A method comprising at least (a) a step of preparing a silane master batch by melt-kneading, to 100 parts by mass of a base resin (R.sub.B) containing a non-aromatic organic oil and ethylene rubber, an organic peroxide of from 0.01 to 0.6 parts by mass, an inorganic filler of from 10 to 400 parts by mass, and a silane coupling agent of from 1 to 15.0 parts by mass, at a temperature equal to or higher than the decomposition temperature of the organic peroxide; a heat-resistant silane crosslinked resin molded body and a heat-resistant silane crosslinkable resin composition prepared by the method, and a silane master batch and a heat-resistant product.

The present invention provides an insulating paste for supporting an electrode layer which is suitable for a process of applying a conductive paste, exposing the conductive paste through a photomask, and developing the conductive paste to form a pattern, does not generate residues of silver fine particles and the like after the development, has good adhesion to an electrode layer, and can be used without problems of visibility at a touch position of a touch panel. The present invention is an insulating paste for supporting an electrode layer containing a carboxyl group-containing resin, a polyfunctional monomer, and a photopolymerization initiator. In this insulating paste, a content of the photopolymerization initiator is 3.5% by mass to 20% by mass, a content of the carboxyl group-containing resin is 20% by mass to 35% by mass, and the carboxyl group-containing resin has a weight average molecular weight of 20,000 to 120,000.

An electrical cable includes a plurality of conductors forming a conductor core, one or more insulation layers at least partially surrounding at least one of the plurality of conductors, an outer jacket surrounding the conductor core and a film applied to the exterior surface of the outer jacket. The film includes high visibility particles. Methods of forming electrical cables are also described herein.

Provided are insulation coated carbon fiber and a method of producing insulation coated carbon fiber having excellent electrical insulation while having high thermal conductivity. The insulation coated carbon fiber includes carbon fiber that is at least partially coated by an electrically insulative coating. The electrically insulative coating is a polymer formed from one type or two or more types of a polymerizable compound having a double bond, at least one of which is a polymerizable compound including at least two polymerizable functional groups.

This application generally relates to deformable elastomeric conductors and differential signaling transmission techniques. According to one embodiment, a deformable elastomeric conductor is configured to transmit electrical signals. It comprises: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically conductive. The conductive filler material may include substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain. Thus, over a transmission distance of an electrical signal through the conductor, the transmission does not suffer greater than about 3 dB of signal attenuation when subjected to the deformation.

A a crosslinkable polymer composition which provides a crosslinked product capable of both heat resistance and re-formability, a crosslinked polymer material capable of both heat resistance and re-formability, and an insulated wire and a wiring harness including the crosslinked polymer material. The crosslinkable polymer composition includes: ingredient A from which metal ion is released by heat; and ingredient B including an organic polymer having a side chain, including an electron-withdrawing substituent group capable of forming an ionic bond with the metal ion, and when B is crosslinked via the metal ion to form a crosslinked product, the product has a flow starting temperature of 190 C. or higher and 300 C. or lower. The crosslinked polymer material includes the crosslinked product of the crosslinkable polymer composition. The insulated wire includes a wire conductor, and an insulation coating including the crosslinked polymer material, and the wiring harness including the insulated wire.

A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in chemical resistance, desmear resistance, and insulation reliability. The resin composition of the present invention contains a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A transparent conductive film 1 includes a transparent substrate 2; a first optical adjustment layer 4 disposed on one side in the thickness direction of the transparent substrate 2 and made of a resin layer; an inorganic substance layer 5 disposed on one side in the thickness direction of the first optical adjustment layer 4 so as to make contact with the first optical adjustment layer 4; and a transparent conductive layer 6 disposed on one side in the thickness direction of the inorganic substance layer 5. The inorganic substance layer 5 has a thickness of 10 nm or less, and the surface of the one side in the thickness direction of the transparent conductive layer 6 has a surface roughness of 1.40 nm or less.

An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.