A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

Composite electronic including coil, capacitor and intermediate parts, wherein coil part includes coil-conductor and magnetic-layer, capacitor part includes internal electrodes and dielectric-layer, which contains SrOTiO2 or ZnOTiO2 based oxide, intermediate part between coil and capacitor parts, intermediate part includes intermediate material layer, which contains ZnO, TiO2 and boron, ZnO contained in intermediate material layer 50-85 parts by mole and TiO2 contained the intermediate material layer 15-50 parts by mole when total content of ZnO and TiO2 in intermediate material layer is 100 parts by mole, content boron in intermediate material layer is 0.1-5.0 parts by weight of B2O3 when total of ZnO and TiO2 in intermediate material layer set to 100 parts by weight, part of ZnO and TiO2 intermediate material layer constitute ZnOTiO2 compound, which in intermediate material layer is 50 wt % or more when total weight of ZnO and TiO2 in intermediate material layer is set to 100 wt %.

Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 10.sup.10, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10.sup.6.

A composite permanent magnet comprises a first phase including a magnetically hard material and a second phase including a magnetic material. Each of the materials has an anisotropy value selected such that a ratio of the values falls within a predefined range and a resulting grain size of the magnetic material is greater than a predefined threshold defined by the predefined range.

There is provided a method for producing a magnetic refrigeration module. The method comprises: a step (1) of preparing a mixture powder A containing an La(Fe,Si).sub.13-based alloy powder, an M powder, and optionally an organic binder, the La(Fe,Si).sub.13-based alloy powder having a main phase with an NaZn.sub.13-type crystal structure, and the M powder containing a metal and/or an alloy and having a melting point of 1090 C. or lower; a step (2) of subjecting the mixture powder A to a heat treatment in a reducing atmosphere at a temperature close to the melting point of the M powder to obtain a sintered body B; and a step (3) of subjecting the sintered body B to a hydrogenation treatment in a hydrogen-containing atmosphere.

One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.

An integrated inductor can be tunable via a control current which alters the magnetic flux density in a permeable magnetic material. The resulting inductor can be adjusted in-circuit, and may be suitable for applications such as dc-dc converters, RF circuits, or filters requiring operation at high frequencies and across wide bandwidths.

An inductor structure is provided. The inductor structure includes a first dielectric layer formed over a substrate and a first metal layer formed in the first dielectric layer. The inductor structure includes a magnetic layer formed over the first dielectric layer, and the magnetic layer has a main portion and a tapered portion extending from the main portion.

The present invention provides a magnetic multilayer pigment flake and a magnetic coating composition that are relatively safe for human health and the environment. The pigment flake includes one or more magnetic layers of a magnetic alloy and one or more dielectric layers of a dielectric material. The magnetic alloy is an iron-chromium alloy or an iron-chromium-aluminum alloy, having a substantially nickel-free composition. The coating composition includes a plurality of the pigment flakes disposed in a binder medium.

A method for producing a nanoheterostructured permanent magnet includes a first step of preparing a raw material solution by dissolving, in a solvent, (1) a block copolymer comprising polymer block components that are immiscible but linked to each other, (2) a first inorganic precursor which is one of a hard magnetic material precursor and a soft magnetic material precursor, and (3) a second inorganic precursor which is the other of the hard magnetic material precursor and the soft magnetic material precursor, and a second step including a phase-separation treatment for forming a nanophase-separated, a conversion treatment for converting the hard magnetic material precursor and the soft magnetic material precursor to a hard magnetic material and a soft magnetic material, respectively, and a removal treatment for removing the block copolymer from the nanophase-separated structure.