A feed-through for high external pressure applications and methods of producing are provided. The feed-through includes a base body, a through-hole extending through the base body, and a functional element. The functional element is arranged inside the through-hole. The functional element is connected to the base body in fluid-tight manner with a pressure compensator and an insulating material that at least partially surrounds the functional element and establishes the fluid-tight connection. The pressure compensator increases pressure resistance of the fluid-tight connection of the functional element to the base body against pressure.

One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

A glass-metal feedthrough consists of an external conductor, a glass material and an internal conductor. The internal conductor has a coefficient of expansion .sub.internal, the glass material has a coefficient of expansion .sub.glass, and the external conductor has a coefficient of expansion .sub.external. The coefficient of expansion of the internal conductor .sub.internal is greater than the coefficient of expansion of the glass material .sub.glass and the coefficient of expansion of the external conductor .sub.external is at least 2 ppm/K, such as at least 4 ppm/K, greater than the coefficient of expansion of the glass material .sub.glass in the temperature range of 20 C. to the glass transformation temperature.

The present invention relates to a feedthrough (200) adapted for use within a passage (300). The feedthrough (300) has a body (202) having a first interface region (204) and a second interface region (206). The first interface region (204) comprises a platform region (214). At least one electrical conductor (212) extends through the body (202) and out of the body (202) to both the first interface region (204) and the second interface region (206). A printed circuit board (216) is attached to the platform region (214). At least one pin hole (234) defined by the printed circuit board (216) is configured to accept the at least one electrical conductor (212).

A structural assembly of an aircraft has a fastener extending into first and second structural members. A washer is disposed between the fastener and one of the structural members to electrically insulate the fastener and the structural members. The washer has a core of reinforcement fibers supported in a thermoplastic matrix material. Electrically-insulating outer layers of glass fibers overlay the core.

A join is provided that has an electrically insulating component and two joining partners secured to one another and electrically insulated from one another by the electrically insulating component. The electrically insulating component has a surface that extends between the two joining partners. The surface defines a structure selected from a group consisting of an elevation, a depression, and any combinations thereof. The structure elongates a direct path along the surface. The structure completely surrounds at least one of the two joining partners. The electrically insulating component and/or the structure includes a glass that is at least partially crystallized.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20 C. to more than 450 C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (PtNi) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and PtNi-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20? C. to more than 450? C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.