An inductor structure is provided. The inductor structure includes a first dielectric layer formed over a substrate and a first metal layer formed in the first dielectric layer. The inductor structure includes a magnetic layer formed over the first dielectric layer, and the magnetic layer has a main portion and a tapered portion extending from the main portion.

A circuit board (01), including at least two electrically conductive layers (02) arranged one above the other and at least one dielectric layer (03), which is arranged between adjacent electrically conductive layers (02), is provided. The circuit board (01) is characterized in particular in that the plate has at least two magnetically conductive layers (05), wherein each magnetically conductive layer (05) is arranged at least indirectly adjacent to an electrically conductive layer (02), and that the circuit board also has vertical recesses for accommodating magnetic vias (08) for connecting the magnetically conductive layers (05) in a specific manner. A method for producing such a circuit board (01) is provided.

Embodiments provide a magnetic shield for wireless power chargers and a method of manufacturing the same. The method includes forming flake powder having flake-type particles, forming an oxide film by performing oxygen heat treatment on the surface of the flake powder, performing insulation treatment on the surface of the flake powder provided with the oxide film formed thereon, and producing a sendust block by mixing and melting the insulation-treated flake powder and insulative resin powder. Therefore, a magnetic shield having high insulation characteristics and magnetic permeability may be provided.

A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.

A coil component includes a coil portion, a core portion in which the coil portion is buried, and first and second outer electrodes connected respectively to one end and the other end of the coil portion at one or different end surfaces of the core portion. The core portion includes a metal magnetic substanceresin composite and a heat dissipative resin composite having a higher thermal conductivity than the metal magnetic substanceresin composite. The heat dissipative resin composite is arranged around an outer periphery of the coil portion to connect the outer periphery and the end surface of the core portion in at least parts thereof. The metal magnetic substanceresin composite is arranged in a core region and upper and lower regions with respect to the coil portion, and in a connecting region in at least one corner of the core portion.

Ice nucleation and supercooling are controlled by the presence of magnetite particles. Magnetite decreases supercooling and promotes ice nucleation. Therefore, freezing of liquid solutions occurs at higher temperature compared to supercooled solutions. Applying a magnetic field allows control of supercooling and ice nucleation.

A magnetoresistive element includes a storage layer as a ferromagnetic layer which has magnetic anisotropy perpendicular to film planes, and in which a magnetization direction is variable, a reference layer as a ferromagnetic layer which has magnetic anisotropy perpendicular to film planes, and in which a magnetization direction is invariable, a tunnel barrier layer as a nonmagnetic layer formed between the storage layer and the reference layer, and a first underlayer formed on a side of the storage layer, which is opposite to a side facing the tunnel barrier layer, and containing amorphous W.

An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 m, the wire pitch of the spiral wires is equal to or smaller than 10 m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 m.

The present invention relates to a magnetic nanoparticle comprising: a) a core containing a ferromagnetic material; b) an outer coating containing a mixture of a lipophilic compound and a hydrophilic compound. The outer coating of the above particle makes the nanoparticle stable in water and, simultaneously, capable of adsorbing/emulsifying large amounts of hydrophobic/lipophilic compounds. The present invention further relates to a process for the preparation of the above- mentioned particles as well as their use in the removal of hydrocarbons from solid or liquid environments and metal ions from contaminated water (wastewater).