Disclosed is a biaxially oriented film for electrical insulation having even better withstand voltage characteristics than before together with excellent film-forming properties. The biaxially oriented film for electrical insulation of the invention is a film that includes a substrate layer containing a crystalline thermoplastic resin as a main component. The substrate layer contains a phenolic stabilizer in an amount of 0.001 wt % or more and 3 wt % or less based on the weight of the substrate layer. The phenolic stabilizer is an alkylenebisamide-type hindered phenol.

It is an object of the present invention to provide an excellent thermosetting resin that achieves both higher heat resistance and higher toughness and mechanical strength for improving cracking resistance and lower viscosity which are conventionally in a trade-off relationship. It is also an object of the present invention to provide an electronicelectrical device using a cured product of the thermosetting resin as an insulating material or a structural material. The present invention includes a plurality of means for achieving the above objects, and one of the means is a thermosetting resin composition comprising: a three-dimensional copolymer obtained by copolymerizing a maleimide derivative and a styrene derivative with use of an alkyl borane or a boron compound as a polymerization initiator; and a thermosetting resin composition.

A coaxial cable includes a center conductor, and an insulation formed surrounding the center conductor. The insulation includes an insulating tape that includes a mesh layer including a plurality of threads woven and a reinforcement layer attached to the mesh layer. The insulating tape is wound, with an overlap, around the center conductor such that the mesh layer is arranged as an outer peripheral surface.

A plastic-cladding filament structure includes a combined arrangement of a thermoplastic elastomer and at least one conductive filament. The thermoplastic elastomer includes a rigid chain segment and a flexible chain segment. The at least one conductive filament is enclosed and housed in the thermoplastic elastomer so that the conductive filament may be attachable, through heating, melting, and bonding of the thermoplastic elastomer, in which through the property that the thermoplastic elastomer is solid in room temperature and gets melted to become liquid when heated to a predetermined temperature and gets solidified and bonded after being cooled, the thermoplastic elastomer that encloses and houses the conductive filament is allowed to attached to a fabric article or a base layer through solidification and bonding resulting from cooling, thereby improving utilization thereof.

A non-halogen insulating wire with excellent flame resistance as well as high mechanical characteristics (wear resistance) and electrical insulation characteristics is provided. A non-halogen two-layer insulating wire includes: a conductor; and an insulating layer having an insulating inner layer which covers an outer circumference of the conductor and an insulating outer layer which covers an outer circumference of the insulating inner layer The insulating inner layer is made of a first non-halogen resin composition which contains metal hydroxide and a base polymer (A) including polyolefin, and has a thickness of 20% to 58% of an entire thickness of the insulating layer. The insulating outer layer is made of a second non-halogen resin composition which contains metal hydroxide and a base polymer (B) including polyester resin and/or polyester elastomer resin.

An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.

A transparent conductive film 1 includes, in this order, a transparent substrate 2, a first optical adjustment layer 4, an inorganic layer 5, and a transparent conductive layer 6. The first optical adjustment layer 4 has refraction nC lower than refraction nA of the transparent substrate 2, and thickness TC of 10 nm or more and 35 nm or less. The inorganic layer 5 has refraction nD that is lower than the absolute value |nC1.13| of a value obtained by multiplying the refraction nC of the first optical adjustment layer 4 by 1.13.

Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

There is provided a power cable including a conductor extending along a centre axis; an insulation system including at least a first semiconducting layer surrounding the conductor, and an insulation layer surrounding the first semiconducting layer; wherein the insulation layer includes a) 40-94 wt % LDPE; and b) 6-60 wt % PS and/or styrene block copolymer, wherein the weight percentages are based on the insulation layer as a whole.

A power cable including: a conductor extending along a center axis; an insulation system including at least a first semiconducting layer provided around the conductor, and an insulation layer provided around the first semiconducting layer; wherein the insulation layer includes: a) 60 to 90 wt % polypropylene; b) 5 to 20 wt % styrene block copolymer; c) 1 to 6 wt % dielectric fluid; and d) 0 to 15 wt % polyethylene.