A varistor array can include a monolithic body including a plurality of dielectric layers. A first varistor can be formed in the monolithic body. The first varistor can include a first external terminal on a first end of the monolithic body, a first plurality of electrodes connected with the first external terminal, a second external terminal on a second end of the monolithic body, and a second plurality of electrodes connected with the second external terminal. The second plurality of electrodes can be interleaved with the first plurality of electrodes and can overlap the first plurality of electrodes at an overlapping area that is insensitive to a relative misalignment between the first plurality of electrodes and the second plurality of electrodes when the misalignment is less than a threshold. A second varistor can be formed in the monolithic body that is distinct from the first varistor.

A varistor array can include a monolithic body including a plurality of dielectric layers. A first varistor can be formed in the monolithic body. The first varistor can include a first external terminal on a first end of the monolithic body, a first plurality of electrodes connected with the first external terminal, a second external terminal on a second end of the monolithic body, and a second plurality of electrodes connected with the second external terminal. The second plurality of electrodes can be interleaved with the first plurality of electrodes and can overlap the first plurality of electrodes at an overlapping area that is insensitive to a relative misalignment between the first plurality of electrodes and the second plurality of electrodes when the misalignment is less than a threshold. A second varistor can be formed in the monolithic body that is distinct from the first varistor.

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.

Integrated device having GDT and MOV functionalities. In some embodiments, an electrical device can include a first layer and a second layer joined with an interface, with each having an outer surface and an inner surface, such that the inner surfaces of the first and second layers define a sealed chamber therebetween. The electrical device can further include an outer electrode implemented on the outer surface of each of the first and second layers, and an inner electrode implemented on the inner surface of each of the first and second layers. The first layer can include a metal oxide material such that the first outer electrode, the first layer, and the first inner electrode provide a metal oxide varistor (MOV) functionality, and the first inner electrode, the second inner electrode, and the sealed chamber provide a gas discharge tube (GDT) functionality.

Integrated device having GDT and MOV functionalities. In some embodiments, an electrical device can include a first layer and a second layer joined with an interface, with each having an outer surface and an inner surface, such that the inner surfaces of the first and second layers define a sealed chamber therebetween. The electrical device can further include an outer electrode implemented on the outer surface of each of the first and second layers, and an inner electrode implemented on the inner surface of each of the first and second layers. The first layer can include a metal oxide material such that the first outer electrode, the first layer, and the first inner electrode provide a metal oxide varistor (MOV) functionality, and the first inner electrode, the second inner electrode, and the sealed chamber provide a gas discharge tube (GDT) functionality.

A voltage nonlinear resistor ceramic comprises: a Zn oxide; a Co oxide; an R (specific rare earth) oxide; a Cr oxide; an M1 (Ca, Sr) oxide; an M2 (Al, Ga, In) oxide; and strontium titanate. When content of the Zn oxide is assumed to be 100 mole portion in terms of Zn, content of the Co oxide is 0.30 to 10 mole portion in terms of Co, content of the R oxide is 0.10 to 10 mole portion in terms of R, content of the Cr oxide is 0.01 to 2 mole portion in terms of Cr, content of the M1 oxide is 0.10 to 5 mole portion in terms of M1, content of the M2 oxide is 0.0005 to 5 mole portion in terms of M2, and content of the strontium titanate is 0.10 to 5 mole portion in terms of SrTiO.sub.3.

The present invention relates to a product and fabrication method for a varistor comprising a solid phase of zinc oxide particles substantially uniformly dispersed within a resin media. The varistor of the present invention is synthesized by mixing a substantially homogenous mixture of solid zinc oxide particles and a resin media, and heating the mixture under conditions to melt the resin and suspend the solid zinc oxide particles therein.

The present invention relates to a product and fabrication method for a varistor comprising a solid phase of zinc oxide particles substantially uniformly dispersed within a resin media. The varistor of the present invention is synthesized by mixing a substantially homogenous mixture of solid zinc oxide particles and a resin media, and heating the mixture under conditions to melt the resin and suspend the solid zinc oxide particles therein.

A voltage-nonlinear resistor element 10 includes a voltage-nonlinear resistor (referred simply as resistor) 20 and a pair of electrodes 14 and 16 between which the resistor 20 is interposed. The resistor 20 has a multilayer structure including a first layer 21 composed primarily of zinc oxide, a second layer 22 composed primarily of zinc oxide, and a third layer 23 composed primarily of a metal oxide other than zinc oxide. The second layer 22 is adjacent to the first layer 21 and has a smaller thickness and a higher volume resistivity than the first layer 21. The third layer 23 is adjacent to the second layer 22.