A glass-metal feedthrough includes: an external conductor including steel, having a coefficient of expansion α.sub.external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including steel and having a coefficient of expansion α.sub.internal. The external conductor and the internal conductor are configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture. A glass material surrounds the internal conductor within the opening and has a coefficient of expansion α.sub.glass. The coefficient of expansion α.sub.external of the external conductor and the coefficient of expansion α.sub.internal of the internal conductor both are greater than the coefficient of expansion α.sub.glass of the glass material.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

A glass-metal feedthrough includes: an external conductor having a coefficient of expansion α.sub.external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion α.sub.internal, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion α.sub.glass, the coefficient of expansion of the internal conductor α.sub.internal and the coefficient of expansion of the external conductor α.sub.external are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20° C. to a glass transformation temperature of the glass material.

A glass-metal feedthrough consists of an external conductor, a glass material and an internal conductor. The internal conductor has a coefficient of expansion α.sub.internal, the glass material has a coefficient of expansion α.sub.glass, and the external conductor has a coefficient of expansion α.sub.external. The coefficient of expansion of the internal conductor α.sub.internal is greater than the coefficient of expansion of the glass material α.sub.glass and the coefficient of expansion of the external conductor α.sub.external is at least 2 ppm/K, such as at least 4 ppm/K, greater than the coefficient of expansion of the glass material α.sub.glass in the temperature range of 20° C. to the glass transformation temperature.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

The disclosure relates to a glass-metal feedthrough, composed of an outer conductor or a basic body, a glass material or glass-ceramic material, and an inner conductor. The inner conductor is preferably a metal pin and the inner conductor is sealed in the outer conductor, in particular basic body, in the glass or glass-ceramic material. The metal pin comprises a material with high conductivity and/or low contact resistance, as well as a sleeve element that surrounds the metal pin at least partially.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

A join is provided that includes a first joining partner, a second joining partner having a surface, an electrically insulating component connecting the first joining partner in the second joining partner so that the first joining partner is electrically insulated from the second joining partner and so that the first joining partner extends from the surface. The electrically insulating component has a structure between the first and second joining partners that elongates from the surface along the first joining partner. The electrically insulating component and/or the structure is an at least partially crystallized glass.

Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.