The application relates to a method for preparing magnetite, comprising steps of:

a) reaction at a temperature of 100 to 500 C. of a material containing wstite with water, in order to obtain a solid comprising magnetite, and then
b) recovery of the magnetite in the form of particles wherein more than 25% by weight are of nanometric size.

The application relates to a method for preparing magnetite, comprising steps of:

a) reaction at a temperature of 100 to 500 C. of a material containing wstite with water, in order to obtain a solid comprising magnetite, and then
b) recovery of the magnetite in the form of particles wherein more than 25% by weight are of nanometric size.

Techniques for fabricating a semiconductor package comprising inductor features and a magnetic film are described. For one technique, fabricating a package includes: forming inductor features comprising a pad and a conductive line on a first build-up layer; forming a raised pad structure on the first build-up layer by fabricating a pillar structure on the pad, wherein a size of the pillar structure is approximately equal or equal to a corresponding size of the pad such that the pillar structure and the pad are aligned or minimally misaligned relative to each other; encapsulating the inductor features and the raised pad structure in a magnetic film; planarizing the magnetic film until top surfaces of the raised pad structure and magnetic film are co-planar; depositing an additional layer on the top surfaces; and forming a via on the raised pad structure by removing portions of the additional layer above the raised pad structure.

Techniques for fabricating a semiconductor package comprising inductor features and a magnetic film are described. For one technique, fabricating a package includes: forming inductor features comprising a pad and a conductive line on a first build-up layer; forming a raised pad structure on the first build-up layer by fabricating a pillar structure on the pad, wherein a size of the pillar structure is approximately equal or equal to a corresponding size of the pad such that the pillar structure and the pad are aligned or minimally misaligned relative to each other; encapsulating the inductor features and the raised pad structure in a magnetic film; planarizing the magnetic film until top surfaces of the raised pad structure and magnetic film are co-planar; depositing an additional layer on the top surfaces; and forming a via on the raised pad structure by removing portions of the additional layer above the raised pad structure.

A wire coil component includes a shaped article, a wire wound around the shaped article, and terminal electrodes to which the ends of the wire are connected. The shaped article is formed from a magnetic resin containing a binder resin and a magnetic metal powder and has a thermal expansion coefficient of about 12 ppm/K or more and about 16 ppm/K or less (i.e., from about 12 ppm/K to about 16 ppm/K) from 55 C. to 150 C.

A soft magnetic ribbon for a magnetic core segmented into small pieces includes: an inductance priority region having a first average crack interval; and an eddy current suppression priority region having a second average crack interval, in which the first and second average crack intervals are different from each other.

A soft magnetic ribbon for a magnetic core segmented into small pieces includes: an inductance priority region having a first average crack interval; and an eddy current suppression priority region having a second average crack interval, in which the first and second average crack intervals are different from each other.

A wireless power receiving apparatus which wirelessly charges power according to one embodiment of the present invention includes a substrate, a soft magnetic layer which is laminated on the substrate and is formed with a plurality of patterns including at least 3 lines radiated from predetermined points, and a coil which is laminated on the soft magnetic layer and receives electromagnetic energy radiated from a wireless power transmitting apparatus.

A wireless power receiving apparatus which wirelessly charges power according to one embodiment of the present invention includes a substrate, a soft magnetic layer which is laminated on the substrate and is formed with a plurality of patterns including at least 3 lines radiated from predetermined points, and a coil which is laminated on the soft magnetic layer and receives electromagnetic energy radiated from a wireless power transmitting apparatus.

A coil component according to one aspect is provided with a core containing a plurality of soft magnetic metal particles, a winding wire wound on the core, and a sheathing body provided on the core so as to cover at least part of the winding wire and having a relative magnetic permeability smaller than that of the core.