Magnetic core inductors implemented on integrated circuits and methods for fabricating such magnetic core inductors are disclosed. An exemplary magnetic core inductor includes a bottom magnetic plate that includes a center portion and first, second, third, and fourth extension portions extending from the center portion. The exemplary magnetic core inductor includes an interlayer dielectric layer disposed over the bottom magnetic plate, and within the interlayer dielectric layer, first, second, third, and fourth via trenches extending above a respective one of the first, second, third, and fourth extension portions, and a fifth via trench extending above the center portion. The magnetic core inductor further includes a stacked-ring inductor coil including a plurality of inductor rings surrounding the fifth via trench and a top magnetic plate including a center portion and first, second, third, and fourth extension portions extending from the center portion.

The disclosure provides a structure and method for an inductor with windings having different widths. A structure may include an inductor including a plurality of windings about a magnetic core. Each winding has a first segment within a first wiring layer coupled to a second segment within a second wiring layer. The plurality of windings includes a first winding having a first width along a same direction as a length of the magnetic core and a second winding having a second width along the same direction as the length of the magnetic core. The second width is larger than the first width.

The disclosure provides a structure and method for an inductor with windings having different widths. A structure may include an inductor including a plurality of windings about a magnetic core. Each winding has a first segment within a first wiring layer coupled to a second segment within a second wiring layer. The plurality of windings includes a first winding having a first width along a same direction as a length of the magnetic core and a second winding having a second width along the same direction as the length of the magnetic core. The second width is larger than the first width.

A magnetic device having a first coil and a second coil, wherein the first coil is wound in a first direction when viewed from the first terminal part of the first coil, and the second coil is wound in a second direction when viewed from the third terminal part of the second coil, wherein the first direction and the second direction are opposite to each other for canceling magnetic fluxes generated by the first coil and the second coil.

A soft magnetic powder includes soft magnetic particles each having a nucleus that contains a soft magnetic metal and an insulating film on the surface of the nucleus. The insulating film contains Si and a hydrocarbon group having a C8 or longer linear-chain moiety, and the ratio by weight of Si to C in the insulating film is 7.6 or more and 42.8 or less (i.e., from 7.6 to 42.8).

A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.

A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.

A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

In the coil component, external stress applied when the upper coil structure, the lower coil structure, and the magnetic sheet are stacked is dispersed by the undulation of both main surfaces of the magnetic sheet. By dispersing the stress in this manner, a situation in which defects such as cracks occur in the coil structure is effectively suppressed.