sup.15 (Ωcm); an insulating layer arranged on an outer periphery of the semiconductive layer, the insulating layer having a volume resistivity defined by JIS C2151 that is larger than 5.0×10.sup.15 (Ωcm); and a flame-retardant semiconductive layer arranged on an outer periphery of the insulating layer, the flame-retardant semiconductive layer having a volume resistivity defined by JIS C2151 that is equal to or smaller than 1.5×10.sup.15 (Ωcm) and having an oxygen index defined by JIS K7201-2 that is larger than 40.

A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25° C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 Ω/sq. or less.

A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A varnish having low viscosity and a cured product thereof having a high degree of cross-linking, exhibiting excellent low dielectric properties and mechanical properties at high temperature, and a low coefficient of linear thermal expansion are provided. A varnish comprising an olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer satisfying specific conditions, one or more selected from the following (a) to (c), and (d) a solvent: (a) a curing agent; (b) one or a plurality of resins selected from a hydrocarbon-based elastomer, a polyphenylene ether-based resin, an olefin-aromatic vinyl compound-aromatic polyene copolymer, and an aromatic polyene-based resin; and (c) a polar monomer; and a cured product of the varnish.

Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10, at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.

Provided is a dielectric material (1, 2, 3, 4) to solve the problems of low production efficiency and high production cost of the existing dielectric material. The dielectric material (1, 2, 3, 4) is a tube structure. The tube wall of the tube structure is formed from a foam material foamed. The dielectric material further includes metal wires (11, 21, 31, 41). The metal wires (11, 21, 31, 41) are disposed in the longitudinal direction of the tube structure, and are evenly distributed in the tube wall of the tube structure without being in contact with each other. The dielectric material (1, 2, 3, 4) with such a structure has the advantages of simple structure, accurate control of the dielectric constant, light weight per unit volume, easy and efficient production, and stable technical indicators. Further provided is a dielectric material production method.